KR102242321B1 - 관통 실리콘 비아 노출 처리의 음향 모니터링 및 제어를 위한 장치 및 방법 - Google Patents

관통 실리콘 비아 노출 처리의 음향 모니터링 및 제어를 위한 장치 및 방법 Download PDF

Info

Publication number
KR102242321B1
KR102242321B1 KR1020157034275A KR20157034275A KR102242321B1 KR 102242321 B1 KR102242321 B1 KR 102242321B1 KR 1020157034275 A KR1020157034275 A KR 1020157034275A KR 20157034275 A KR20157034275 A KR 20157034275A KR 102242321 B1 KR102242321 B1 KR 102242321B1
Authority
KR
South Korea
Prior art keywords
tsv
acoustic
substrate
cmp
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157034275A
Other languages
English (en)
Korean (ko)
Other versions
KR20160003247A (ko
Inventor
시옹 예우 츄
콤미세티 수브라흐마니암
우데이 마하잔
보구슬로 에이. 스웨덱
라지브 바자즈
지안쉐 탕
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20160003247A publication Critical patent/KR20160003247A/ko
Application granted granted Critical
Publication of KR102242321B1 publication Critical patent/KR102242321B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • H01L21/30625—
    • H01L21/67092—
    • H01L22/12—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020157034275A 2013-05-01 2014-04-28 관통 실리콘 비아 노출 처리의 음향 모니터링 및 제어를 위한 장치 및 방법 Active KR102242321B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/874,495 2013-05-01
US13/874,495 US20140329439A1 (en) 2013-05-01 2013-05-01 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
PCT/US2014/035756 WO2014179241A1 (en) 2013-05-01 2014-04-28 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing

Publications (2)

Publication Number Publication Date
KR20160003247A KR20160003247A (ko) 2016-01-08
KR102242321B1 true KR102242321B1 (ko) 2021-04-21

Family

ID=51841646

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157034275A Active KR102242321B1 (ko) 2013-05-01 2014-04-28 관통 실리콘 비아 노출 처리의 음향 모니터링 및 제어를 위한 장치 및 방법

Country Status (6)

Country Link
US (1) US20140329439A1 (https=)
JP (1) JP6397896B2 (https=)
KR (1) KR102242321B1 (https=)
CN (1) CN105164794B (https=)
TW (1) TWI686264B (https=)
WO (1) WO2014179241A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9403254B2 (en) * 2011-08-17 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for real-time error detection in CMP processing
US10478937B2 (en) * 2015-03-05 2019-11-19 Applied Materials, Inc. Acoustic emission monitoring and endpoint for chemical mechanical polishing
KR102333209B1 (ko) 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
KR102401388B1 (ko) * 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
JP7312103B2 (ja) * 2016-09-15 2023-07-20 アプライド マテリアルズ インコーポレイテッド 化学機械研磨スマートリング
US10695907B2 (en) * 2017-09-29 2020-06-30 Intel Corporation Methods and apparatus for monitoring robot health in manufacturing environments
US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
CN108188931A (zh) * 2017-12-22 2018-06-22 华侨大学 双面行星磨削/研磨加工中工件破碎的在线控制系统
WO2019152222A1 (en) * 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
KR102677387B1 (ko) 2018-03-13 2024-06-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 진동들의 모니터링
JP7116645B2 (ja) * 2018-09-12 2022-08-10 キオクシア株式会社 研磨装置
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
US11289387B2 (en) * 2020-07-31 2022-03-29 Applied Materials, Inc. Methods and apparatus for backside via reveal processing
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
JP7690297B2 (ja) 2021-02-22 2025-06-10 キオクシア株式会社 基板処理の制御方法
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
KR20240025694A (ko) * 2021-07-06 2024-02-27 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 윈도우를 포함하는 연마 패드
CN117597215A (zh) 2021-07-06 2024-02-23 应用材料公司 使用光学传感器的化学机械抛光振动测量
US12403561B2 (en) 2022-03-09 2025-09-02 Applied Materials, Inc. Eddy current monitoring to detect vibration in polishing
WO2023234974A1 (en) 2022-06-03 2023-12-07 Applied Materials, Inc. Determining substrate orientation with acoustic signals

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020173223A1 (en) * 2001-05-17 2002-11-21 Norm Gitis Method and apparatus for polishing control with signal peak analysis
US20050124273A1 (en) * 2000-05-19 2005-06-09 Applied Materials, Inc., A Delaware Corporation Method of forming a polishing pad for endpoint detection
US20080305717A1 (en) * 2007-06-06 2008-12-11 Novellus Systems, Inc. Platen assembly and work piece carrier head employing flexible circuit sensor

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2600001B1 (fr) * 1986-06-11 1988-09-09 Meseltron Sa Dispositif pour la commande de la vitesse d'avance d'un outil vers une piece a usiner
JP2011249833A (ja) * 1995-03-28 2011-12-08 Applied Materials Inc Ｃｍｐプロセス中のインシチュウ終点検出に用いるポリッシングパッド
JP3431115B2 (ja) * 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US6910942B1 (en) * 1997-06-05 2005-06-28 The Regents Of The University Of California Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
JPH11183447A (ja) * 1997-12-19 1999-07-09 Nippei Toyama Corp 被加工材の割れ発生予知方法及びこれを利用したウエハの加工方法並びに研削盤
JPH11254311A (ja) * 1998-03-09 1999-09-21 Super Silicon Kenkyusho:Kk 研磨時の薄板状ワーク破損防止方法
JPH11254304A (ja) * 1998-03-10 1999-09-21 Super Silicon Kenkyusho:Kk センサを組み込んだ定盤
JP2000306963A (ja) * 1999-04-22 2000-11-02 Mitsubishi Electric Corp 半導体装置及びその製造方法並びに半導体製造装置及び製造システム
JP3292243B2 (ja) * 1999-06-30 2002-06-17 日本電気株式会社 研磨終点検出装置
US6488569B1 (en) * 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US6924641B1 (en) * 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
US6424137B1 (en) * 2000-09-18 2002-07-23 Stmicroelectronics, Inc. Use of acoustic spectral analysis for monitoring/control of CMP processes
US20020090889A1 (en) * 2001-01-10 2002-07-11 Crevasse Annette M. Apparatus and method of determining an endpoint during a chemical-mechanical polishing process
TW536454B (en) * 2001-02-14 2003-06-11 Taiwan Semiconductor Mfg Apparatus and method for detecting polishing endpoint of chemical-mechanical planarization/polishing of wafer
JP2003086551A (ja) * 2001-09-07 2003-03-20 Mitsubishi Electric Corp 半導体研磨装置、半導体研磨の終点検出方法および研磨ヘッドのドレスの終点検出方法
US6646737B2 (en) * 2001-09-24 2003-11-11 Kla-Tencor Technologies Submicron dimensional calibration standards and methods of manufacture and use
US6660539B1 (en) * 2001-11-07 2003-12-09 Advanced Micro Devices, Inc. Methods for dynamically controlling etch endpoint time, and system for accomplishing same
US6586337B2 (en) * 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US6878039B2 (en) * 2002-01-28 2005-04-12 Speedfam-Ipec Corporation Polishing pad window for a chemical-mechanical polishing tool
US6808590B1 (en) * 2002-06-28 2004-10-26 Lam Research Corporation Method and apparatus of arrayed sensors for metrological control
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
US7537511B2 (en) * 2006-03-14 2009-05-26 Micron Technology, Inc. Embedded fiber acoustic sensor for CMP process endpoint
KR20090026266A (ko) * 2006-05-03 2009-03-12 에스티. 로렌스 나노테크놀로지, 인크. 폴리싱 개별 다이의 능력을 이용하여 대형 웨이퍼를 화학적기계적으로 폴리싱하기 위한 방법 및 장치
US8106651B2 (en) * 2008-04-17 2012-01-31 Novellus Systems, Inc. Methods and apparatuses for determining thickness of a conductive layer
WO2009137764A2 (en) * 2008-05-08 2009-11-12 Applied Materials, Inc. Cmp pad thickness and profile monitoring system
KR101601346B1 (ko) * 2008-12-12 2016-03-08 아사히 가라스 가부시키가이샤 연마 장치 및 연마 방법, 및 유리판의 제조 방법
DE102009015718B4 (de) * 2009-03-31 2012-03-29 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Testsystem und Verfahren zum Verringern der Schäden in Saatschichten in Metallisierungssystemen von Halbleiterbauelementen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050124273A1 (en) * 2000-05-19 2005-06-09 Applied Materials, Inc., A Delaware Corporation Method of forming a polishing pad for endpoint detection
US20020173223A1 (en) * 2001-05-17 2002-11-21 Norm Gitis Method and apparatus for polishing control with signal peak analysis
US20080305717A1 (en) * 2007-06-06 2008-12-11 Novellus Systems, Inc. Platen assembly and work piece carrier head employing flexible circuit sensor

Also Published As

Publication number Publication date
JP6397896B2 (ja) 2018-09-26
TWI686264B (zh) 2020-03-01
US20140329439A1 (en) 2014-11-06
CN105164794B (zh) 2019-01-11
CN105164794A (zh) 2015-12-16
JP2016517185A (ja) 2016-06-09
TW201503995A (zh) 2015-02-01
KR20160003247A (ko) 2016-01-08
WO2014179241A1 (en) 2014-11-06

Similar Documents

Publication Publication Date Title
KR102242321B1 (ko) 관통 실리콘 비아 노출 처리의 음향 모니터링 및 제어를 위한 장치 및 방법
JP7354131B2 (ja) 化学機械研磨中の振動のモニタリング
US5245794A (en) Audio end point detector for chemical-mechanical polishing and method therefor
JP3949941B2 (ja) 半導体装置の製造方法および研磨装置
US20160013085A1 (en) In-Situ Acoustic Monitoring of Chemical Mechanical Polishing
JPH09155642A (ja) ポリシング制御方法および装置
JP3466374B2 (ja) 研磨装置及び研磨方法
US6488569B1 (en) Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
JP2002160154A (ja) Ｃｍｐ処理のモニタ／制御に対する音響分光分析の使用
TWI849385B (zh) 用於化學機械拋光的聲學監控和感測器
TWI760478B (zh) 切削裝置
US20230010025A1 (en) Detection of planarization from acoustic signal during chemical mechanical polishing
JP7815413B2 (ja) 化学機械研磨のための音響センサの結合
US6198294B1 (en) In-situ backgrind wafer thickness monitor
JPH11221760A (ja) 被加工材の割れ発生予知方法及びこれを利用したウエハの加工方法並びに研削盤
US20240424635A1 (en) Polishing method, polishing apparatus, and non-transitory computer-readable recording medium
JP2003037090A (ja) 半導体集積回路装置の製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000