201029808 ’六、發明說明： 【發明所屬之技術領域】 本發明係關於一種加工玻璃板等時，檢測加工中之玻璃 板等中產生之破裂等異常的研磨裝置及研磨方法與玻璃板 之製造方法。 【先前技術】 玻璃板之製造步驟中，對玻璃板實施切割、倒角 (chamfering)、開孔、研磨、加熱成形、風冷強化等各種 加工。例如’於LCD(Liquid Crystal Display，液晶顯示器） 或 OLED(〇rganic Light-Emitting Diode，有機發光二極體） 專平板顯示器（FPD，Flat Panel Display)中所使用之玻璃板 中’有時因其表面之微小凹凸或波紋成為影響圖像之主要 因素’故藉由研磨裝置研磨玻璃板表面之局部或整體。 為進行上述研磨，眾所周知有包括對玻璃板進行保持並 搬送之移動研磨頭、及配置於該研磨頭之下方之複數個研 磨壓盤的研磨裝置。根據該研磨裝置，利用移動研磨頭搬 送玻璃板，並利用複數個研磨壓盤依序研磨玻璃板。 然而，於利用研磨裝置之玻璃板之研磨中，導致玻璃板 破裂之情況偶有發生。於上述情形時，若於玻璃板已破裂 之狀態下繼續進行研磨加工，則已破裂之玻璃片會損傷研 磨墊。進而，於生產步驟中依序研磨複數個玻璃板之連續 研磨時，會產生對後續玻璃板造成不良影響之不良狀況。 因此，期望及早檢測出玻璃板之破裂而迅速使研磨裝置停 止0 145132.d〇c 201029808 專利文獻1中’揭示有檢測研磨加工中之玻璃板之破裂一 的破裂檢測裝置。該玻璃破裂檢測裝置係利用麥克風3〇將 研磨加工中產生之加工音集中，並且利用濾波器自已集中 之加工音提取特定頻率（3 kHz以上）之聲波，對該所提取之 聲波之當前之聲波位準與自當前至過去特定時間内之恆定 聲波位準進行比較，藉此判定玻璃板之破裂。 [先行技術文獻] [專利文獻] [專利文獻1]曰本專利特開2〇〇6 35343號公報 【發明内容】 [發明所欲解決之問題] 然而，專利文獻1之破裂檢測裝置係利用聲音而檢測研 磨加工中之玻璃板之破裂者，故僅能利用玻璃板裂得粉碎 片Ί、下之聲g進付檢測，而破裂產生之初始階段（裂紋 等微小破裂、缺口）之聲音則無法檢測。又，容易受到周 邊聲音頻率成分之雜訊之影響。 右玻璃板裂成細片，則如上所述會對研磨墊造成損傷， 並且用以將其去除之清掃作業亦需耗費數小時。因此，於 恢復作業所需之時間内，生產步驟中之研磨作業會中斷， 因此存在運行速率下降之缺點。 再者，於破裂產生之初始階段所產生之極小聲音會被研 磨裝置周邊之脅音淹沒，故幾乎不可能進行檢測。又，即 使監視員時常監視研磨加工中之玻璃板，亦不可能由監視 員用耳朵直接聆聽而將該聲音與周圍之聲波位準加以區 145132.doc 201029808 分’從而檢測出研磨中之玻璃板之破裂。 本發明係鑒於上述情況而開發者，其目的在於提供一種 藉由檢測出研磨中之被研磨物之破裂等異常產生之初始階 段’從而縮減因研磨具之受損或清掃作業等所引起之中斷 時間，且可抑制不必要之損失時間之產生的研磨裝置及研 磨方法與玻璃板之製造方法。 [解決問題之技術手段] Φ 亦即，本發明提供一種研磨裝置，其特徵在於：其係使 研磨具與被研磨物相對擠壓地移動，並且一面向研磨具與 被研磨物之間供給研磨液，一面藉由研磨具而研磨被研磨 物者，該研磨裝置包括：AE感測器（Acoustic Emissi〇n[Technical Field] The present invention relates to a polishing apparatus, a polishing method, and a glass sheet manufacturing method for detecting abnormalities such as cracks occurring in a glass sheet or the like during processing of a glass plate or the like. . [Prior Art] In the manufacturing process of the glass sheet, various processing such as cutting, chamfering, opening, grinding, heat forming, and air-cooling strengthening is performed on the glass sheet. For example, 'in a glass plate used in an LCD (Liquid Crystal Display) or an OLED (〇rganic Light-Emitting Diode) flat panel display (Flat Panel Display) The minute irregularities or corrugations of the surface become the main factors affecting the image, so the surface or the whole of the surface of the glass plate is ground by the grinding device. In order to perform the above polishing, there is known a polishing head including a moving polishing head for holding and transporting a glass sheet, and a plurality of grinding press plates disposed under the polishing head. According to the polishing apparatus, the glass plate is conveyed by the moving polishing head, and the glass plate is sequentially polished by a plurality of polishing plates. However, in the grinding of the glass plate using the grinding device, the occurrence of cracking of the glass plate occasionally occurs. In the above case, if the polishing process is continued while the glass plate has been broken, the ruptured glass piece may damage the polishing pad. Further, when the plurality of glass sheets are sequentially ground in the production step, the subsequent polishing of the glass sheets adversely affects the subsequent glass sheets. Therefore, it is desirable to detect the rupture of the glass sheet at an early stage and quickly stop the polishing apparatus. 145132.d〇c 201029808 Patent Document 1 discloses a crack detecting device for detecting cracking of the glass sheet in the polishing process. The glass rupture detecting device concentrates the processing sound generated in the polishing process by using the microphone 3 ,, and extracts a sound wave of a specific frequency (above 3 kHz) from the concentrated processing sound by a filter, and the current sound wave of the extracted sound wave. The level is compared with a constant sonic level from the current to the past specific time to determine the rupture of the glass sheet. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. However, when the crack of the glass plate in the polishing process is detected, it is only possible to use the glass plate to crack the pulverized piece and the sound of the lower part, and the sound of the initial stage (small crack or chipping of cracks) cannot be produced. Detection. Moreover, it is susceptible to noise from peripheral frequency components. When the right glass sheet is broken into fine pieces, the polishing pad is damaged as described above, and the cleaning operation for removing it also takes several hours. Therefore, the grinding operation in the production step is interrupted during the time required for the recovery operation, so there is a disadvantage that the operation rate is lowered. Furthermore, the extremely small sound generated in the initial stage of the rupture is submerged by the cusp of the periphery of the grinding device, so that detection is almost impossible. Moreover, even if the monitor constantly monitors the glass plate in the grinding process, it is impossible for the monitor to directly listen to the ear and the sound wave level with the surrounding sound wave level is 145132.doc 201029808 minutes to detect the glass plate in the grinding. The rupture. The present invention has been made in view of the above circumstances, and an object thereof is to provide an initial stage of detecting an abnormality such as cracking of an object to be polished during polishing, thereby reducing an interruption caused by damage of a polishing tool or cleaning operation. A polishing apparatus, a polishing method, and a method of manufacturing a glass sheet which can suppress the occurrence of unnecessary loss time. [Technical means for solving the problem] Φ That is, the present invention provides a polishing apparatus characterized in that the polishing tool is moved relative to the object to be polished, and a grinding is provided between the polishing tool and the object to be polished. Liquid, one of which is ground by a grinding tool, the grinding device comprising: an AE sensor (Acoustic Emissi〇n
Sensor ’聲射感測器），其係安裝於支撐研磨具或被研磨物 之平板，異常探測部，其係基於上述測器檢測出來 自被研磨物之彈性波時的來自AE感測器之輸出信號，而 探測研磨中之異常；以及警告機構，其係當藉由上述異常 φ 探測部探測出被研磨物之異常時，發出警告。 又，本發明提供—種研磨方法，其特徵在於：其係使研 磨具與被研磨物相對擠壓地移動，並且—面向研磨具與被 研磨物之間供給研磨液，_面藉由研磨具研磨被研磨物 者》亥研磨方法包含如下步驟：於支揮研磨具或被研磨物 之平板安裝AE感測盗，異常探測部基於上述感測器檢 測出來自被研磨物之彈性波時的來自姆測器之輸出信 號，而探測研磨中之異常；以及，當藉由上述異常探測部 探測出被研磨物之異常時，警告機構發出擎告。 145132.doc 201029808 於上述研磨具為研磨墊、且上述被研磨物為玻璃板之情 形時’例如適用於LCD或OLED用之母玻璃基板之研磨。 又’於上述研磨具為整形磨石、且上述被研磨物為研磨 塾之情形時，適用於研磨墊之整形作業。 又，本發明提供一種利用上述研磨方法而進行玻璃板之 加工的玻璃板之製造方法。 本發明中，自研磨中之玻璃板或整形中之研磨墊所產生 之彈性波穿過研磨液中而時常被AE(ac〇Ustic emissi〇n，聲 射）感測器檢測出，其資訊時常輸出至異常探測部。於異 常探測部預先設定可認定玻璃板中產生裂紋等微小破裂、 缺口之臨限值、或研磨墊之合理整形效率之臨限值。當研 磨中來自AE感測器之輸出值超出上述臨限值時，亦即， 當異常探測部探測出玻璃板中產生裂紋等微小破裂、缺口 時，或者當整形中來自AE感測器之輸出值低於上述臨限 值時，警告機構發出警告。 而且，於玻璃研磨中，在發出警告之同時，控制部使研 磨裝置停纟。藉A ’可⑯測出整形效率下降等異常之產 生二以及玻璃板破裂之初始階段，故可於玻璃板裂得粉碎 之前，檢測出玻璃板之破裂而使研磨裝置停止。由此，根 據本發明，可將研㈣之受損或清㈣業等㈣起之 時間抑制為最小限度。或者，亦 J不靠人手而利用機械裝 置及電腦控制，大致自動化地實現異常探測後之處理。t 玻璃板之研磨步驟中，研料與破璃板係相對進行 之旋轉.滑動動作，一直產生較 ’、 枚大之機械性振動且連續運 145132.doc 201029808 轉。又’步驟周邊亦會產生來自馬達或電源系統之電磁波 雜訊。因此’本發明中之AE感測器可檢測出玻璃板之通 常研磨中所產生之低位準之彈性波或不可回避之雜訊成 分。於上述環境下’將恆定狀態下之彈性波檢測為破璃板 產生破裂並判斷為異常產生之情況，有恣意攪亂研磨步驟 之虞。 因此’本發明中’係基於實驗值或經驗值設定上述臨限Sensor 'sound sensor', which is mounted on a flat plate supporting the abrasive or the object to be polished, and an abnormality detecting portion based on the AE sensor when the elastic wave from the object to be polished is detected by the above detector The signal is output to detect an abnormality in the polishing; and the warning mechanism issues a warning when the abnormality of the object to be polished is detected by the abnormality φ detecting portion. Moreover, the present invention provides a polishing method which is characterized in that the polishing tool is moved relative to the object to be polished, and the polishing liquid is supplied between the polishing tool and the object to be polished, and the surface is provided by the polishing tool. The method of grinding the object to be polished includes the following steps: mounting the AE sensor on the flat plate of the abrasive or the object to be polished, and the abnormality detecting unit detects the elastic wave from the object to be polished based on the sensor. The output signal of the detector is used to detect an abnormality in the grinding; and when the abnormality detecting portion detects the abnormality of the object to be polished, the warning mechanism issues a warning. 145132.doc 201029808 When the polishing tool is a polishing pad and the object to be polished is a glass plate, it is applied, for example, to the polishing of a mother glass substrate for an LCD or an OLED. Further, when the polishing tool is an orthodontic stone and the object to be polished is a polishing crucible, it is suitable for a shaping operation of a polishing pad. Further, the present invention provides a method for producing a glass sheet which is processed by a polishing method using the above-described polishing method. In the present invention, the elastic wave generated from the polishing glass plate or the shaped polishing pad passes through the polishing liquid and is often detected by an AE (ac〇Ustic emissi〇n, sounding) sensor, and the information is often Output to the abnormality detection section. The abnormality detecting unit sets in advance a threshold value for determining a micro crack such as a crack in the glass sheet, a threshold value of the notch, or a reasonable shaping efficiency of the polishing pad. When the output value from the AE sensor exceeds the above threshold value during the grinding, that is, when the abnormality detecting portion detects a small crack or a crack such as a crack in the glass plate, or when the output from the AE sensor is in the shaping When the value is lower than the above threshold, the warning agency issues a warning. Further, in the glass polishing, the control unit stops the grinding device while issuing a warning. By A'16, an abnormality such as a decrease in shaping efficiency and an initial stage of cracking of the glass sheet are measured, so that the crack of the glass sheet can be detected and the polishing apparatus can be stopped before the glass sheet is pulverized. Thus, according to the present invention, it is possible to minimize the time from the damage of the research (4) or the time of the fourth (4) industry. Or, J does not rely on manual use of mechanical devices and computer controls to substantially automate the processing after anomaly detection. In the grinding step of the glass plate, the grinding material and the glass plate are rotated relative to each other. The sliding action always produces mechanical vibrations that are larger than that of the large one, and continuously transports 145132.doc 201029808. Electromagnetic noise from the motor or power system is also generated around the steps. Therefore, the AE sensor of the present invention can detect a low level of elastic wave or an unavoidable noise component which is generated in the usual grinding of the glass sheet. In the above environment, the elastic wave in a constant state was detected as a crack in the glass plate and it was judged that the abnormality occurred, and the polishing step was disturbed. Therefore, in the present invention, the above threshold is set based on experimental values or empirical values.
值。進而’具有根據所指定範圍内之過去實績最大值，將 該最大值與某一加法值相加而得之值作為臨限值的自動臨 限值調整功能，可選擇採用哪個臨限值。將探測出超出所 選擇之臨限值的信號成分之情形判定為「異常」。於圖3之 事例中’ W 1.000 v設為臨限值。於研磨裝置穩定且恆定 地運轉之If开；時，進行探測電路之_雜訊設計、設定信號 放大率等，使其雜訊位準成為0.1 V以下。 本發明中，於研磨中之玻璃板產生裂紋等微小破裂、缺 匱开y時將其瞬間檢測出而暫時使研磨裝置停止，該 處，有意義。先前之方式中，無法忽視研磨頭、研磨墊之 月掃作業所耗費之時間、然而，根據本發明，因玻璃板未 =，故其清掃作業所耗#之時間較短，幾十分鐘以内就 。由此’可大幅縮短生產步驟中之研磨裝置之中斷時 間。本發明中，例 大型母玻璃& 所謂微小破裂等係意指於 "之極少之部分產生少數條幾cm〜幾10 cm以 熊。 或者如貝通玻璃板之表背之較短之破裂的狀 I45132.doc 201029808 進而’本發明中，於使上述研磨墊保持於研磨壓盤上之 平板安裝有AE感測器。藉此，ae感測器可準確檢測出研 磨中產生之彈性波。又，研磨裝置中，使用水或漿料作為 研磨液’故若使AE感測器之除已絕緣之檢測面以外之金 屬部分物理性接觸或者經由水或漿料而電性接觸於保持於 研磨壓盤上之平板’則存在電性雜訊流回至Ae感測器而 無法判別微小位準之異常信號的可能性。因此，較好的是 對AE感測器安裝用以防水及絕緣之樹脂製（絕緣性）防護 罩。 又’並不將AE感測器之檢測面直接安裝於平板，就上 述防水之觀點而言，較好的是經由與厶£感測器之檢測面 相接且覆蓋其大致整體之金屬製之防護罩（c〇ver)而安裝於 平板。此時，就提高微小位準之異常產生之檢測精度之觀 點而言，較好的是設置將AE感測器之檢測面向上述金屬 製防護罩推壓之彈簧等施壓機構。 本發明中，較好的是，藉由上述異常探測部探測出玻璃 板之破裂之後’使上述玻璃板之研磨裝置停止。其流程如 圖斤示亦即，6又置玻璃板之破裂檢測裝置（s丨）；開始 玻璃板之加工（S2);當檢測出玻璃板之微少位準之破裂 時使研磨裝置停止（S3);進行研磨零件之檢查…广恢 復研磨裝置（S5)。 例如，可構成為，於藉由 裂產生之初始階段之情形時 制之控制部使研磨裝置停止 異常探測部探測出玻璃板之破 ’對整個研磨裝置進行總括控 。由此’不需要所謂由監視員 145J32.doc 201029808 監視研磨裝置之人工作業。又，於連續研磨時，由於可阻 止對其他玻璃板之影響，因此玻璃板之品質、運行速率及 良率分別提高。進而，於研磨裝置已停止時，較好的是使 玻璃板與研磨頭一同自研磨墊上升（撤回）。藉此，可自研 磨頭容易地取出破裂產生之初始階段之玻璃板。 本發明中，上述AE感測器較好的是，自滲透至上述研 磨墊之研磨液經由上述平板而檢測來自玻璃板之彈性波。 φ 作為上述研磨液，於研磨玻璃板之情形時，較好的是使用 包含氧化飾或氧化石夕之漿料，而於整形研磨塾之情形時， 較好的是使用水。 研磨墊通常係由聚胺酯製造，雖然聚胺酯自身難以傳遞 彈性波，但因聚胺酯製之研磨墊中滲透有研磨液，故ae 感測器可自該研磨液經由平板而準確地檢測出來自玻璃板 之彈性波。作為研磨液之供給機構，較好的是如下機構： 於研磨壓盤與平板上形成多個研磨液供給孔，且自該等研 • 磨液供給孔向研磨墊供給研磨液。藉此，可將水或漿料均 勻地供給至整個研磨塾。 本發明中，較好的是，AE感測器形成於平板、且安裝 於平板之自研磨壓盤向側方伸出之突出片的下表面。value. Further, it has an automatic threshold adjustment function that adds a value obtained by adding the maximum value to a certain addition value as a threshold value according to the past performance maximum value within the specified range, and which threshold value can be selected. The case where a signal component exceeding the selected threshold value is detected is judged as "abnormal". In the case of Figure 3, 'W 1.000 v is set to the threshold. When the polishing device is stably and constantly operated, If is turned on, the noise level of the detection circuit, the setting signal amplification factor, and the like are performed so that the noise level becomes 0.1 V or less. In the present invention, it is meaningful that the glass plate during polishing is slightly broken by cracks or the like, and is instantaneously detected when the y is opened, and the polishing apparatus is temporarily stopped. In the previous method, the time taken for the monthly cleaning operation of the polishing head and the polishing pad cannot be ignored. However, according to the present invention, since the glass plate is not =, the time taken for the cleaning operation is short, within a few tens of minutes. . Thus, the interruption time of the polishing apparatus in the production step can be greatly shortened. In the present invention, the example of a large mother glass & so-called micro-cracking means that a very small portion of the " produces a few pieces of a few cm to several 10 cm for a bear. Or, in the case of a short rupture of the surface of a Beton glass plate, I45132.doc 201029808 Further, in the present invention, an AE sensor is mounted on a flat plate on which the polishing pad is held on a polishing platen. Thereby, the ae sensor can accurately detect the elastic wave generated in the grinding. Further, in the polishing apparatus, water or a slurry is used as the polishing liquid. Therefore, the metal portion of the AE sensor other than the insulated detection surface is physically contacted or electrically contacted by water or slurry to be maintained in the polishing. The flat plate on the platen has the possibility that electrical noise will flow back to the Ae sensor and the abnormal signal of the minute level cannot be discriminated. Therefore, it is preferable to install a resin (insulating) shield for waterproofing and insulating the AE sensor. Moreover, the detection surface of the AE sensor is not directly mounted on the flat plate, and from the viewpoint of the above waterproofing, it is preferably made of metal which is in contact with the detecting surface of the sensor and covers substantially the entire surface thereof. A protective cover (c〇ver) is attached to the flat plate. In this case, in order to improve the detection accuracy of the abnormality of the minute level, it is preferable to provide a pressing mechanism such as a spring that presses the detection of the AE sensor toward the metal shield. In the invention, it is preferable that the polishing apparatus of the glass sheet is stopped after the abnormality detecting unit detects the rupture of the glass sheet. The process is as shown in the figure, that is, the rupture detecting device (s丨) of the glass plate is placed; the processing of the glass plate is started (S2); when the rupture of the micro-level of the glass plate is detected, the grinding device is stopped (S3) ); inspection of the grinding parts... extensive recovery grinding device (S5). For example, the control unit may cause the polishing device to stop when the crack is generated in the initial stage of the cracking, and the abnormality detecting portion detects the breakage of the glass sheet. The entire polishing device is collectively controlled. Thus, the manual operation of monitoring the grinding device by the monitor 145J32.doc 201029808 is not required. Further, in the case of continuous polishing, since the influence on other glass sheets can be prevented, the quality, operation rate, and yield of the glass sheets are improved, respectively. Further, when the polishing apparatus has stopped, it is preferred that the glass sheet be lifted (withdrawn) from the polishing pad together with the polishing head. Thereby, the glass plate at the initial stage of the crack generation can be easily taken out by the grinding head. In the present invention, it is preferable that the AE sensor detects the elastic wave from the glass sheet through the flat plate from the polishing liquid permeating the polishing pad. φ As the above-mentioned polishing liquid, in the case of polishing a glass plate, it is preferred to use a slurry containing oxidized or oxidized stone, and in the case of shaping and polishing, it is preferred to use water. The polishing pad is usually made of polyurethane. Although the polyurethane itself is difficult to transmit elastic waves, the ae sensor can accurately detect the glass plate from the polishing liquid through the flat plate. Elastic wave. As the supply means of the polishing liquid, a mechanism is provided in which a plurality of polishing liquid supply holes are formed in the polishing platen and the flat plate, and the polishing liquid is supplied from the grinding liquid supply holes to the polishing pad. Thereby, water or slurry can be uniformly supplied to the entire grinding crucible. In the present invention, it is preferable that the AE sensor is formed on the lower surface of the flat plate and is attached to the protruding piece of the flat plate which protrudes laterally from the polishing platen.
若於自研磨壓盤向侧方伸出之平板之突出片之下表面安 裝AE感測器，則可防止旋轉中之研磨頭碰撞到ae感測 器又，作為AE感測器之安裝位置，亦可於研磨壓盤之 中央部形成貫通孔，並經由該貫通孔而將AE感測器之檢 測面安裝於平板。如此，若於研磨壓盤之中央部安裝AE 145132.doc 201029808 感測器’則多數情況下玻璃板之破裂位置與ae感測器之 距離會變短，因此彈性波之檢測靈敏度提高。 女裝之AE感測器之數量可根據玻璃板之大小適當決 定。例如，較好的是，對於邊長為3000 minx3〇〇〇 mm以上 之玻璃板’安裝兩個以上之Ae感測器。 為提高檢測靈敏度，安裝複數個AE感測器時之AE感測 裔之安裝位置較好的是相對於玻璃板大致均等地配置。例 如，於安裝兩個AE感測器之情形時，較好的是以隔著玻 璃板而使AE感測器對稱之方式安裝。 本發明+，較好的是，利用濾波器將自上述AE感測器 輸出至異常探測部之頻帶設定為100〜200 kHz之範圍。 於玻璃板之研磨裝置之周邊設置有玻璃板之切割裝置、 倒角裝置、搬送裝置、2次研磨裝置等各種裝置。必需排 除因來自。該等裝置之機械性振動所引起之小於⑽池之 頻率之彈n又，必需排除因電性雜訊所引起之超出 200 kHz之頻率之彈性波。 立 本發明中，由於將自八£感測器輸出至異常探測 頻f之下限值设為1〇〇 kHz，因&，可防止因上述機 :性振動之彈性波所引起之誤檢測，X，由於將上限值設 ”、、20〇 kHz’因此可防止因上述電性雜訊之彈性波所引起 誤檢測、如此’藉由選擇成為對象之頻帶且設定特定臨 ^值可達成與周圍雜訊成分之區分。 :者’上限值越高’則AE感測器之輸出越會衰減，故 。又’亦可於AE感測器自身内設置濾、波器，但亦可 145132.doc 201029808 將來自AE感測器之輸出經由濾波器而輸出至異常探測 邛。作為濾波器，較好的是使用鑑別器。 [發明之效果] 如以上說明所示，根據本發明，因藉由从感測器檢測 出研磨中之被研磨物之破裂等異常產生之初始階段，故可 將研磨具、被研磨物之受損或掃除等所引起之中斷時間抑 制為最小限度。 φ 其結果，可提高研磨步驟中之連續運行，從而改善生產 工廠之效率。又，由於可於較早之階段檢測出微小位準之 異常產生，因此可預防研磨裝置或研磨墊之破損，從而容 易維護裝置。 【實施方式】 以下，根據圖式，就本發明之研磨裝置及研磨方法與玻 璃板之製造方法之較佳實施形態加以說明。 圖1表示實施形態之研磨裝置10之立體圖。又，圖2中， • 表示著表現研磨裝置10之主要部分構造之放大剖面圖。 該研磨裝置10係將製造成矩形狀之玻璃板G {例如，邊 長為 2000x2200 mm〜2200x2600 mm、厚度為 〇·7 mm、fpd 用途之包含無驗玻璃系材料的利用浮式法製造之研磨前之 玻璃板（例如，AN100) }研磨至液晶顯示器用玻璃板所需 之平坦度的研磨裝置。 其構成包括：研磨頭16，其將玻璃板g經由片狀之保持 構件14而保持於其下表面；以及研磨壓盤22，其將研磨墊 20經由鋁製平板18而保持於其上表面。玻璃板(?保持於包 145132.doc 201029808 含具有自我吸附作用之襯底材料等之保持構件14上，並且 藉由研磨頭16將被研磨面A向研磨墊20擠壓，藉此將被研 磨面A研磨至所需之平坦度。 研磨中，如圖2所示，通過貫通形成於研磨壓盤22與平 板18之多個研磨液供給孔24、24...，而自研磨墊2〇之下表 面側供給氧化鈽水溶液等作為研磨液之漿料。藉此，研磨 墊20成為被漿料滲透之狀態，於該狀態下研磨玻璃板 研磨液供給孔24、24…密集且均勻地形成於研磨壓盤。與 平板18。 因此，向研磨墊20均勻地供給漿料。再者，作為研磨墊 20,例如使用發泡聚胺酯型或麂皮型者，且黏附於平板 18 ° 又，於與作為被研磨物之玻璃板〇之相對關係中，研磨 墊20可為丨張，但相對於玻璃板G之尺寸，其尺寸亦較大， 故亦可將複數張分割研磨墊組合而製成丨張研磨墊2〇。 進而，於研磨壓盤22貫通形成有多個抽吸孔％、％ ， 該等抽吸孔26、26…係經由閥門而連接於未圖示之抽氣泵 (suction pump)。因此，藉由開放上述閥門而使抽氣聚^ 抽吸力傳遞至抽吸孔26、26..·’因此平_吸附保持於研 磨壓盤22之上表面。又’藉由封閉上述閥門而解除抽氣果 之抽吸力，因此於研磨塾20之狀態檢查或更換時，可將研 磨墊20與平板18—同自研磨壓盤22卸除。 如圖1所示，於研磨頭16之上部 | 丁天回疋有主軸28， 該主轴28連結有旋轉/升降裝置3〇。 、 硬轉/升降裝置30係藉 145132.doc 12 201029808 由對整個研磨裝置10進行總括控制之控制部32，而控制適 用於玻璃板G之研磨之轉速及下降動作（推壓力）。 另一方面’研磨裝置1〇包括AE(acoustic emission，聲 射）感測器34、異常探測部36及警報器（警告機構）38。作為 AE感測器3 4 ’為良好地檢測出玻璃板g之初始階段之破 裂’使用共振頻率為140〜150 kHz者。上述共振頻率較好 的是設定於應檢測之頻帶之大致中央附近。而且，該AE 感測器34安裝於平板18。又，異常探測部36係基於來自研 磨中之玻璃板G之彈性波穿過漿料而被ae感測器34檢測時 之、來自AE感測器34之輸出信號，而探測研磨中之玻璃 板G之初始階段之破裂。進而，警報器38受控制部32控 制’使得當藉由異常探測部3 6探測出玻璃板G之初始階段 之破裂時該警報器38發出警告。 然而’表示由AE感測器34檢測出之彈性波之信號，由 别置放大益40放大特定量，並且由下述鑑別器“僅提取特 定頻帶之信號，利用PLC(p〇wer Line c〇_unicati〇n，電 力線通信）等高速通信方式將該信號傳送至異常探測部 36。異常探測部36包含安裝有用以判定研磨中產生之玻璃 板G之初始破裂之演算法的CD R〇M(c〇mpact以化ReadIf the AE sensor is mounted on the lower surface of the protruding piece of the flat plate extending from the grinding platen to the side, the grinding head in the rotation is prevented from colliding with the ae sensor, and as the mounting position of the AE sensor, A through hole may be formed in a central portion of the polishing platen, and the detection surface of the AE sensor may be attached to the flat plate via the through hole. Thus, if the AE 145132.doc 201029808 sensor is installed in the center of the polishing platen, the rupture position of the glass plate and the distance of the ae sensor are shortened in many cases, so the detection sensitivity of the elastic wave is improved. The number of AE sensors for women's wear can be determined according to the size of the glass plate. For example, it is preferred to install more than two Ae sensors for a glass plate having a side length of 3000 min x 3 mm or more. In order to improve the detection sensitivity, it is preferable that the mounting position of the AE sensory person when a plurality of AE sensors are mounted is substantially equally arranged with respect to the glass plate. For example, in the case of installing two AE sensors, it is preferable to mount the AE sensor symmetrically across the glass plate. In the present invention, it is preferable that the frequency band output from the AE sensor to the abnormality detecting portion is set to a range of 100 to 200 kHz by a filter. Various devices such as a glass plate cutting device, a chamfering device, a conveying device, and a secondary polishing device are provided around the polishing device for the glass plate. It is necessary to exclude the cause. The elastic waves caused by the mechanical vibration of the devices smaller than the frequency of the (10) pool must eliminate the elastic waves exceeding the frequency of 200 kHz caused by electrical noise. In the present invention, since the lower limit of the output from the eight-sensor to the abnormal detection frequency f is set to 1 kHz, the & can prevent false detection caused by the elastic wave of the above-mentioned machine: , X, because the upper limit is set to ", 20 kHz", it is possible to prevent erroneous detection caused by the elastic wave of the electrical noise, and thus by selecting the frequency band to be targeted and setting a specific value can be achieved. Distinguish from the surrounding noise components: The higher the upper limit value, the more the output of the AE sensor will be attenuated. Therefore, it is also possible to set the filter and wave filter in the AE sensor itself. 145132.doc 201029808 The output from the AE sensor is output to the abnormality detection 经由 via the filter. As the filter, it is preferable to use the discriminator. [Effect of the Invention] As described above, according to the present invention, By detecting the initial stage of abnormality such as cracking of the object to be polished during polishing from the sensor, it is possible to minimize the interruption time caused by damage or cleaning of the polishing tool or the object to be polished. As a result, the continuity in the grinding step can be increased In order to improve the efficiency of the production plant, the abnormality of the micro-level can be detected at an early stage, so that the damage of the polishing device or the polishing pad can be prevented, and the device can be easily maintained. [Embodiment] BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a polishing apparatus 10 according to an embodiment of the present invention. Fig. 1 is a perspective view showing a polishing apparatus 10 according to an embodiment. An enlarged sectional view of the main part of the structure 10. The polishing apparatus 10 is a glass plate G which is manufactured into a rectangular shape {for example, a side length of 2000 x 2200 mm to 2200 x 2600 mm, a thickness of 〇·7 mm, and an fpd-containing glass containing no inspection glass A pre-grinding glass plate (for example, AN100) manufactured by a floating method, a polishing device for polishing to a flatness required for a glass plate for a liquid crystal display. The composition includes: a polishing head 16 that passes the glass plate g via The sheet-like holding member 14 is held on the lower surface thereof; and the platen 22 is polished, which holds the polishing pad 20 on the upper surface thereof via the aluminum flat plate 18. The glass plate (? is held on the holding member 14 containing the self-adsorbing substrate material or the like, and is pressed by the polishing head 16 to the polishing pad 20, thereby being ground The surface A is ground to a desired flatness. In the polishing, as shown in Fig. 2, the plurality of polishing liquid supply holes 24, 24, ... formed on the polishing platen 22 and the flat plate 18 are passed through the polishing pad 2 The lower surface side is supplied with a slurry of cerium oxide or the like as a slurry of the polishing liquid. Thereby, the polishing pad 20 is in a state of being infiltrated by the slurry, and in this state, the polishing glass plate polishing liquid supply holes 24, 24 are densely and uniformly formed. Grinding the platen. With the tablet 18. Therefore, the slurry is uniformly supplied to the polishing pad 20. Further, as the polishing pad 20, for example, a foamed polyurethane type or a suede type is used, and adhered to the flat plate at 18°, and in a relative relationship with the glass plate as the object to be polished, the polishing pad 20 may be a sheet. However, the size of the glass sheet G is also large, so that a plurality of divided polishing pads can be combined to form a sheet-like polishing pad 2〇. Further, a plurality of suction holes %, % are formed in the polishing platen 22, and the suction holes 26, 26 are connected to a suction pump (not shown) via a valve. Therefore, the suction pumping force is transmitted to the suction holes 26, 26, . . . by opening the above-mentioned valve, so that the flat_adsorption is held on the upper surface of the grinding platen 22. Further, since the suction force of the pumping fruit is released by closing the valve, the polishing pad 20 and the flat plate 18 can be removed from the polishing platen 22 when the polishing head 20 is inspected or replaced. As shown in Fig. 1, on the upper portion of the polishing head 16 | Ding Tian Hui has a spindle 28 to which a rotary/elevating device 3 is coupled. The hard turning/elevating device 30 is controlled by the control unit 32 that performs overall control of the entire polishing apparatus 10, and controls the rotation speed and the lowering operation (pushing pressure) suitable for the polishing of the glass sheet G. On the other hand, the polishing apparatus 1 includes an AE (acoustic emission) sensor 34, an abnormality detecting portion 36, and an alarm (warning mechanism) 38. The AE sensor 3 4 ' is a good one for detecting the crack of the initial stage of the glass sheet g. The resonance frequency is 140 to 150 kHz. Preferably, the resonance frequency is set near the approximate center of the frequency band to be detected. Moreover, the AE sensor 34 is mounted to the flat panel 18. Further, the abnormality detecting unit 36 detects the glass plate in the grinding based on the output signal from the AE sensor 34 when the elastic wave from the glass plate G during polishing passes through the slurry and is detected by the ae sensor 34. The rupture of the initial stage of G. Further, the alarm 38 is controlled by the control unit 32 so that the alarm 38 issues a warning when the abnormality of the initial stage of the glass sheet G is detected by the abnormality detecting portion 36. However, 'the signal indicating the elastic wave detected by the AE sensor 34 is amplified by a certain amount, and the discriminator "extracts only the signal of the specific frequency band, using the PLC (p〇wer Line c〇) The high-speed communication method such as _unicati〇n, power line communication transmits the signal to the abnormality detecting portion 36. The abnormality detecting portion 36 includes CD R〇M (the algorithm for determining the initial rupture of the glass sheet G generated during polishing) C〇mpact to read Read
Only Memory ’唯讀光碟記憶體）等記錄媒體。又，對 傳遞信號之讀44係、繞過成為變頻馬達或動力線等雜訊源 之處而配線。 另一方面，Μ用研磨嚴置1〇之玻璃㈣之研磨中所產生 之彈性波穿過聚料而時常被ΑΕ感測器34檢測出，其資訊 145132.doc 13 201029808 時常輸出至異常探測部36。於異常探測部36預先設定可認 定玻璃板G上產生裂紋等微小破裂、缺口之臨限值。 圖3中，表示著表現上述臨限值（丨v)之來自ae感測器34 之輸出信號。當來自AE感測器34之輸出值超出上述臨限 值（1 V)時’亦即’異常探測部36探測出玻璃板^上產生裂 紋等微小破裂、缺口等異常。繼而，警報器38發出警告。 自警報器38發出警告之同時’藉由控制部32而使研磨裝置 10立即自動停止。 藉此’根據實施形態之研磨裝置1〇，可藉由AE感測器 34檢測出玻璃板G之破裂產生之初始階段，又，此時研磨 裝置10立即自動停止，故可於玻璃板（}裂得粉碎之前，檢 測出玻璃板G之破裂。由此，根據該研磨裝置丨〇，可將因 研磨墊20之檢查或清掃作業及交換作業等所引起之中斷時 間抑制為最小限度。 再者，AE感測器34亦檢測出玻璃板G之通常研磨中所產 生之低位準之彈性波，但甚至將上述彈性波亦判斷為檢測 出破裂之彈性波之情況，有恣意攪亂研磨步驟之虞。因 此，於實施形態之研磨裝置10中，將基於實驗值或經驗值 之上述臨限值（1 V)或藉由自動臨限值調整功能計算之值設 定為臨限值。 又，即便研磨中之玻璃板G上產生裂紋等微小破裂、缺 口之情形時，亦必需暫時使研磨裝置10停止，而清潔保持 構件丨4、研磨頭16、研磨墊2〇。然而’一般說來，玻璃板 G突然破碎之情形較少’而起初產生微小位準之破裂或缺 145132.doc 14 201029808 口之機率較多，故其清掃作業與恢復作業所耗費之時間僅 需幾十分鐘便足夠。由此，可大幅縮短中斷時間。 進而，實施形態之研磨裝置1 〇中，於使研磨墊20保持於 研磨壓盤22上之平板18 ’安裝有AE感測器34。藉此，AE 感測器3 4可準確檢測出研磨中產生之彈性波。 又，研磨裝置10中，於玻璃板G之研磨時使用漿料，故 可能會因平板18與AE感測器34之除AE感測器檢測面34八以 φ 外之部分之導通而引起電性雜訊產生。為防止該電性雜 訊，較好的是對圖4所示之AE感測器34安裝圖5(A)所示之 用以防水及絕緣之樹脂製防護罩46。該防護罩46覆蓋AE 感測器34之除檢測面34A以外之部分。又進而，並不將AE 感測器34之檢測面34A直接安裝於平板18，自防水及防止 漿料所造成之電性導通之觀點而言，如圖5(B)、5(c)所 示，較好的是經由與AE感測器34之檢測面34A相接且覆蓋 大致整體的金屬製防護罩48而安裝於平板18。此時，自提 • 咼檢測精度之觀點而言，較好的是設置將AE感測器34之 檢測面34A向防護罩48推壓之彈簧等施壓機構（未圖示）。 對圖5(B)、5(C)加以說明，圖5(B)係自下方觀察防護罩 48之立體圖，圖5(C)係自上方觀察防護罩48之立體圖。該 防護罩48係底部開放之箱體，AE感測器％之檢測面34A經 由上述施壓機構而受到推壓且固定於其頂板48八之下表面 中央部。 又，於頂板48A之兩側，隔著AE感測器“之安裝部48B 而形成有螺帽部48C、48C。而且，以與螺帽部縱、48〇： 145132.doc 201029808 對應之方式，於平板18形成有貫通孔（未圖示），使螺釘（未 圖示）通過該等貫通孔而緊固於螺帽部48c、48c ,藉此使 防護罩48固定於平板a。 再者，構成研磨裝置之系統，使得當自圖i之警報器38 發出警告時，對整個研磨裝置1〇進行總括控制之控制部32 使研磨裝置10停止。 藉此，不需要監視員監視研磨裴置1〇。又，於連續研磨 時，可阻止異常產生後之對後續之其他玻璃板G之影響， 因此玻璃板G之品質、運行速率及良率分別提高。又於 研磨裝置10已停止時，較好的是由控制部3 2控制旋轉/升 降裝置30，以使玻璃板g與研磨頭16 一同自研磨墊2〇上升 (撤回）。藉此，可自研磨頭16容易地取出破裂產生之初始 階段之玻璃板G。 又，AE感測器34自渗透於研磨墊2〇之漿料經由平板j 8 而檢測出來自玻璃板G之彈性波。圖6中，表示著玻璃板G 之破裂檢測原理。於研磨中之玻璃板（5上，若於點（p〇int)p 產生初始階段之破裂，則來自點p之彈性波會如圖中之虛 線所示於玻璃板G内傳播’繼而傳播至滲透有漿料之研磨 墊20 ’之後’傳播至平板丨8而被AE感測器3 4檢測出。 研磨墊20通常係由聚胺酯製造，雖然聚胺酯自身難以傳 遞彈性波’但聚胺酯製之研磨墊20中滲透有漿料。因此， AE感測器34能自該漿料經由平板18而準確地檢測出來自 點P之彈性波。 另一方面，如圖1所示，AE感測器34形成於平板18、且 145132.doc -16- 201029808 安裝於自研磨壓盤22向側方伸出之突出片18A的下表面。 如此，若於自研磨壓盤22向側方伸出之平板18之突出片 18Α的下表面安裝ΑΕ感測器34，則可防止旋轉中之研磨頭 16碰撞到ΑΕ感測器34。 圖1中，表示著ΑΕ感測器之數量為一個之情形，但如上 所述，安裝之ΑΕ感測器之數量較好的是根據玻璃板之大 小而適當決定。 又，作為ΑΕ感測器34之安裝位置，如圖6所示，亦可於 研磨壓盤22之中央部形成貫通孔22Α，且經由該貫通孔 22Α而將以雙點劃線表示之ΑΕ感測器34之檢測面34α安裝 於平板18之下表面。如此，若於研磨壓盤22之中央部安裝 ΑΕ感測器34，則可縮短玻璃板G之破裂位置與αε感測器μ 之距離。藉由採用上述配置構成，彈性波之檢測靈敏度提 高。 進而，自ΑΕ感測器34輸出至異常探測部36之頻帶係藉 • 由鑑別器（濾波器）42而設定於100〜200 kHz之範圍内。於研 磨裝置10之周邊，設置有玻璃板G之切割裝置、倒角裝 置、開孔裝置等各種裝置，必需排除因來自該等裝置之機 械性振動所引起之頻率（小於1〇〇kHz)之彈性波，又，必需 排除因電性雜訊所引起之頻率（超出2〇〇 kHz)之彈性波。 因此，實施形態之研磨裝置1〇中，由於將自AE感測器 34輸出至異常探測部36之頻帶之下限值設為刚他，因 此可防止因上述機械性振動之彈性波所引起之誤檢測。 又由於將上限值設為200 kHz，因此可防止上述電性雜 145J32.doc -17- 201029808 訊之彈性波所引起之誤檢測。再者，上限值越高，則ae 感測器34之輸出越會衰減，故不佳。又’亦可於ae感測 器自身内設置提取上述頻帶之頻率之濾波器。 本發明並不限定於上述實施例，可適用於除FPD以外之 電子裝置’例如光學元件用玻璃基板、玻璃盤（glass disk)、太陽電池等之基板加工中。 又’實施形態中，作為研磨具係列舉研磨墊2〇，且作為 被研磨物係列舉玻璃板G，但並不限定於此，亦可適用於 如下裝置中：以整形磨石（平面狀之電鍍金剛石板）為研磨❿ 具，以研磨墊20為被研磨物，且利用整形磨石而對研磨墊 20進行整形。該裝置之構成，係將圖2中之玻璃板g替換成 整形磨石’故此處省略圖。 又，於對研磨墊20進行整形之情形時，使用水作為研磨 液，故整形時產生之來自研磨墊2〇之彈性波會穿過水而被 AE感測器34檢測出。而且，來自AE感测器Μ之資訊時常 輸出至異常探測部36 ’於異常探測㈣中預先設定研磨塾 之合理整形效率下限之臨限值。當異常探測部％探測$ ◎ 研磨墊20之整形效率之下降時，警報器巧發出警告。 :上已參照特定之實施態樣對本發明進行詳細㈣，伸 ^明白可不脫離本發明之精神及範圍進行各種變更或修 申請之曰本專利申請案 照之形式應用於本文 本申請案係基於2008年12月12曰 2008-317269開發者，其内容以參 中。 145132.doc 18 201029808 【圖式簡單說明】 圖1係本發明之研磨裝置之立體圖； 圖2係圖1之研磨裝置之主要部分放大剖面圖； 圖3係表示來自AE感測器之輪出波形與臨限值之波形 圖； 圖4係AE感測器之放大立體圖； 圖5(A)係由樹脂製防護罩覆蓋之八£感測器之立體圖，圖 5(B)係自下方觀察金屬製防護罩之立體圖，圖5(c)係自上 方觀察金屬製防護罩之立體圖； 圖6係表示AE感測器之其他安裝位置之研磨裝置之局部 剖面圖； 圖7係本發明之玻璃板之製造方法之流程圖；及 圖8係表示玻璃板之微小位準之破裂之俯視圖。 【主要元件符號說明】 10 研磨裝置 14 保持構件 16 研磨頭 18 平板 20 研磨塾 22 研磨壓盤 22A 貫通孔 24 研磨液供給孔 26 抽吸孔 28 主軸 145132.doc •19- 201029808 30 旋轉/升降裝置 32 控制部 34 AE感測器 34A 檢測面 36 異常探測部 38 警報器 40 前置放大器 42 鑑別器 44 PLC電纜 46 防護罩 48 防護罩 48A 頂板 48B 安裝部 48C 螺帽部 145132.doc -20-Recording media such as Only Memory ’. In addition, the transmission signal is read 44 lines, and wiring is bypassed to become a noise source such as a variable frequency motor or a power line. On the other hand, the elastic wave generated by the grinding of the glass (4) which is ground with a grind is passed through the polymer and is often detected by the sputum sensor 34, and the information is often output to the abnormality detecting unit 145132.doc 13 201029808 36. The abnormality detecting unit 36 sets in advance a threshold value for determining a minute crack or a chip which is generated by a crack in the glass sheet G. In Fig. 3, the output signal from the ae sensor 34 showing the above threshold (丨v) is shown. When the output value from the AE sensor 34 exceeds the threshold value (1 V), the abnormality detecting unit 36 detects an abnormality such as a crack or a chip which is cracked or the like on the glass plate. In turn, the alarm 38 issues a warning. The polishing device 10 is automatically stopped immediately by the control unit 32 while the warning device 38 issues a warning. Therefore, according to the polishing apparatus 1 of the embodiment, the initial stage of the rupture of the glass sheet G can be detected by the AE sensor 34, and at this time, the polishing apparatus 10 is automatically stopped immediately, so that it can be used on the glass plate (} Before the pulverization is pulverized, the rupture of the glass sheet G is detected. Therefore, according to the polishing apparatus 中断, the interruption time due to the inspection, cleaning operation, exchange work, and the like of the polishing pad 20 can be minimized. The AE sensor 34 also detects the low-order elastic wave generated in the usual polishing of the glass sheet G, but even determines the elastic wave as the elastic wave of the crack, and arbitrarily disturbs the grinding step. Therefore, in the polishing apparatus 10 of the embodiment, the threshold value (1 V) based on the experimental value or the empirical value or the value calculated by the automatic threshold adjustment function is set as the threshold value. When a slight crack or a gap such as a crack occurs in the glass sheet G in the middle, it is necessary to temporarily stop the polishing apparatus 10, and clean the holding member 4, the polishing head 16, and the polishing pad 2 〇. However, generally speaking The glass plate G suddenly breaks down less often, and initially has a slight level of cracking or lack of 145132.doc 14 201029808 mouth is more likely, so the cleaning and recovery operations take only a few minutes is enough. Thereby, the interruption time can be greatly shortened. Further, in the polishing apparatus 1 of the embodiment, the AE sensor 34 is attached to the flat plate 18' holding the polishing pad 20 on the polishing platen 22. Thereby, the AE sensing is performed. The elastic wave generated in the grinding can be accurately detected by the device 34. Further, in the polishing device 10, the slurry is used for polishing the glass plate G, so the AE sensor may be removed by the flat plate 18 and the AE sensor 34. The detecting surface 34 is electrically turned on by the conduction of the portion other than φ. To prevent the electrical noise, it is preferable to mount the AE sensor 34 shown in Fig. 4 as shown in Fig. 5(A). A waterproof protective cover 46 for waterproofing and insulating. The protective cover 46 covers a portion of the AE sensor 34 other than the detecting surface 34A. Further, the detecting surface 34A of the AE sensor 34 is not directly mounted to the detecting surface 34A of the AE sensor 34. The flat plate 18 is self-waterproof and prevents electrical conduction caused by the slurry. 5(B) and 5(c), it is preferable to be attached to the flat plate 18 via a metal shield 48 that is in contact with the detection surface 34A of the AE sensor 34 and covers substantially the entire surface. From the viewpoint of the detection accuracy of the crucible and the crucible, it is preferable to provide a pressing mechanism (not shown) such as a spring that presses the detecting surface 34A of the AE sensor 34 against the shield 48. Fig. 5 (B) 5(C), FIG. 5(B) is a perspective view of the protective cover 48 viewed from below, and FIG. 5(C) is a perspective view of the protective cover 48 viewed from above. The protective cover 48 is a box having an open bottom. The detection surface 34A of the AE sensor % is pressed by the above-described pressing mechanism and fixed to the central portion of the lower surface of the top plate 48. Further, on both sides of the top plate 48A, the nut portions 48C and 48C are formed via the mounting portion 48B of the AE sensor. Further, in correspondence with the nut portion length, 48〇: 145132.doc 201029808, A through hole (not shown) is formed in the flat plate 18, and a screw (not shown) is fastened to the nut portions 48c and 48c through the through holes, whereby the shield 48 is fixed to the flat plate a. The system constituting the polishing apparatus causes the control unit 32 that performs overall control of the entire polishing apparatus 1 to stop the polishing apparatus 10 when a warning is issued from the alarm unit 38 of Fig. i. Thereby, the monitor is not required to monitor the polishing apparatus 1 Further, in the case of continuous grinding, the influence of the abnormality on the subsequent glass sheets G can be prevented, so that the quality, the operation rate and the yield of the glass sheets G are respectively increased. When the grinding apparatus 10 is stopped, Preferably, the rotation/lifting device 30 is controlled by the control unit 32 to cause the glass sheet g to be lifted (retracted) from the polishing pad 2 together with the polishing head 16. Thereby, the initial generation of the crack can be easily taken out from the polishing head 16. Stage glass plate G. Again, AE sensor 34 The elastic wave from the glass sheet G is detected from the slurry penetrating the polishing pad 2 through the flat plate j 8. The crack detection principle of the glass plate G is shown in Fig. 6. In the glass plate during polishing (5, if When the point p (p〇int) p produces an initial stage of rupture, the elastic wave from point p will propagate in the glass sheet G as indicated by the dashed line in the figure, and then propagates to the polishing pad 20 that has penetrated the slurry. It is transmitted to the flat plate 8 and detected by the AE sensor 34. The polishing pad 20 is usually made of polyurethane, although the polyurethane itself is difficult to transmit elastic waves, but the polishing pad 20 made of polyurethane penetrates the slurry. Therefore, the AE sense The detector 34 can accurately detect the elastic wave from the point P from the slurry via the flat plate 18. On the other hand, as shown in Fig. 1, the AE sensor 34 is formed on the flat plate 18, and 145132.doc -16- 201029808 is mounted on the lower surface of the protruding piece 18A which protrudes laterally from the grinding platen 22. Thus, if the lower surface of the protruding piece 18Α of the flat plate 18 which protrudes laterally from the grinding platen 22 is attached to the ΑΕ sensor 34, the rotating head 16 in rotation is prevented from colliding with the ΑΕ sensor 34. In the case of 1, the number of the sensors is one, but as described above, the number of the sensors to be mounted is preferably determined according to the size of the glass plate. Also, as the ΑΕ sensor 34 As shown in FIG. 6, a through hole 22A may be formed in a central portion of the polishing platen 22, and the detecting surface 34α of the click sensor 34 indicated by a chain double-dashed line may be attached via the through hole 22Α. On the lower surface of the flat plate 18. Thus, if the ΑΕ sensor 34 is attached to the central portion of the polishing platen 22, the distance between the rupture position of the glass plate G and the α ε sensor μ can be shortened. By adopting the above configuration, the detection sensitivity of the elastic wave is improved. Further, the frequency band output from the sensor 34 to the abnormality detecting unit 36 is set in the range of 100 to 200 kHz by the discriminator (filter) 42. At the periphery of the polishing apparatus 10, various devices such as a cutting device, a chamfering device, and a hole opening device of the glass plate G are provided, and it is necessary to eliminate the frequency (less than 1 kHz) caused by mechanical vibrations from the devices. Elastic waves, in addition, must eliminate the elastic waves (exceeding 2 kHz) caused by electrical noise. Therefore, in the polishing apparatus 1 of the embodiment, since the lower limit value of the frequency band output from the AE sensor 34 to the abnormality detecting unit 36 is set to be the same, it is possible to prevent the elastic wave due to the mechanical vibration. False detection. Further, since the upper limit value is set to 200 kHz, it is possible to prevent erroneous detection caused by the elastic wave of the above-mentioned electrical miscellaneous 145J32.doc -17-201029808. Furthermore, the higher the upper limit value, the more the output of the ae sensor 34 is attenuated, which is not preferable. Further, a filter for extracting the frequency of the above frequency band may be provided in the ae sensor itself. The present invention is not limited to the above embodiment, and can be applied to substrate processing such as an electronic device other than FPD, such as a glass substrate for an optical element, a glass disk, or a solar cell. In the embodiment, the polishing pad is used as a polishing pad, and the glass plate G is used as the object to be polished. However, the present invention is not limited thereto, and may be applied to an apparatus for shaping a grindstone (planar shape). The electroplated diamond plate is a polishing tool, and the polishing pad 20 is used as an object to be polished, and the polishing pad 20 is shaped by an orthodontic grinding stone. The configuration of the apparatus is such that the glass plate g in Fig. 2 is replaced with a shaped grindstone. Further, when the polishing pad 20 is shaped, water is used as the polishing liquid, so that the elastic wave from the polishing pad 2 which is generated during the shaping is passed through the water and detected by the AE sensor 34. Further, the information from the AE sensor 时 is often output to the abnormality detecting portion 36' in the abnormality detecting (4), and the threshold value of the lower limit of the reasonable shaping efficiency of the grinding 预先 is set in advance. When the abnormality detecting portion % detects $ ◎ the plastic forming efficiency of the polishing pad 20 is lowered, the alarm warns. The present invention has been described in detail with reference to the specific embodiments of the present invention. It is to be understood that the present invention can be applied in various forms without departing from the spirit and scope of the invention. Developers of December 12曰2008-317269, whose contents are included. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a polishing apparatus of the present invention; FIG. 2 is an enlarged sectional view of a main part of the polishing apparatus of FIG. 1; FIG. 3 is a diagram showing a wheel-out waveform from an AE sensor. FIG. 4 is an enlarged perspective view of the AE sensor; FIG. 5(A) is a perspective view of a sensor covered by a resin cover, and FIG. 5(B) is a metal view from below. Figure 3 (c) is a perspective view of the metal shield from above; Figure 6 is a partial cross-sectional view of the grinding device showing other mounting positions of the AE sensor; Figure 7 is a glass plate of the present invention A flow chart of the manufacturing method; and FIG. 8 is a plan view showing the rupture of the minute level of the glass sheet. [Main component symbol description] 10 Grinding device 14 Holding member 16 Grinding head 18 Flat plate 20 Grinding 塾 22 Grinding platen 22A Through hole 24 Grinding liquid supply hole 26 Suction hole 28 Spindle 145132.doc • 19- 201029808 30 Rotary/lifting device 32 Control unit 34 AE sensor 34A Detection surface 36 Abnormal detection unit 38 Alarm 40 Preamplifier 42 Discriminator 44 PLC cable 46 Shield 48 Shield 48A Top plate 48B Mounting portion 48C Nut portion 145132.doc -20-