TWI687266B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI687266B
TWI687266B TW107131482A TW107131482A TWI687266B TW I687266 B TWI687266 B TW I687266B TW 107131482 A TW107131482 A TW 107131482A TW 107131482 A TW107131482 A TW 107131482A TW I687266 B TWI687266 B TW I687266B
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TW
Taiwan
Prior art keywords
substrate
cup
processing liquid
liquid
processing
Prior art date
Application number
TW107131482A
Other languages
English (en)
Chinese (zh)
Other versions
TW201929965A (zh
Inventor
古矢正明
山崎克弘
森秀樹
林航之介
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW201929965A publication Critical patent/TW201929965A/zh
Application granted granted Critical
Publication of TWI687266B publication Critical patent/TWI687266B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW107131482A 2017-09-26 2018-09-07 基板處理裝置及基板處理方法 TWI687266B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-185312 2017-09-26
JP2017185312A JP6983602B2 (ja) 2017-09-26 2017-09-26 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201929965A TW201929965A (zh) 2019-08-01
TWI687266B true TWI687266B (zh) 2020-03-11

Family

ID=65864708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107131482A TWI687266B (zh) 2017-09-26 2018-09-07 基板處理裝置及基板處理方法

Country Status (4)

Country Link
JP (1) JP6983602B2 (enExample)
KR (1) KR102221337B1 (enExample)
CN (1) CN109560018B (enExample)
TW (1) TWI687266B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
JP7364460B2 (ja) * 2019-12-25 2023-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI711491B (zh) * 2020-01-03 2020-12-01 弘塑科技股份有限公司 基板濕處理設備及回收環
TWI755122B (zh) * 2020-10-28 2022-02-11 辛耘企業股份有限公司 晶圓蝕刻機
TW202501589A (zh) * 2022-08-02 2025-01-01 日商東京威力科創股份有限公司 基板處理裝置、供給系統、基板處理方法及供給方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201506993A (zh) * 2013-03-18 2015-02-16 東京威力科創股份有限公司 液體處理裝置
TW201538231A (zh) * 2014-03-11 2015-10-16 斯克林集團公司 基板處理裝置及基板處理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533339Y2 (ja) 1991-06-28 1997-04-23 大日本スクリーン製造株式会社 基板の回転処理装置
JPH09115873A (ja) * 1995-10-20 1997-05-02 Mitsubishi Electric Corp 半導体の製造装置および半導体の製造方法
JP3691227B2 (ja) * 1996-10-07 2005-09-07 東京エレクトロン株式会社 液処理方法及びその装置
JP4571299B2 (ja) * 2000-11-29 2010-10-27 芝浦メカトロニクス株式会社 スピン処理装置及び飛散防止用カップ
JP2002329705A (ja) * 2001-04-26 2002-11-15 Shibaura Mechatronics Corp スピン処理装置
JP4319221B2 (ja) * 2004-03-12 2009-08-26 リアライズ・アドバンストテクノロジ株式会社 基板処理装置
CN100550291C (zh) * 2006-06-16 2009-10-14 东京毅力科创株式会社 液体处理装置及液体处理方法
US8152933B2 (en) * 2006-10-05 2012-04-10 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and drain cup cleaning method
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
JP4949338B2 (ja) * 2008-08-06 2012-06-06 東京エレクトロン株式会社 液処理装置
KR101592058B1 (ko) * 2010-06-03 2016-02-05 도쿄엘렉트론가부시키가이샤 기판 액처리 장치
JP5844681B2 (ja) * 2011-07-06 2016-01-20 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5387636B2 (ja) * 2011-08-31 2014-01-15 東京エレクトロン株式会社 液処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201506993A (zh) * 2013-03-18 2015-02-16 東京威力科創股份有限公司 液體處理裝置
TW201538231A (zh) * 2014-03-11 2015-10-16 斯克林集團公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
JP6983602B2 (ja) 2021-12-17
KR20190035549A (ko) 2019-04-03
CN109560018A (zh) 2019-04-02
KR102221337B1 (ko) 2021-03-02
JP2019062075A (ja) 2019-04-18
TW201929965A (zh) 2019-08-01
CN109560018B (zh) 2022-10-18

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