JP6661200B2 - エッチング装置 - Google Patents
エッチング装置 Download PDFInfo
- Publication number
- JP6661200B2 JP6661200B2 JP2018123807A JP2018123807A JP6661200B2 JP 6661200 B2 JP6661200 B2 JP 6661200B2 JP 2018123807 A JP2018123807 A JP 2018123807A JP 2018123807 A JP2018123807 A JP 2018123807A JP 6661200 B2 JP6661200 B2 JP 6661200B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- substrate
- glass substrate
- chamber
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005530 etching Methods 0.000 title claims description 99
- 239000000758 substrate Substances 0.000 claims description 66
- 239000007921 spray Substances 0.000 claims description 29
- 238000012545 processing Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 238000012546 transfer Methods 0.000 claims description 9
- 229920000306 polymethylpentene Polymers 0.000 claims description 5
- 239000011116 polymethylpentene Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 41
- 239000000243 solution Substances 0.000 description 20
- 239000007788 liquid Substances 0.000 description 13
- 238000005406 washing Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000010802 sludge Substances 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
- Surface Treatment Of Glass (AREA)
Description
12‐搬入部
14-前水洗チャンバ
161‐第1のエッチングチャンバ
18-後水洗チャンバ
20‐搬出部
24‐ガラス基板
30-搬送ローラ
32‐スプレイユニット
34-送液配管
36-噴射ノズル
38-排出口
40-天井部
42‐透明部材
44-枠体
46-保護フィルム
Claims (3)
- 所定方向に搬送されている被処理基板に対してエッチング液を噴射するように構成されたエッチング装置であって、
前記被処理基板を所定の搬送方向に向かって搬送するように構成された搬送路と、
前記搬送路上の前記被処理基板に対してエッチング液を噴射するスプレイユニットと、
前記搬送路および前記スプレイユニットを少なくとも内部に収容するように構成された処理チャンバと、
を備え、
前記処理チャンバが、断面視円弧状でかつ透明性を備えた天井部であって前記搬送路の基板搬送面よりも上側のみを覆うように設けられた天井部を有することを特徴とするエッチング装置。 - 前記天井部は、断面視円弧状に形成された透明樹脂と、
前記透明樹脂の外壁側において格子状に取り付けられた枠体部と、
前記透明樹脂材の内壁に貼り付けられたポリメチルペンテンフィルムと、
を有することを特徴とする請求項1に記載のエッチング装置。 - 前記スプレイユニットが、前記被処理基板の搬送方向と直交する方向に沿ってスライドすることを特徴とする請求項1または2に記載のエッチング装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018123807A JP6661200B2 (ja) | 2018-06-29 | 2018-06-29 | エッチング装置 |
PCT/JP2019/025660 WO2020004569A1 (ja) | 2018-06-29 | 2019-06-27 | エッチング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018123807A JP6661200B2 (ja) | 2018-06-29 | 2018-06-29 | エッチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020001974A JP2020001974A (ja) | 2020-01-09 |
JP6661200B2 true JP6661200B2 (ja) | 2020-03-11 |
Family
ID=68986657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018123807A Active JP6661200B2 (ja) | 2018-06-29 | 2018-06-29 | エッチング装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6661200B2 (ja) |
WO (1) | WO2020004569A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3820591A1 (de) * | 1988-06-16 | 1989-12-21 | Texas Instruments Deutschland | Vorrichtung zum nassaetzen von duennen filmen |
JPH06108270A (ja) * | 1992-09-30 | 1994-04-19 | Mitsui High Tec Inc | 表面処理装置 |
JP6013557B1 (ja) * | 2015-06-02 | 2016-10-25 | 株式会社Nsc | スプレイエッチング装置 |
JP6631844B2 (ja) * | 2016-09-30 | 2020-01-15 | 株式会社Nsc | 防汚性透明積層体 |
-
2018
- 2018-06-29 JP JP2018123807A patent/JP6661200B2/ja active Active
-
2019
- 2019-06-27 WO PCT/JP2019/025660 patent/WO2020004569A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2020001974A (ja) | 2020-01-09 |
WO2020004569A1 (ja) | 2020-01-02 |
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