TWI682164B - 基板監視裝置及基板監視方法 - Google Patents

基板監視裝置及基板監視方法 Download PDF

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Publication number
TWI682164B
TWI682164B TW104140284A TW104140284A TWI682164B TW I682164 B TWI682164 B TW I682164B TW 104140284 A TW104140284 A TW 104140284A TW 104140284 A TW104140284 A TW 104140284A TW I682164 B TWI682164 B TW I682164B
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TW
Taiwan
Prior art keywords
substrate
imaging
laser light
light
irradiation
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TW104140284A
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English (en)
Chinese (zh)
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TW201632876A (zh
Inventor
阪上弘敏
大野哲宏
東基從
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日商愛發科股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture

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  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW104140284A 2014-12-05 2015-12-02 基板監視裝置及基板監視方法 TWI682164B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-246984 2014-12-05
JP2014246984 2014-12-05

Publications (2)

Publication Number Publication Date
TW201632876A TW201632876A (zh) 2016-09-16
TWI682164B true TWI682164B (zh) 2020-01-11

Family

ID=56091663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140284A TWI682164B (zh) 2014-12-05 2015-12-02 基板監視裝置及基板監視方法

Country Status (5)

Country Link
JP (1) JP6483152B2 (fr)
KR (1) KR101981182B1 (fr)
CN (1) CN107110793B (fr)
TW (1) TWI682164B (fr)
WO (1) WO2016088721A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7010633B2 (ja) * 2017-09-19 2022-01-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6963725B2 (ja) * 2017-10-13 2021-11-10 日本電気硝子株式会社 ガラス板の検査方法及び検査装置並びにガラス板の製造方法
CN108414518A (zh) * 2018-01-30 2018-08-17 珠海格力智能装备有限公司 覆膜机构及工业视觉检测装置
CN111373523B (zh) * 2018-04-11 2023-09-08 株式会社爱发科 基板保持装置、基板保持方法和成膜装置
SG11202107495UA (en) * 2019-02-28 2021-08-30 Yoshino Gypsum Co Ltd Apparatus for inspecting plate-like bodies
WO2020199206A1 (fr) * 2019-04-04 2020-10-08 合刃科技（深圳）有限公司 Système et procédé de détection de défaut microscopique dans un matériau transparent ou semi-transparent

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258231A (ja) * 1991-01-31 1994-09-16 Central Glass Co Ltd 板ガラスの欠点検出装置
JP2004317500A (ja) * 2003-04-03 2004-11-11 Hitachi High-Tech Electronics Engineering Co Ltd 透光性ディスクの周面欠陥検出光学系、周面欠陥検出装置および周面欠陥検出方法
TW201416468A (zh) * 2012-10-18 2014-05-01 Ulvac Inc 成膜裝置
JP6258231B2 (ja) 2012-02-27 2018-01-10 サムスン エレクトロニクス カンパニー リミテッド 各資源の変化に対する制御信号伝送の適応方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07119781B2 (ja) * 1987-01-19 1995-12-20 名古屋電機工業株式会社 実装済プリント基板自動検査装置におけるフラットパッケージのブリッジ検査方法
JPH1030988A (ja) * 1996-07-15 1998-02-03 Hitachi Ltd 自動焦点補正方法及びその装置
JP3422935B2 (ja) * 1997-07-17 2003-07-07 Ｈｏｙａ株式会社 透光性物質の不均一性検査方法及びその装置並びに透明基板の選別方法
JPH11339042A (ja) * 1998-05-26 1999-12-10 Sanko:Kk 基板ウェハー判定装置及び判定方法
US20040196454A1 (en) * 2003-04-03 2004-10-07 Takayuki Ishiguro Optical system, detector and method for detecting peripheral surface defect of translucent disk
DE102009050711A1 (de) * 2009-10-26 2011-05-05 Schott Ag Verfahren und Vorrichtung zur Detektion von Rissen in Halbleitersubstraten
JP4884540B2 (ja) 2010-01-21 2012-02-29 東京エレクトロン株式会社 基板検査装置及び基板検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258231A (ja) * 1991-01-31 1994-09-16 Central Glass Co Ltd 板ガラスの欠点検出装置
JP2004317500A (ja) * 2003-04-03 2004-11-11 Hitachi High-Tech Electronics Engineering Co Ltd 透光性ディスクの周面欠陥検出光学系、周面欠陥検出装置および周面欠陥検出方法
JP6258231B2 (ja) 2012-02-27 2018-01-10 サムスン エレクトロニクス カンパニー リミテッド 各資源の変化に対する制御信号伝送の適応方法
TW201416468A (zh) * 2012-10-18 2014-05-01 Ulvac Inc 成膜裝置

Also Published As

Publication number Publication date
WO2016088721A1 (fr) 2016-06-09
CN107110793A (zh) 2017-08-29
WO2016088721A8 (fr) 2017-06-22
KR101981182B1 (ko) 2019-05-22
CN107110793B (zh) 2021-12-10
JP6483152B2 (ja) 2019-03-13
KR20170093174A (ko) 2017-08-14
JPWO2016088721A1 (ja) 2017-09-14
TW201632876A (zh) 2016-09-16

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