TWI697521B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

Info

Publication number
TWI697521B
TWI697521B TW104134684A TW104134684A TWI697521B TW I697521 B TWI697521 B TW I697521B TW 104134684 A TW104134684 A TW 104134684A TW 104134684 A TW104134684 A TW 104134684A TW I697521 B TWI697521 B TW I697521B
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
epoxy resin
mass
skeleton
Prior art date
Application number
TW104134684A
Other languages
English (en)
Chinese (zh)
Other versions
TW201631017A (zh
Inventor
中村茂雄
江戶幸則
巽志朗
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014215506A external-priority patent/JP6428147B2/ja
Priority claimed from JP2014217910A external-priority patent/JP6428153B2/ja
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201631017A publication Critical patent/TW201631017A/zh
Application granted granted Critical
Publication of TWI697521B publication Critical patent/TWI697521B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/105—Esters; Ether-esters of monocarboxylic acids with phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
TW104134684A 2014-10-22 2015-10-22 樹脂組成物 TWI697521B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-215506 2014-10-22
JP2014215506A JP6428147B2 (ja) 2014-10-22 2014-10-22 樹脂組成物
JP2014-217910 2014-10-27
JP2014217910A JP6428153B2 (ja) 2014-10-27 2014-10-27 樹脂組成物

Publications (2)

Publication Number Publication Date
TW201631017A TW201631017A (zh) 2016-09-01
TWI697521B true TWI697521B (zh) 2020-07-01

Family

ID=55821713

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104134684A TWI697521B (zh) 2014-10-22 2015-10-22 樹脂組成物

Country Status (3)

Country Link
KR (2) KR102411958B1 (ko)
CN (1) CN105542127B (ko)
TW (1) TWI697521B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7247471B2 (ja) * 2017-05-10 2023-03-29 味の素株式会社 樹脂組成物
JP6859916B2 (ja) * 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
WO2020175037A1 (ja) * 2019-02-28 2020-09-03 日本ゼオン株式会社 樹脂組成物、電子部品、及び、樹脂膜の製造方法
JP7211175B2 (ja) * 2019-03-14 2023-01-24 味の素株式会社 樹脂組成物
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201412805A (zh) * 2012-06-07 2014-04-01 Nippon Kayaku Kk 環氧樹脂、環氧樹脂組成物及硬化物
CN103897143A (zh) * 2012-12-28 2014-07-02 明和化成株式会社 环氧树脂、环氧树脂的制造方法及其使用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH496021A (de) * 1966-03-10 1970-09-15 Ciba Geigy Verfahren zur Herstellung von neuen Polyglycidyläthern
JP3476027B2 (ja) * 1994-04-28 2003-12-10 日本化薬株式会社 エポキシ樹脂の製造方法
JP2006056969A (ja) * 2004-08-19 2006-03-02 Nippon Steel Chem Co Ltd エポキシ樹脂組成物およびその硬化物
JP5249903B2 (ja) 2009-10-22 2013-07-31 味の素株式会社 樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201412805A (zh) * 2012-06-07 2014-04-01 Nippon Kayaku Kk 環氧樹脂、環氧樹脂組成物及硬化物
CN103897143A (zh) * 2012-12-28 2014-07-02 明和化成株式会社 环氧树脂、环氧树脂的制造方法及其使用

Also Published As

Publication number Publication date
KR102411958B1 (ko) 2022-06-22
CN105542127B (zh) 2020-04-10
KR20160047415A (ko) 2016-05-02
CN105542127A (zh) 2016-05-04
TW201631017A (zh) 2016-09-01
KR20220091448A (ko) 2022-06-30

Similar Documents

Publication Publication Date Title
JP6801736B2 (ja) 樹脂組成物、接着フィルム、硬化物、多層プリント配線板及び半導体装置
TWI701289B (zh) 樹脂組成物
JP6992333B2 (ja) 樹脂組成物
JP6728760B2 (ja) 支持体付き樹脂シート
JP6428147B2 (ja) 樹脂組成物
TWI717464B (zh) 附支撐體之樹脂薄片
JP6428153B2 (ja) 樹脂組成物
JP2023052814A (ja) 樹脂組成物
JP7435695B2 (ja) 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
TW201418357A (zh) 樹脂組成物
TWI697521B (zh) 樹脂組成物
JP6545924B2 (ja) 粗化硬化体、積層体、プリント配線板及び半導体装置
JP7310852B2 (ja) 樹脂組成物
JP2017008204A (ja) 樹脂組成物
JP6969099B2 (ja) 樹脂シートの製造方法
JP6672954B2 (ja) 樹脂シート
JP6459279B2 (ja) 樹脂シート
JP7156433B2 (ja) 樹脂組成物
JP6534986B2 (ja) 樹脂組成物
TWI620613B (zh) Manufacturing method of component mounting substrate, thermosetting resin composition, prepreg, multilayer printed wiring board, and component mounting substrate
JP6848950B2 (ja) 樹脂組成物
JP2021120466A (ja) 樹脂シート、プリント配線板及び半導体装置
TWI786106B (zh) 樹脂組成物層
TWI855998B (zh) 樹脂組成物