JP6013557B1 - スプレイエッチング装置 - Google Patents
スプレイエッチング装置 Download PDFInfo
- Publication number
- JP6013557B1 JP6013557B1 JP2015112530A JP2015112530A JP6013557B1 JP 6013557 B1 JP6013557 B1 JP 6013557B1 JP 2015112530 A JP2015112530 A JP 2015112530A JP 2015112530 A JP2015112530 A JP 2015112530A JP 6013557 B1 JP6013557 B1 JP 6013557B1
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- unit
- spray
- etching
- spray piping
- piping unit
- Prior art date
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- 239000007921 spray Substances 0.000 title claims abstract description 122
- 238000005530 etching Methods 0.000 title claims abstract description 114
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000011521 glass Substances 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 17
- 238000012545 processing Methods 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 description 16
- 230000007246 mechanism Effects 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000010802 sludge Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Surface Treatment Of Glass (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
12−導入部
14−前処理チャンバ
16−エッチングチャンバ
18−洗浄チャンバ
20−排出部
30−搬送ローラ
40−送液ユニット
50−駆動ユニット
162−上側スプレイ配管ユニット
164−下側スプレイ配管ユニット
166−上側ホースユニット
167−下側ホースユニット
Claims (2)
- ガラス基板等の被処理基板に対してスプレイ方式のエッチング処理を行うように構成されたスプレイエッチング装置であって、
所定の搬送方向に順次搬送される被処理基板に対してエッチング液をスプレイするように構成された移動可能なスプレイ配管ユニットを少なくとも含むエッチングチャンバと、
前記スプレイ配管ユニットに対してエッチング液を供給するように構成される送液ユニットと、
少なくとも前記スプレイ配管ユニットに対して前記エッチングチャンバの外側から駆動力を伝達するように構成された駆動ユニットと、
を含み、
前記送液ユニット、前記エッチングチャンバ、および前記駆動ユニットが被処理基板の搬送方向に直交する幅方向に配列され、かつ、
前記スプレイ配管ユニットは、被処理基板の搬送経路の上側に配置された上側スプレイ配管ユニットと、被処理基板の搬送経路の下側に配置された下側スプレイ配管ユニットとからなっており、
前記送液ユニットの下部と前記上側スプレイ配管ユニットとが可撓性を備えたホースによって接続されるとともに、前記送液ユニットの上部と前記下側スプレイ配管ユニットとが可撓性を備えたホースによって接続されることを特徴とするスプレイエッチング装置。 - 前記スプレイ配管ユニットは、その脚部が前記幅方向に延びる直線状のガイド部材にスライド自在に支持されており、
前記駆動ユニットは、前記スプレイ配管ユニットが前記ガイド部材に沿って往復スライド移動するための力を前記スプレイ配管ユニットに加えるように構成されることを特徴とする請求項1に記載のスプレイエッチング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015112530A JP6013557B1 (ja) | 2015-06-02 | 2015-06-02 | スプレイエッチング装置 |
PCT/JP2016/064970 WO2016194647A1 (ja) | 2015-06-02 | 2016-05-20 | スプレイエッチング装置 |
CN201680038962.3A CN107710389B (zh) | 2015-06-02 | 2016-05-20 | 喷淋蚀刻装置 |
TW105116872A TWI689352B (zh) | 2015-06-02 | 2016-05-30 | 噴灑蝕刻裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015112530A JP6013557B1 (ja) | 2015-06-02 | 2015-06-02 | スプレイエッチング装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016168010A Division JP6536830B2 (ja) | 2016-08-30 | 2016-08-30 | スプレイエッチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6013557B1 true JP6013557B1 (ja) | 2016-10-25 |
JP2016225547A JP2016225547A (ja) | 2016-12-28 |
Family
ID=57145175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015112530A Active JP6013557B1 (ja) | 2015-06-02 | 2015-06-02 | スプレイエッチング装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6013557B1 (ja) |
CN (1) | CN107710389B (ja) |
TW (1) | TWI689352B (ja) |
WO (1) | WO2016194647A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI635910B (zh) * | 2017-04-26 | 2018-09-21 | 均豪精密工業股份有限公司 | 平台式噴灑裝置 |
CN108787672A (zh) * | 2018-05-28 | 2018-11-13 | 武汉华星光电技术有限公司 | 基板清洗装置、显影机及基板清洗方法 |
JP6661200B2 (ja) * | 2018-06-29 | 2020-03-11 | 株式会社Nsc | エッチング装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002148818A (ja) * | 2000-11-15 | 2002-05-22 | Fuji Photo Film Co Ltd | 薬液処理装置及び方法 |
JP2010245344A (ja) * | 2009-04-07 | 2010-10-28 | Kawasaki Plant Systems Ltd | 薄膜太陽電池パネルの高圧液噴射洗浄装置 |
JP2013256427A (ja) * | 2012-06-14 | 2013-12-26 | Nsc:Kk | 化学研磨装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004023468A1 (ja) * | 2002-09-06 | 2004-03-18 | Mitsubishi Chemical Corporation | 光学的情報記録媒体 |
JP2012174741A (ja) * | 2011-02-17 | 2012-09-10 | Aqua Science Kk | 複連ノズル及び当該複連ノズルを備える基板処理装置 |
CN203754810U (zh) * | 2014-04-11 | 2014-08-06 | 孟建华 | 一种新型的蚀刻机 |
-
2015
- 2015-06-02 JP JP2015112530A patent/JP6013557B1/ja active Active
-
2016
- 2016-05-20 WO PCT/JP2016/064970 patent/WO2016194647A1/ja active Application Filing
- 2016-05-20 CN CN201680038962.3A patent/CN107710389B/zh not_active Expired - Fee Related
- 2016-05-30 TW TW105116872A patent/TWI689352B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002148818A (ja) * | 2000-11-15 | 2002-05-22 | Fuji Photo Film Co Ltd | 薬液処理装置及び方法 |
JP2010245344A (ja) * | 2009-04-07 | 2010-10-28 | Kawasaki Plant Systems Ltd | 薄膜太陽電池パネルの高圧液噴射洗浄装置 |
JP2013256427A (ja) * | 2012-06-14 | 2013-12-26 | Nsc:Kk | 化学研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2016194647A1 (ja) | 2016-12-08 |
CN107710389B (zh) | 2021-10-26 |
JP2016225547A (ja) | 2016-12-28 |
TWI689352B (zh) | 2020-04-01 |
CN107710389A (zh) | 2018-02-16 |
TW201703864A (zh) | 2017-02-01 |
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