CN109560018B - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

Info

Publication number
CN109560018B
CN109560018B CN201811120882.XA CN201811120882A CN109560018B CN 109560018 B CN109560018 B CN 109560018B CN 201811120882 A CN201811120882 A CN 201811120882A CN 109560018 B CN109560018 B CN 109560018B
Authority
CN
China
Prior art keywords
substrate
liquid
cup body
cup
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811120882.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN109560018A (zh
Inventor
古矢正明
山崎克弘
森秀树
林航之介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN109560018A publication Critical patent/CN109560018A/zh
Application granted granted Critical
Publication of CN109560018B publication Critical patent/CN109560018B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201811120882.XA 2017-09-26 2018-09-26 基板处理装置和基板处理方法 Active CN109560018B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-185312 2017-09-26
JP2017185312A JP6983602B2 (ja) 2017-09-26 2017-09-26 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
CN109560018A CN109560018A (zh) 2019-04-02
CN109560018B true CN109560018B (zh) 2022-10-18

Family

ID=65864708

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811120882.XA Active CN109560018B (zh) 2017-09-26 2018-09-26 基板处理装置和基板处理方法

Country Status (4)

Country Link
JP (1) JP6983602B2 (enExample)
KR (1) KR102221337B1 (enExample)
CN (1) CN109560018B (enExample)
TW (1) TWI687266B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
JP7364460B2 (ja) * 2019-12-25 2023-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI711491B (zh) * 2020-01-03 2020-12-01 弘塑科技股份有限公司 基板濕處理設備及回收環
TWI755122B (zh) * 2020-10-28 2022-02-11 辛耘企業股份有限公司 晶圓蝕刻機
TW202501589A (zh) * 2022-08-02 2025-01-01 日商東京威力科創股份有限公司 基板處理裝置、供給系統、基板處理方法及供給方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166216A (ja) * 2000-11-29 2002-06-11 Shibaura Mechatronics Corp スピン処理装置及び飛散防止用カップ
JP2011249848A (ja) * 2011-08-31 2011-12-08 Tokyo Electron Ltd 液処理装置及び液処理方法
TW201215458A (en) * 2010-06-03 2012-04-16 Tokyo Electron Ltd Substrate liquid processing apparatus
CN104916570A (zh) * 2014-03-11 2015-09-16 斯克林集团公司 基板处理装置以及基板处理方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533339Y2 (ja) 1991-06-28 1997-04-23 大日本スクリーン製造株式会社 基板の回転処理装置
JPH09115873A (ja) * 1995-10-20 1997-05-02 Mitsubishi Electric Corp 半導体の製造装置および半導体の製造方法
JP3691227B2 (ja) * 1996-10-07 2005-09-07 東京エレクトロン株式会社 液処理方法及びその装置
JP2002329705A (ja) * 2001-04-26 2002-11-15 Shibaura Mechatronics Corp スピン処理装置
JP4319221B2 (ja) * 2004-03-12 2009-08-26 リアライズ・アドバンストテクノロジ株式会社 基板処理装置
CN100550291C (zh) * 2006-06-16 2009-10-14 东京毅力科创株式会社 液体处理装置及液体处理方法
US8152933B2 (en) * 2006-10-05 2012-04-10 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and drain cup cleaning method
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
JP4949338B2 (ja) * 2008-08-06 2012-06-06 東京エレクトロン株式会社 液処理装置
JP5844681B2 (ja) * 2011-07-06 2016-01-20 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6020271B2 (ja) * 2013-03-18 2016-11-02 東京エレクトロン株式会社 液処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166216A (ja) * 2000-11-29 2002-06-11 Shibaura Mechatronics Corp スピン処理装置及び飛散防止用カップ
TW201215458A (en) * 2010-06-03 2012-04-16 Tokyo Electron Ltd Substrate liquid processing apparatus
JP2011249848A (ja) * 2011-08-31 2011-12-08 Tokyo Electron Ltd 液処理装置及び液処理方法
CN104916570A (zh) * 2014-03-11 2015-09-16 斯克林集团公司 基板处理装置以及基板处理方法

Also Published As

Publication number Publication date
TWI687266B (zh) 2020-03-11
JP6983602B2 (ja) 2021-12-17
KR20190035549A (ko) 2019-04-03
CN109560018A (zh) 2019-04-02
KR102221337B1 (ko) 2021-03-02
JP2019062075A (ja) 2019-04-18
TW201929965A (zh) 2019-08-01

Similar Documents

Publication Publication Date Title
TWI839024B (zh) 基板處理裝置
KR100935280B1 (ko) 처리액 공급노즐 및 처리액 공급장치
TWI687266B (zh) 基板處理裝置及基板處理方法
US10096493B2 (en) Substrate treatment apparatus, and substrate treatment method
KR100812482B1 (ko) 매엽식 기판세정방법 및 매엽식 기판세정장치
TWI283020B (en) Single wafer type substrate cleaning method and apparatus
TWI547984B (zh) Liquid processing apparatus and liquid processing method
KR101983897B1 (ko) 기판 처리 장치
KR101678231B1 (ko) 액 처리 장치 및 액 처리 방법
JP2003203891A (ja) 基板処理装置
US20120218531A1 (en) Developing method and apparatus using organic-solvent containing developer
JP5031671B2 (ja) 液処理装置、液処理方法および記憶媒体
JP2002353181A (ja) 枚葉式基板洗浄方法および枚葉式基板洗浄装置
TW201246323A (en) Liquid processing apparatus and liquid processing method
KR101551995B1 (ko) 액 처리 장치
TW201246441A (en) Liquid Processing Apparatus and Liquid Processing Method
KR101377196B1 (ko) 액처리 장치
KR101927919B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR101519674B1 (ko) 웨이퍼 무전해 도금을 위한 방법 및 장치
KR20180025256A (ko) 기판 처리 방법
JP6491900B2 (ja) 基板処理装置および基板処理方法
JP2005079220A (ja) 基板処理装置
JP6416652B2 (ja) 基板処理装置
JP5143657B2 (ja) 液処理装置
KR20090132965A (ko) 매엽식 세정장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant