TWI689352B - 噴灑蝕刻裝置 - Google Patents

噴灑蝕刻裝置 Download PDF

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Publication number
TWI689352B
TWI689352B TW105116872A TW105116872A TWI689352B TW I689352 B TWI689352 B TW I689352B TW 105116872 A TW105116872 A TW 105116872A TW 105116872 A TW105116872 A TW 105116872A TW I689352 B TWI689352 B TW I689352B
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TW
Taiwan
Prior art keywords
unit
etching
spray
spray piping
piping unit
Prior art date
Application number
TW105116872A
Other languages
English (en)
Chinese (zh)
Other versions
TW201703864A (zh
Inventor
竹內一馬
水谷竜也
林田哲夫
Original Assignee
日商Ｎｓｃ股份有限公司
日商京機械股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商Ｎｓｃ股份有限公司, 日商京機械股份有限公司 filed Critical 日商Ｎｓｃ股份有限公司
Publication of TW201703864A publication Critical patent/TW201703864A/zh
Application granted granted Critical
Publication of TWI689352B publication Critical patent/TWI689352B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Surface Treatment Of Glass (AREA)
  • ing And Chemical Polishing (AREA)
TW105116872A 2015-06-02 2016-05-30 噴灑蝕刻裝置 TWI689352B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015112530A JP6013557B1 (ja) 2015-06-02 2015-06-02 スプレイエッチング装置
JP2015-112530 2015-06-02

Publications (2)

Publication Number Publication Date
TW201703864A TW201703864A (zh) 2017-02-01
TWI689352B true TWI689352B (zh) 2020-04-01

Family

ID=57145175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105116872A TWI689352B (zh) 2015-06-02 2016-05-30 噴灑蝕刻裝置

Country Status (4)

Country Link
JP (1) JP6013557B1 (ja)
CN (1) CN107710389B (ja)
TW (1) TWI689352B (ja)
WO (1) WO2016194647A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635910B (zh) * 2017-04-26 2018-09-21 均豪精密工業股份有限公司 平台式噴灑裝置
CN108787672A (zh) * 2018-05-28 2018-11-13 武汉华星光电技术有限公司 基板清洗装置、显影机及基板清洗方法
JP6661200B2 (ja) * 2018-06-29 2020-03-11 株式会社Ｎｓｃ エッチング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002148818A (ja) * 2000-11-15 2002-05-22 Fuji Photo Film Co Ltd 薬液処理装置及び方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004023468A1 (ja) * 2002-09-06 2004-03-18 Mitsubishi Chemical Corporation 光学的情報記録媒体
JP5377037B2 (ja) * 2009-04-07 2013-12-25 川崎重工業株式会社 薄膜太陽電池パネルの高圧液噴射洗浄装置
JP2012174741A (ja) * 2011-02-17 2012-09-10 Aqua Science Kk 複連ノズル及び当該複連ノズルを備える基板処理装置
JP5518133B2 (ja) * 2012-06-14 2014-06-11 株式会社Ｎｓｃ 化学研磨装置
CN203754810U (zh) * 2014-04-11 2014-08-06 孟建华 一种新型的蚀刻机

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002148818A (ja) * 2000-11-15 2002-05-22 Fuji Photo Film Co Ltd 薬液処理装置及び方法

Also Published As

Publication number Publication date
WO2016194647A1 (ja) 2016-12-08
CN107710389B (zh) 2021-10-26
JP2016225547A (ja) 2016-12-28
CN107710389A (zh) 2018-02-16
JP6013557B1 (ja) 2016-10-25
TW201703864A (zh) 2017-02-01

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