TW202104871A - Abnormality detection device and abnormality detection method capable of accurately detecting abnormalities in various processing of a workpiece - Google Patents

Abstract

The present invention provides an abnormality detection device and an abnormality detection method capable of accurately detecting abnormalities in various processing of a workpiece. The abnormality detection device of the present invention comprises: an AE sensor 61, which is arranged on a grinding disc 20 for processing a glass plate G placed on the top and detects elastic waves from the glass plate G through a slurry S interposed between the glass plate G; and an abnormality detection unit 17 which determines whether the glass plate G is abnormal based on a detection signal from the AE sensor 61. The AE sensor 61 is arranged directly below the placement position of the glass plate G on the grinding disc 20.

Description

Anomaly detection device and anomaly detection method

The invention relates to an abnormality detection device and an abnormality detection method.

For example, in various processing of glass plates used in LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) and other flat panel displays (FPD: Flat Panel Display), Occasionally, the glass plate may be broken or damaged. Therefore, as a polishing device that grinds a glass plate, a glass breakage detection device that detects the breakage of the glass plate in advance is known (for example, refer to Patent Document 1). The glass break detection device includes: a liquid supply part, which supplies liquid to the glass plate; an AE (Acoustic Emission) sensor, which is arranged at a position in contact with the liquid; and a signal processing part, whose self-detection comes from the glass The AE signal input by the AE sensor of the elastic wave of the board is processed. Moreover, in the glass breakage detection device, the signal processing unit judges the breakage of the glass plate by the AE signal from the AE sensor exceeding a predetermined threshold.

In addition, a technique is also known that uses a detection signal from an AE sensor to determine the breakage of a glass plate, and the AE sensor is mounted on an aluminum plate constituting a polishing pad of a polishing device (for example, refer to Patent Document 2). [Prior technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-190971 [Patent Document 2] International Publication No. 2010/067732

[The problem to be solved by the invention]

In addition, the detection devices described in the above-mentioned Patent Documents 1 and 2 are all detected by the AE sensor on the side away from the polishing position of the polishing head for polishing the glass plate. In addition, in the detection device described in Patent Document 2, the elastic wave is detected by an AE sensor mounted on an aluminum plate to which a polishing pad for grinding a glass plate is fixed. Therefore, in these detection devices, the noise contained in the elastic wave detected by the AE sensor increases, and there is a risk of misdetecting abnormalities such as minute breaks.

Therefore, an object of the present invention is to provide an abnormality detection device and an abnormality detection method that can detect abnormalities in various processing of a workpiece with high accuracy. [Technical means to solve the problem]

The present invention includes the following constitutions. (1) An abnormality detection device, which is provided with: AE sensor, which is installed on the processing table for processing the workpiece placed on the upper part, and detects the liquid from the workpiece through the liquid interposed between the workpiece and the workpiece. The elastic wave of the above-mentioned workpiece; and an abnormality detection unit, which determines whether the above-mentioned workpiece is abnormal based on the detection signal from the above-mentioned AE sensor; the above-mentioned workpiece with the above-mentioned AE sensor arranged on the processing table Directly below the placement position. (2) An abnormality detection method, which is to install an AE sensor on a processing table that processes the workpiece placed on the upper part, and the AE sensor detects the liquid interposed between the workpiece and the workpiece Elastic waves from the above-mentioned workpiece, and based on the detection signal from the above-mentioned AE sensor, determine whether the above-mentioned workpiece is abnormal, and the above-mentioned AE sensor is placed on the above-mentioned processing table. Right below the location. [Effects of the invention]

According to the abnormality detection device and the abnormality detection method of the present invention, it is possible to accurately detect abnormalities when various processing is performed on the workpiece.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Furthermore, in this example, the case of detecting the breakage of a workpiece made of a glass plate is exemplified to illustrate the abnormality detection device and the abnormality detection method of the present invention. Fig. 1 is a schematic configuration diagram of a polishing device applying the abnormality detection device of the present invention. Fig. 2 is a schematic side view of a polishing device to which the abnormality detection device of the present invention is applied. Figure 3 is a cross-sectional view of a part of the polishing device.

As shown in FIGS. 1 and 2, the polishing device 10 is a device for polishing a glass plate (worked object) G formed into a rectangular shape. The glass plate G polished by the polishing device 10 is composed of, for example, an alkali-free glass-based material used in a flat panel display (FPD: Flat Panel Display) such as LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode). The glass plate G is, for example, a glass plate with a side of 2000×2200 mm-2200×2600 mm and a thickness of 0.7 mm, and is manufactured by, for example, a float method. The polishing device 10 grinds the glass plate G and grinds it to the flatness required for various applications.

The polishing device 10 includes a polishing table (processing table) 20, a polishing plate 40, and a polishing head 50. The polishing table 20 is formed in a circular shape in plan view, and a polishing plate 40 is provided on the upper surface thereof. The polishing head 50 is arranged on the upper portion of the polishing table 20. The glass plate G is disposed on the upper portion of the polishing plate 40 provided on the polishing table 20 and is pressed against the polishing plate 40 by the polishing head 50. A rotating shaft 51 is provided in the center of the upper part of the polishing head 50, and a rotating/lifting device 53 is connected to the rotating shaft 51. The rotating/lifting device 53 is connected to the control unit 11 that controls the entire polishing device 10, and the control unit 11 controls the number of rotations and the lowering action (pressing force) suitable for the polishing of the glass plate G.

As shown in FIG. 3, the polishing table 20 is formed with a plurality of suction holes 31 and a plurality of slurry supply holes 33 with an opening on the upper surface. To the suction hole 31, a suction pump (not shown) is connected, and to the slurry supply hole 33, for example, a slurry supply machine (not shown) is connected to supply slurry (liquid) S as a polishing liquid such as an aqueous solution of cerium oxide Show).

The polishing plate 40 provided on the upper surface of the polishing table 20 has a resin buffer plate portion 41, an aluminum support plate portion 43, and a polishing pad 45, and the buffer plate portion 41, the support plate portion 43 and the polishing pad The pads 45 are sequentially overlapped and configured. As the polishing pad 45, for example, a foamed polyurethane type or a suede type is used. The polishing plate 40 is formed with flow paths 47 penetrating the front and back surfaces, and the flow paths 47 communicate with the slurry supply hole 33 of the polishing table 20.

The polishing plate 40 that grinds the upper surface of the table 20 is sucked by the suction hole 31 by a suction pump to be held on the upper surface of the table 20. Moreover, by stopping the operation of the suction pump, the suction at the suction hole 31 is released, and it can be removed from the upper surface of the polishing table 20.

In addition, if the slurry S is supplied from the slurry supply machine to the slurry supply hole 33 of the polishing table 20, the slurry S is fed into the flow path 47 communicating with the slurry supply hole 33, and is then polished to the polishing plate 40. The pad 45 is supplied on the upper surface side. Thereby, the polishing pad 45 is in a state of being soaked with the slurry S.

The polishing head 50 arranged on the upper portion of the polishing table 20 holds the glass plate G via a sheet-shaped holding sheet 55 including a backing material having a self-adsorption effect and the like. The polishing head 50 is rotated and lifted by the rotating shaft 51 driven by the rotating/lifting device 53. Therefore, the glass plate G held by the polishing head 50 via the holding sheet 55 is pressed against the polishing plate 40 provided on the upper surface of the polishing platen 20 while rotating by the number of revolutions and pressing force suitable for polishing. Thereby, the surface on the side of the polishing plate 40 of the glass plate G, that is, the surface to be polished A, is polished by the polishing pad 45 of the polishing plate 40 to a desired flatness.

Fig. 4 is a schematic plan view of the polishing table constituting the polishing device. Fig. 5 is a schematic cross-sectional view of the sensor part disposed on the polishing platen. Figure 6 is a three-dimensional view of the AE sensor.

As shown in FIGS. 4 and 5, the polishing table 20 has a sensor portion 21 at a substantially central portion thereof. The sensor part 21 has a sensor accommodating part 23 formed in a concave shape, and an AE (Acoustic Emission) sensor 61 is accommodated in the sensor accommodating part 23. The AE sensor 61 is, for example, a sensor that has a piezoelectric element, and the piezoelectric element detects elastic waves released when a solid is deformed or broken, and outputs its detection signal. As the AE sensor 61, a pre-amplifier built in to amplify the output detection signal can be used.

The sensor part 21 is arranged at a lower position overlapping with the glass plate G arranged on the polishing platen 20 in a plan view. Thereby, the AE sensor 61 of the sensor part 21 is arranged directly below the placement position of the glass plate G on the grinding table 20.

As shown in FIG. 6, the periphery of the AE sensor 61 excluding the detection surface 63 is covered with a resin cover 65. In this way, the AE sensor 61 ensures waterproofness and insulation by the cover 65. In addition, the AE sensor 61 pulls out the cable 67 from its side.

The polishing table 20 has a cover 25 covering the sensor receiving portion 23. A mounting hole 27 is formed in the cover 25, and the detection surface 63 side of the AE sensor 61 is fitted and mounted in the mounting hole 27. Thereby, the detection surface 63 of the AE sensor 61 is exposed on the upper surface side of the polishing table 20.

In addition, the polishing plate 40 has a slurry inflow hole 49 penetrating through the front surface and the back surface at a position where the detection surface 63 of the AE sensor 61 of the polishing platen 20 is exposed. The slurry inflow hole 49 is filled with slurry S supplied to the polishing pad 45 of the polishing plate 40. As a result, the slurry S is interposed between the detection surface 63 of the AE sensor 61 and the polished surface A of the glass plate G.

A cable insertion hole 29 is formed in the polishing table 20, and a cable 67 drawn from the AE sensor 61 is inserted into the cable insertion hole 29. Then, the cable 67 inserted into the cable insertion hole 29 is pulled out from the outer peripheral surface of the polishing platen 20.

As shown in FIG. 1, the cable 67 from the AE sensor 61 pulled out from the polishing platen 20 is connected to the control unit 11 via the discriminator 15. Thereby, the detection signal representing the elastic wave from the AE sensor 61 is sent to the control unit 11. Furthermore, the cable 67 drawn from the polishing table 20 and connected to the control unit 11 is a PLC (Power Line Communication) cable or the like.

The detection signal sent to the control unit 11 is amplified by a pre-amplifier built in the AE sensor 61, and only a signal of a specific frequency band is extracted by the discriminator 15. The control unit 11 has an abnormality detection unit 17 and an alarm 19. Based on the detection signal from the AE sensor 61, the abnormality detection unit 17 detects the abnormality of the glass plate G being polished. Furthermore, if the abnormality of the glass plate G is detected by the abnormality detection part 17, the alarm 19 will give a warning.

Here, since a built-in preamplifier is used as the AE sensor 61, the influence of noise on the detection signal output from the AE sensor 61 and sent to the control unit 11 can be suppressed. That is, the detection signal sent from the AE sensor 61 can be set as a signal resistant to peripheral noise, and the distance of the cable 67 to the discriminator 15 can be increased.

For example, in the case of using an AE sensor without a built-in preamplifier, a preamplifier must be installed separately. In addition, when a preamplifier is installed separately, noise can easily enter the AE sensor to the preamplifier. between. Therefore, the noise contained in the detection signal may be amplified together with the elastic wave signal by the preamplifier and the discriminator, which may have a greater impact on the detection result. Therefore, the length of the cable between the AE sensor and the preamplifier cannot be increased, for example, the cable length is about 5 m at the longest.

On the other hand, if the AE sensor 61 with a built-in preamplifier is used as in this example, the length of the cable 67 from the AE sensor 61 to the discriminator 15 can be 10 m or more, for example, It can also be extended with a connector. Therefore, even if the polishing device 10 is a device for polishing a large glass plate G, the AE sensor 61 can be installed in the center of the polishing table 20, and the cable 67 can be fully wired to the center of the polishing table 20 without installing a preamplifier in the middle. Grind the outside of the fixed plate 20.

Furthermore, there are cases where it is not necessary to use a built-in preamplifier as the AE sensor 61. For example, when the distance from the sensor accommodating portion 23 of the polishing plate 20 to the outside is short like a device for polishing a small glass plate G, it may be difficult to ensure the preamplifier built-in type AE sensing in the polishing plate 20. In the case of the installation space of the device 61, the AE sensor 61 without a built-in preamplifier can also be used. In this case, a preamplifier is installed on the cable 67 drawn from the polishing platen 20 to amplify the detection signal from the AE sensor 61.

Figure 7 is a waveform diagram showing the output waveform from the AE sensor. As shown in FIG. 7, the abnormality detection unit 17 is preset with a threshold value T that considers that the glass plate G is broken, chipped, or scratched. In the abnormality detection unit 17, if the output value of the AE sensor 61 exceeds the threshold value T, the abnormality detection unit 17 determines that the glass plate G is abnormal. Furthermore, if it is determined by the abnormality detection unit 17 that an abnormality has occurred, the control unit 11 performs control such that the rotation/elevating device 53 is stopped and a warning that the abnormality has occurred is issued from the alarm 19.

Next, the polishing step and abnormality detection of the glass plate G performed by the above-mentioned polishing device 10 will be described. In the grinding step, the glass plate G is placed on the placement position of the grinding table 20, and the glass plate G is rotated while being pressed against the grinding plate 40 by the grinding head 50. Thereby, the polished surface A of the glass plate G is polished by the polishing pad 45 containing the slurry S.

In this polishing step, the slurry S supplied to the polishing pad 45 enters the slurry inflow hole 49. Thereby, it becomes a state in which the slurry S flowing into the slurry inflow hole 49 is interposed between the glass plate G and the detection surface 63 of the AE sensor 61 (refer to FIG. 5). Thereby, the elastic wave from the glass plate G is detected by the AE sensor 61 arranged directly below the placement position of the glass plate G of the polishing platen 20 through the slurry S.

Then, as shown in FIG. 7, for example, after the polishing start S1, if the output value of the AE sensor 61 exceeds the threshold value T, the abnormality detection unit 17 determines that the glass plate G is abnormal. Then, the control unit 11 of the polishing device 10 stops the rotation/lifting device 53 at the time S2, and the alarm 19 issues a warning. Thereby, the influence on the glass plate G or the polishing pad 45 due to the continuous polishing of the glass plate G in the abnormal state is suppressed.

As explained above, according to the abnormality detection device and the abnormality detection method of this embodiment, the grinding table 20 is arranged directly below the placement position of the glass plate G as the workpiece to detect the elasticity from the glass plate G Wave of the AE sensor 61. Thereby, the elastic wave from the glass plate G can be accurately detected through the slurry S interposed between the glass plate G and the glass plate G. Therefore, it is possible to detect abnormalities such as breakage or chipping of the glass plate G with high accuracy without error detection. In addition, since the elastic wave can be detected with high accuracy, it is possible to detect minute breaks or notches. In addition, it is possible to detect not only the breaks or notches, but also when the glass plate G has a flaw, the abnormality can also be detected. Moreover, compared with the structure which detects the elastic wave on the side of the glass plate G, even if the glass plate G is large, the abnormality which arises near the center in a plan view can be detected well.

Next, a modified example will be explained. Fig. 8 is a schematic top view of the polishing plate of the modified example. As shown in FIG. 8, in a modified example, a plurality of sensor parts 21 are provided on the polishing platen 20. In this example, the polishing table 20 includes two sensor parts 21. The sensor parts 21 are respectively arranged at approximately the middle position of the polishing platen 20 in the radial direction, and are arranged at opposite positions across the center of the polishing platen 20. Moreover, these sensor parts 21 are also arrange|positioned at the lower position which overlaps with the installed glass plate G in a plan view. Thereby, the AE sensor 61 of the sensor part 21 is arranged directly below the placement position of the glass plate G on the grinding table 20.

In addition, in the modified example, the polishing plate 40 provided on the upper surface of the polishing platen 20 is divided into a plurality of pieces. In this example, the polishing plate 40 is divided into 12 divided plates 40A to 40L. In addition, the two sensor parts 21 provided on the polishing table 20 are provided at positions below the two divided plates 40D and 40I near the center of the plurality of divided plates 40A to 40L.

According to this modified example, the polishing plate 40 is composed of a plurality of divided plates 40A to 40L, whereby the operability of the polishing plate 40 can be improved. By this, for example, even when a large glass plate G whose one side is 3000 mm×3000 mm or more is polished, the glass plate G can be smoothly polished, and the abnormality of the glass plate G during polishing can be detected with high accuracy.

In this way, the present invention is not limited to the above-mentioned embodiments. Combining the various components of the embodiments or making changes and applications based on the description of the specification and known technologies by the industry is also the intended part of the present invention and is included in the claims. range.

Furthermore, the present invention can be applied to the processing of electronic devices other than LCDs, OLEDs, and FPDs, such as glass substrates for optical elements, glass discs, and solar cells. Moreover, as a to-be-processed object, it is not limited to a glass plate, For example, it may be formed of metal, ceramics, or resin.

In addition, in the above-mentioned embodiment, the case where an abnormality is detected in the grinding process of a workpiece made of a glass plate is exemplified, but the present invention is not limited to grinding, for example, it can be applied to cutting, grinding, and coating. Abnormal detection during various processing.

As mentioned above, the following matters are disclosed in this manual. (1) An abnormality detection device, which is provided with: AE sensor, which is installed on the processing table for processing the workpiece placed on the upper part, and detects the liquid from the workpiece through the liquid interposed between the workpiece and the workpiece. The elastic wave of the above-mentioned workpiece; and an abnormality detection unit, which determines whether the above-mentioned workpiece is abnormal based on the detection signal from the above-mentioned AE sensor; the above-mentioned workpiece with the above-mentioned AE sensor arranged on the processing table Directly below the placement position. According to the abnormality detection device of the above-mentioned (1), the AE sensor that detects the elastic wave from the workpiece is arranged directly below the placement position of the workpiece on the processing table. Thereby, the elastic wave from the workpiece can be accurately detected through the liquid interposed between the workpiece and the workpiece. Therefore, it is possible to accurately detect abnormalities such as breaks or nicks that occur in the workpiece without error detection. Moreover, since the elastic wave can be detected with high accuracy, it is possible to detect minute breaks or notches. In addition, it is possible to detect not only the breaks or notches, but also the abnormality when the workpiece is flawed. In addition, compared to the structure that detects elastic waves on the side of the workpiece, even if the workpiece is large, it is possible to better detect abnormalities that occur near the center when viewed from above.

(2) The abnormality detection device according to (1), wherein the AE sensor detects elastic waves from the workpiece formed of a glass plate. According to the abnormality detection device constructed in (2) above, it is possible to detect abnormalities in various processing of the glass plate with high accuracy.

(3) The abnormality detection device according to (2), wherein a polishing plate is provided on the upper surface of the processing table, and the polishing plate is pressed against the glass plate and moved relatively to polish the glass plate. The plate has a slurry inflow hole that communicates with the AE sensor and the glass plate. The AE sensor detects the slurry through the slurry supplied between the polishing plate and the glass plate and flows into the slurry inflow hole. Elastic wave of glass plate. According to the abnormality detection device of the above-mentioned (3) configuration, the AE sensor can detect the elastic wave from the glass plate through the slurry flowing into the slurry inflow hole formed in the polishing plate, so that the polished can be detected with high accuracy. The abnormality of the glass plate.

(4) The abnormality detection device according to (3), wherein the polishing plate is composed of a plurality of divided plates divided in a plane direction, and the AE sensor is arranged under at least one of the divided plates. According to the abnormality detection device constructed in (4) above, the polishing plate is composed of a plurality of divided plates, thereby improving the operability of the polishing plate. Thereby, even when a large glass plate is polished, the glass plate can be polished well, and the abnormality of the glass plate during polishing can be detected with high accuracy.

(5) An abnormality detection method, which is to install an AE sensor on a processing table for processing the workpiece placed on the upper part, and the AE sensor detects the liquid through the liquid interposed between the workpiece and the workpiece Elastic waves from the above-mentioned workpiece, and based on the detection signal from the above-mentioned AE sensor, determine whether the above-mentioned workpiece is abnormal, and the above-mentioned AE sensor is placed on the above-mentioned processing table. Right below the location. According to the abnormal detection method of the above-mentioned (5) configuration, an AE sensor that detects the elastic wave from the processed object is arranged directly below the placement position of the processed object on the processing table. Thereby, the elastic wave from the workpiece can be accurately detected through the liquid interposed between the workpiece and the workpiece. Therefore, it is possible to accurately detect abnormalities such as breaks or nicks that occur in the workpiece without error detection. In addition, since the elastic wave can be detected with high accuracy, it is possible to detect minute breaks or notches. In addition, it is possible to detect not only the breaks or notches, but also the abnormality when the workpiece has a flaw. In addition, compared to the structure that detects elastic waves on the side of the workpiece, even if the workpiece is large, it is possible to better detect abnormalities that occur near the center when viewed from above.

(6) The abnormality detection method according to (5), wherein the above-mentioned AE sensor is used to detect the elastic wave from the above-mentioned workpiece composed of a glass plate. According to the abnormality detection method of the above-mentioned (6) configuration, it is possible to detect abnormalities in various processing of the glass plate with high accuracy.

(7) The abnormality detection method according to (6), wherein a polishing plate is provided on the upper surface of the processing table, and the polishing plate is pressed against the glass plate to move relatively to polish the glass plate, and the polishing plate is placed on the polishing plate. , Forming a slurry inflow hole communicating between the AE sensor and the glass plate, and the AE sensor is used to detect from the slurry supplied between the polishing plate and the glass plate and flowing into the slurry inflow hole The elastic wave of the above-mentioned glass plate. According to the abnormality detection method of the above-mentioned (7) configuration, the AE sensor can detect the elastic wave from the glass plate through the slurry flowing into the slurry inflow hole formed in the polishing plate, so that the polishing can be detected with high accuracy. The abnormality of the glass plate.

(8) The abnormality detection method according to (7), wherein a polishing plate composed of a plurality of divided plates divided in the surface direction is used as the polishing plate, and the AE sensor is arranged under at least one of the divided plates . According to the abnormal detection method of the above-mentioned (8) configuration, the operability of the polishing plate can be improved by using a polishing plate composed of a plurality of divided plates. Thereby, even when a large glass plate is polished, the glass plate can be polished well, and the abnormality of the glass plate during polishing can be detected with high accuracy.

The present invention has been described in detail with reference to specific embodiments, but it is clear to the industry that various changes or modifications can be added without departing from the spirit and scope of the present invention. This application is based on the Japanese patent application 2019-093864 filed on May 17, 2019, the content of which is incorporated herein by reference.

10: Grinding device (abnormality detection device) 11: Control part 15: Discriminator 17: Abnormality detection part 19: Alarm 20: Grinding table (processing table) 21: Sensor part 23: Sensor housing part 25: Cover 27: Mounting hole 29: Cable insertion hole 31: Suction hole 33: Slurry supply hole 40: Polishing plate 40A-40L: Dividing plate 41: Buffer plate section 43: Support plate section 45: Polishing pad 47: Flow path 49: Slurry inflow hole 50: Polishing head 51: Rotating shaft 53: Rotating/lifting device 55: Holding sheet 61: AE sensor 63: Detection surface 65: Outer cover 67: Cable A: Surface to be polished G: Glass plate (worked object) S: slurry (liquid)

Fig. 1 is a schematic configuration diagram of a polishing device to which the abnormality detection device of the present invention is applied. Fig. 2 is a schematic side view of a polishing device applying the abnormality detection device of the present invention. Figure 3 is a cross-sectional view of a part of the polishing device. Fig. 4 is a schematic top view of the polishing table constituting the polishing device. Fig. 5 is a schematic cross-sectional view of the sensor part arranged on the polishing platen. Figure 6 is a three-dimensional view of the AE sensor. Figure 7 is a waveform diagram showing the output waveform from the AE sensor. Fig. 8 is a schematic top view of the polishing plate of the modified example.

21: Sensor Department

23: Sensor housing part

25: Lid

27: Mounting hole

29: Cable insertion hole

40: Grinding board

41: Buffer Board

43: support board

45: Grinding pad

49: Slurry inflow hole

61: AE sensor

63: Detection surface

65: outer cover

67: Cable

A: Ground surface

G: Glass plate (worked object)

S: Slurry (liquid)

Claims (8)

An abnormality detection device, which is provided with: AE sensor, which is set on a processing table for processing the workpiece placed on the upper part, and detects the workpiece through the liquid interposed between the workpiece and the workpiece The elastic wave of the object; and the anomaly detection unit, which determines whether the object to be processed is abnormal based on the detection signal from the AE sensor; The AE sensor is arranged at the placement position of the object to be processed on the processing table Directly below. The abnormality detection device of claim 1, wherein the AE sensor detects elastic waves from the workpiece formed of a glass plate. For example, the abnormality detection device of claim 2, wherein a polishing plate is provided on the upper surface of the processing table, and the polishing plate is pressed against the glass plate to move relatively to polish the glass plate, and the polishing plate has a connection In the slurry inflow hole of the AE sensor and the glass plate, the AE sensor detects the slurry from the glass plate through the slurry that is supplied between the polishing plate and the glass plate and flows into the slurry inflow hole. Elastic wave. For example, the abnormality detection device of claim 3, wherein the polishing plate is composed of a plurality of divided plates divided in a surface direction, and the AE sensor is arranged under at least one of the divided plates. An abnormality detection method, which is to install an AE sensor on a processing table for processing a workpiece placed on the upper part, and the AE sensor detects from the workpiece through the liquid interposed between the workpiece and the workpiece. The elastic wave of the processed object, and based on the detection signal from the above-mentioned AE sensor, determine whether the above-mentioned processed object is abnormal, and the above-mentioned AE sensor is arranged on the processing table in the correct position of the above-mentioned processed object. Below. The abnormality detection method of claim 5, wherein the above-mentioned AE sensor is used to detect the elastic wave from the above-mentioned workpiece composed of a glass plate. Such as the abnormality detection method of claim 6, wherein a polishing plate is provided on the upper surface of the processing table, and the polishing plate is pressed against the glass plate to move relatively to polish the glass plate, and the polishing plate is connected to the polishing plate. In the slurry inflow hole of the AE sensor and the glass plate, the AE sensor is used to detect from the glass plate through the slurry supplied between the polishing plate and the glass plate and flowing into the slurry inflow hole The elastic wave. For example, the abnormality detection method of claim 7, wherein as the polishing plate, a polishing plate including a plurality of divided plates divided in a surface direction is used, and the AE sensor is arranged under at least one of the divided plates.

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