TWI677392B - 標記裝置 - Google Patents

標記裝置 Download PDF

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Publication number
TWI677392B
TWI677392B TW105130653A TW105130653A TWI677392B TW I677392 B TWI677392 B TW I677392B TW 105130653 A TW105130653 A TW 105130653A TW 105130653 A TW105130653 A TW 105130653A TW I677392 B TWI677392 B TW I677392B
Authority
TW
Taiwan
Prior art keywords
drawing pattern
marking
pattern
laser
spot diameter
Prior art date
Application number
TW105130653A
Other languages
English (en)
Chinese (zh)
Other versions
TW201722599A (zh
Inventor
森英治
Eiji Mori
佐橋敬一
Keiichi SAHASHI
北村慎章
Noriaki KITAMURA
梅田英知
Hidetomo UMEDA
Original Assignee
日商東麗工程股份有限公司
Toray Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗工程股份有限公司, Toray Engineering Co., Ltd. filed Critical 日商東麗工程股份有限公司
Publication of TW201722599A publication Critical patent/TW201722599A/zh
Application granted granted Critical
Publication of TWI677392B publication Critical patent/TWI677392B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW105130653A 2015-10-09 2016-09-22 標記裝置 TWI677392B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015200742A JP6608236B2 (ja) 2015-10-09 2015-10-09 マーキング装置
JP2015-200742 2015-10-09

Publications (2)

Publication Number Publication Date
TW201722599A TW201722599A (zh) 2017-07-01
TWI677392B true TWI677392B (zh) 2019-11-21

Family

ID=58487686

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130653A TWI677392B (zh) 2015-10-09 2016-09-22 標記裝置

Country Status (5)

Country Link
JP (1) JP6608236B2 (ja)
KR (1) KR20180063103A (ja)
CN (1) CN108025392B (ja)
TW (1) TWI677392B (ja)
WO (1) WO2017061222A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7119421B2 (ja) * 2018-02-27 2022-08-17 Agc株式会社 識別マーク付きガラス板、およびガラス板の識別マーク形成方法
JP2020007591A (ja) * 2018-07-04 2020-01-16 Dgshape株式会社 加工方法、加工システム及び加工プログラム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116869A (ja) * 1993-10-21 1995-05-09 Nippon Steel Corp レーザ刻印方法
WO2015129316A1 (ja) * 2014-02-27 2015-09-03 東レエンジニアリング株式会社 マーキング装置およびパターン生成装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2577638B2 (ja) * 1989-07-14 1997-02-05 三井東圧化学株式会社 レーザマーキング方法及び装置
JPH04356380A (ja) * 1991-05-24 1992-12-10 Fuji Electric Co Ltd レーザマーキング方法
JP4461740B2 (ja) 2003-08-21 2010-05-12 オムロン株式会社 レーザマーキング装置
JP3872462B2 (ja) 2003-09-01 2007-01-24 住友重機械工業株式会社 レーザ加工装置、及びレーザ加工方法
JP2007025394A (ja) * 2005-07-19 2007-02-01 Fujifilm Holdings Corp パターン形成方法
JP5248205B2 (ja) 2008-05-29 2013-07-31 パナソニック デバイスSunx株式会社 レーザマーキング装置
JP5896459B2 (ja) * 2012-03-06 2016-03-30 東レエンジニアリング株式会社 マーキング装置及び方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116869A (ja) * 1993-10-21 1995-05-09 Nippon Steel Corp レーザ刻印方法
WO2015129316A1 (ja) * 2014-02-27 2015-09-03 東レエンジニアリング株式会社 マーキング装置およびパターン生成装置

Also Published As

Publication number Publication date
CN108025392A (zh) 2018-05-11
WO2017061222A1 (ja) 2017-04-13
JP2017070989A (ja) 2017-04-13
CN108025392B (zh) 2020-03-03
KR20180063103A (ko) 2018-06-11
TW201722599A (zh) 2017-07-01
JP6608236B2 (ja) 2019-11-20

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