TWI698702B - 相移光罩基底及使用其之相移光罩之製造方法、與顯示裝置之製造方法 - Google Patents
相移光罩基底及使用其之相移光罩之製造方法、與顯示裝置之製造方法 Download PDFInfo
- Publication number
- TWI698702B TWI698702B TW106140657A TW106140657A TWI698702B TW I698702 B TWI698702 B TW I698702B TW 106140657 A TW106140657 A TW 106140657A TW 106140657 A TW106140657 A TW 106140657A TW I698702 B TWI698702 B TW I698702B
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- Prior art keywords
- phase shift
- layer
- film
- chromium
- shift mask
- Prior art date
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- 230000010363 phase shift Effects 0.000 title claims abstract description 448
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000010410 layer Substances 0.000 claims abstract description 330
- 239000011651 chromium Substances 0.000 claims abstract description 203
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 146
- 239000000758 substrate Substances 0.000 claims abstract description 144
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 139
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 67
- 239000002346 layers by function Substances 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 60
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 51
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000001301 oxygen Substances 0.000 claims abstract description 50
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims description 26
- 238000002834 transmittance Methods 0.000 claims description 24
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 17
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 17
- 238000002310 reflectometry Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 9
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 claims description 8
- SJKRCWUQJZIWQB-UHFFFAOYSA-N azane;chromium Chemical compound N.[Cr] SJKRCWUQJZIWQB-UHFFFAOYSA-N 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 12
- 239000010408 film Substances 0.000 description 345
- 229910052751 metal Inorganic materials 0.000 description 95
- 239000002184 metal Substances 0.000 description 95
- 230000009467 reduction Effects 0.000 description 86
- 239000007789 gas Substances 0.000 description 80
- 239000000203 mixture Substances 0.000 description 71
- 238000004544 sputter deposition Methods 0.000 description 49
- 230000000052 comparative effect Effects 0.000 description 19
- 230000003287 optical effect Effects 0.000 description 12
- 238000000985 reflectance spectrum Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 11
- 230000008033 biological extinction Effects 0.000 description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 10
- 239000011737 fluorine Substances 0.000 description 10
- 229910052731 fluorine Inorganic materials 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005477 sputtering target Methods 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 7
- 239000004215 Carbon black (E152) Substances 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 229910052743 krypton Inorganic materials 0.000 description 4
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052754 neon Inorganic materials 0.000 description 4
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 4
- 229910052724 xenon Inorganic materials 0.000 description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 4
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- -1 and further Chemical compound 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000001273 butane Substances 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002438 flame photometric detection Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/56—Organic absorbers, e.g. of photo-resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016252703A JP6812236B2 (ja) | 2016-12-27 | 2016-12-27 | 位相シフトマスクブランク及びこれを用いた位相シフトマスクの製造方法、並びに表示装置の製造方法 |
| JP2016-252703 | 2016-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201826010A TW201826010A (zh) | 2018-07-16 |
| TWI698702B true TWI698702B (zh) | 2020-07-11 |
Family
ID=62701037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106140657A TWI698702B (zh) | 2016-12-27 | 2017-11-23 | 相移光罩基底及使用其之相移光罩之製造方法、與顯示裝置之製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6812236B2 (enExample) |
| KR (1) | KR102271751B1 (enExample) |
| CN (1) | CN108241251B (enExample) |
| TW (1) | TWI698702B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220350237A1 (en) * | 2021-04-30 | 2022-11-03 | Skc Solmics Co., Ltd. | Photomask blank and photomask using the same |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7115281B2 (ja) * | 2018-12-12 | 2022-08-09 | 信越化学工業株式会社 | フォトマスクブランク、及びフォトマスクの製造方法 |
| JP7044095B2 (ja) * | 2019-05-31 | 2022-03-30 | 信越化学工業株式会社 | フォトマスクブランク、フォトマスクの製造方法及びフォトマスク |
| JP7303077B2 (ja) * | 2019-09-10 | 2023-07-04 | アルバック成膜株式会社 | マスクブランクスの製造方法及びフォトマスクの製造方法、マスクブランクス及びフォトマスク |
| KR102598440B1 (ko) * | 2019-12-20 | 2023-11-07 | 주식회사 에스앤에스텍 | 플랫 패널 디스플레이용 위상반전 블랭크 마스크 및 포토 마스크 |
| CN112259557B (zh) * | 2020-10-15 | 2022-12-06 | Tcl华星光电技术有限公司 | 显示面板及其制备方法 |
| KR102475672B1 (ko) * | 2021-11-03 | 2022-12-07 | 에스케이씨솔믹스 주식회사 | 블랭크 마스크 및 이를 이용한 포토마스크 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200602803A (en) * | 2004-03-31 | 2006-01-16 | Shinetsu Chemical Co | Halftone phase shift mask blank, halftone phase shift mask, and pattern transfer method |
| TW201118503A (en) * | 2009-11-27 | 2011-06-01 | S&S Tech Co Ltd | Blankmask, photomask, and method for manufacturing the same |
| CN102534502A (zh) * | 2010-12-06 | 2012-07-04 | 信越化学工业株式会社 | 溅射膜形成用硅靶和形成含硅薄膜的方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3262302B2 (ja) * | 1993-04-09 | 2002-03-04 | 大日本印刷株式会社 | 位相シフトフォトマスク、位相シフトフォトマスク用ブランクス及びそれらの製造方法 |
| KR100295385B1 (ko) * | 1993-04-09 | 2001-09-17 | 기타지마 요시토시 | 하프톤위상쉬프트포토마스크,하프톤위상쉬프트포토마스크용블랭크스및이들의제조방법 |
| US5604060A (en) * | 1993-08-31 | 1997-02-18 | Dai Nippon Printing Co., Ltd. | Halftone phase shift photomask comprising a single layer of halftone light blocking and phase shifting |
| US5415953A (en) * | 1994-02-14 | 1995-05-16 | E. I. Du Pont De Nemours And Company | Photomask blanks comprising transmissive embedded phase shifter |
| JP2983020B1 (ja) * | 1998-12-18 | 1999-11-29 | ホーヤ株式会社 | ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク |
| KR100725214B1 (ko) * | 1999-12-15 | 2007-06-07 | 다이니폰 인사츠 가부시키가이샤 | 하프톤 위상 시프트 포토 마스크용 블랭크, 및 하프톤위상 시프트 포토 마스크 |
| JPWO2009123166A1 (ja) * | 2008-03-31 | 2011-07-28 | Hoya株式会社 | フォトマスクブランクおよびその製造方法 |
| JP2010008532A (ja) * | 2008-06-25 | 2010-01-14 | Toppan Printing Co Ltd | ハーフトーンフォトマスク及びそれを用いて製造したカラーフィルタ基板 |
| KR101282040B1 (ko) * | 2012-07-26 | 2013-07-04 | 주식회사 에스앤에스텍 | 플랫 패널 디스플레이용 위상반전 블랭크 마스크 및 포토 마스크 |
| KR101760337B1 (ko) * | 2013-04-17 | 2017-07-21 | 알박 세이마쿠 가부시키가이샤 | 위상 시프트 마스크의 제조 방법 및 위상 시프트 마스크 |
| JP6266322B2 (ja) * | 2013-11-22 | 2018-01-24 | Hoya株式会社 | 表示装置製造用の位相シフトマスクブランク、表示装置製造用の位相シフトマスク及びその製造方法、並びに表示装置の製造方法 |
| JP6229466B2 (ja) * | 2013-12-06 | 2017-11-15 | 信越化学工業株式会社 | フォトマスクブランク |
| JP6722421B2 (ja) * | 2014-04-04 | 2020-07-15 | 大日本印刷株式会社 | 位相シフトマスクおよびその製造方法 |
| JP6661262B2 (ja) * | 2014-05-29 | 2020-03-11 | Hoya株式会社 | 位相シフトマスクブランク及びその製造方法、並びに位相シフトマスクの製造方法 |
| JP6594742B2 (ja) * | 2014-11-20 | 2019-10-23 | Hoya株式会社 | フォトマスクブランク及びそれを用いたフォトマスクの製造方法、並びに表示装置の製造方法 |
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2016
- 2016-12-27 JP JP2016252703A patent/JP6812236B2/ja active Active
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2017
- 2017-11-23 TW TW106140657A patent/TWI698702B/zh active
- 2017-12-01 KR KR1020170164146A patent/KR102271751B1/ko active Active
- 2017-12-08 CN CN201711295074.2A patent/CN108241251B/zh active Active
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| TW200602803A (en) * | 2004-03-31 | 2006-01-16 | Shinetsu Chemical Co | Halftone phase shift mask blank, halftone phase shift mask, and pattern transfer method |
| TW201137510A (en) * | 2004-03-31 | 2011-11-01 | Shinetsu Chemical Co | Halftone phase shift mask blank, halftone phase shift mask, and pattern transfer method |
| TW201137511A (en) * | 2004-03-31 | 2011-11-01 | Shinetsu Chemical Co | Halftone phase shift mask blank, halftone phase shift mask, and pattern transfer method |
| TW201118503A (en) * | 2009-11-27 | 2011-06-01 | S&S Tech Co Ltd | Blankmask, photomask, and method for manufacturing the same |
| CN102534502A (zh) * | 2010-12-06 | 2012-07-04 | 信越化学工业株式会社 | 溅射膜形成用硅靶和形成含硅薄膜的方法 |
| CN102534502B (zh) | 2010-12-06 | 2015-04-01 | 信越化学工业株式会社 | 溅射膜形成用硅靶和形成含硅薄膜的方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220350237A1 (en) * | 2021-04-30 | 2022-11-03 | Skc Solmics Co., Ltd. | Photomask blank and photomask using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108241251B (zh) | 2023-02-28 |
| JP6812236B2 (ja) | 2021-01-13 |
| TW201826010A (zh) | 2018-07-16 |
| JP2018106023A (ja) | 2018-07-05 |
| CN108241251A (zh) | 2018-07-03 |
| KR102271751B1 (ko) | 2021-06-30 |
| KR20180076296A (ko) | 2018-07-05 |
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