TWI686264B - 用於聲學監控及控制直通矽穿孔之顯露處理的設備及方法 - Google Patents

用於聲學監控及控制直通矽穿孔之顯露處理的設備及方法 Download PDF

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Publication number
TWI686264B
TWI686264B TW103115201A TW103115201A TWI686264B TW I686264 B TWI686264 B TW I686264B TW 103115201 A TW103115201 A TW 103115201A TW 103115201 A TW103115201 A TW 103115201A TW I686264 B TWI686264 B TW I686264B
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Taiwan
Prior art keywords
acoustic
substrate
silicon via
chemical mechanical
mechanical polishing
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TW103115201A
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English (en)
Chinese (zh)
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TW201503995A (zh
Inventor
周松佑
蘇布拉曼寧科米塞堤
馬哈珍尤戴
史威克柏格斯勞Ａ
巴札拉吉菲
鄧健攝
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美商應用材料股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW103115201A 2013-05-01 2014-04-28 用於聲學監控及控制直通矽穿孔之顯露處理的設備及方法 TWI686264B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/874,495 2013-05-01
US13/874,495 US20140329439A1 (en) 2013-05-01 2013-05-01 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing

Publications (2)

Publication Number Publication Date
TW201503995A TW201503995A (zh) 2015-02-01
TWI686264B true TWI686264B (zh) 2020-03-01

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TW103115201A TWI686264B (zh) 2013-05-01 2014-04-28 用於聲學監控及控制直通矽穿孔之顯露處理的設備及方法

Country Status (6)

Country Link
US (1) US20140329439A1 (https=)
JP (1) JP6397896B2 (https=)
KR (1) KR102242321B1 (https=)
CN (1) CN105164794B (https=)
TW (1) TWI686264B (https=)
WO (1) WO2014179241A1 (https=)

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JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
US11289387B2 (en) * 2020-07-31 2022-03-29 Applied Materials, Inc. Methods and apparatus for backside via reveal processing
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
JP7690297B2 (ja) 2021-02-22 2025-06-10 キオクシア株式会社 基板処理の制御方法
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
KR20240025694A (ko) * 2021-07-06 2024-02-27 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 윈도우를 포함하는 연마 패드
CN117597215A (zh) 2021-07-06 2024-02-23 应用材料公司 使用光学传感器的化学机械抛光振动测量
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Also Published As

Publication number Publication date
JP6397896B2 (ja) 2018-09-26
US20140329439A1 (en) 2014-11-06
CN105164794B (zh) 2019-01-11
CN105164794A (zh) 2015-12-16
JP2016517185A (ja) 2016-06-09
TW201503995A (zh) 2015-02-01
KR20160003247A (ko) 2016-01-08
KR102242321B1 (ko) 2021-04-21
WO2014179241A1 (en) 2014-11-06

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