TWI694162B - 濺鍍靶材、靶材製造方法 - Google Patents

濺鍍靶材、靶材製造方法 Download PDF

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Publication number
TWI694162B
TWI694162B TW105130847A TW105130847A TWI694162B TW I694162 B TWI694162 B TW I694162B TW 105130847 A TW105130847 A TW 105130847A TW 105130847 A TW105130847 A TW 105130847A TW I694162 B TWI694162 B TW I694162B
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TW
Taiwan
Prior art keywords
atomic
film
substrate
copper
sputtering target
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TW105130847A
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English (en)
Chinese (zh)
Other versions
TW201726932A (zh
Inventor
仲台保夫
新田純一
高澤悟
白井雅紀
Original Assignee
日商愛發科股份有限公司
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Application filed by 日商愛發科股份有限公司 filed Critical 日商愛發科股份有限公司
Publication of TW201726932A publication Critical patent/TW201726932A/zh
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Publication of TWI694162B publication Critical patent/TWI694162B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW105130847A 2015-09-25 2016-09-23 濺鍍靶材、靶材製造方法 TWI694162B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-188506 2015-09-25
JP2015188506 2015-09-25

Publications (2)

Publication Number Publication Date
TW201726932A TW201726932A (zh) 2017-08-01
TWI694162B true TWI694162B (zh) 2020-05-21

Family

ID=58386763

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130847A TWI694162B (zh) 2015-09-25 2016-09-23 濺鍍靶材、靶材製造方法

Country Status (5)

Country Link
JP (1) JP6442603B2 (ja)
KR (1) KR20170083611A (ja)
CN (1) CN107109635B (ja)
TW (1) TWI694162B (ja)
WO (1) WO2017051820A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104685977A (zh) * 2013-05-13 2015-06-03 株式会社爱发科 装载装置、其制造方法、用于该制造方法的溅射靶材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102246311A (zh) * 2009-01-16 2011-11-16 株式会社神户制钢所 Cu合金膜以及显示设备
CN103502505B (zh) * 2011-08-29 2015-09-30 吉坤日矿日石金属株式会社 Cu-Ga合金溅射靶及其制造方法
TWI537400B (zh) * 2011-12-06 2016-06-11 神戶製鋼所股份有限公司 觸控面板感測器用銅合金配線膜及其之製造方法、以及觸控面板感測器、以及濺鍍靶
JP6135275B2 (ja) * 2013-04-22 2017-05-31 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲット
JP5757318B2 (ja) * 2013-11-06 2015-07-29 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲットおよび積層配線膜

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104685977A (zh) * 2013-05-13 2015-06-03 株式会社爱发科 装载装置、其制造方法、用于该制造方法的溅射靶材

Also Published As

Publication number Publication date
KR20170083611A (ko) 2017-07-18
JP6442603B2 (ja) 2018-12-19
TW201726932A (zh) 2017-08-01
WO2017051820A1 (ja) 2017-03-30
CN107109635B (zh) 2019-04-16
CN107109635A (zh) 2017-08-29
JPWO2017051820A1 (ja) 2017-09-21

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