TWI670751B - 壓印用的模板製造裝置 - Google Patents

壓印用的模板製造裝置 Download PDF

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Publication number
TWI670751B
TWI670751B TW105110349A TW105110349A TWI670751B TW I670751 B TWI670751 B TW I670751B TW 105110349 A TW105110349 A TW 105110349A TW 105110349 A TW105110349 A TW 105110349A TW I670751 B TWI670751 B TW I670751B
Authority
TW
Taiwan
Prior art keywords
template
liquid
convex portion
support portion
convex
Prior art date
Application number
TW105110349A
Other languages
English (en)
Chinese (zh)
Other versions
TW201703108A (zh
Inventor
中村聡
出村健介
松嶋大輔
幡野正之
柏木宏之
陳康
伊凡 加納齊夫
Original Assignee
日商芝浦機械電子裝置股份有限公司
日商東芝記憶體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司, 日商東芝記憶體股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW201703108A publication Critical patent/TW201703108A/zh
Application granted granted Critical
Publication of TWI670751B publication Critical patent/TWI670751B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW105110349A 2015-03-31 2016-03-31 壓印用的模板製造裝置 TWI670751B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-074109 2015-03-31
JP2015074109 2015-03-31
JP2016-062077 2016-03-25
JP2016062077A JP6532419B2 (ja) 2015-03-31 2016-03-25 インプリント用のテンプレート製造装置

Publications (2)

Publication Number Publication Date
TW201703108A TW201703108A (zh) 2017-01-16
TWI670751B true TWI670751B (zh) 2019-09-01

Family

ID=57323979

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105110349A TWI670751B (zh) 2015-03-31 2016-03-31 壓印用的模板製造裝置

Country Status (5)

Country Link
US (1) US20180016673A1 (enExample)
JP (1) JP6532419B2 (enExample)
KR (1) KR102022074B1 (enExample)
CN (1) CN107735237B (enExample)
TW (1) TWI670751B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6529843B2 (ja) * 2015-07-14 2019-06-12 芝浦メカトロニクス株式会社 インプリント用のテンプレート製造装置及びテンプレート製造方法
CN115257026A (zh) * 2017-10-17 2022-11-01 奇跃公司 用于铸造聚合物产品的方法和装置
US10921706B2 (en) * 2018-06-07 2021-02-16 Canon Kabushiki Kaisha Systems and methods for modifying mesa sidewalls
US10990004B2 (en) 2018-07-18 2021-04-27 Canon Kabushiki Kaisha Photodissociation frame window, systems including a photodissociation frame window, and methods of using a photodissociation frame window
JP7292949B2 (ja) * 2019-04-24 2023-06-19 キヤノン株式会社 インプリント用モールド及びその製造方法、及びインプリント方法
CN114850003B (zh) * 2021-02-03 2023-06-27 芝浦机械电子装置株式会社 加热处理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201038394A (en) * 2009-04-30 2010-11-01 Toshiba Kk Patterning method, patterning apparatus, and method for manufacturing semiconductor device

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Publication number Priority date Publication date Assignee Title
JPS5537517A (en) 1978-09-08 1980-03-15 Hitachi Ltd Driving circuit of compressor motor
JP2008072030A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd プラズマ処理装置、プラズマ処理装置の異常検出方法、及びプラズマ処理方法
JP4874851B2 (ja) * 2007-03-30 2012-02-15 富士フイルム株式会社 真空成膜装置
JP5377053B2 (ja) * 2009-04-17 2013-12-25 株式会社東芝 テンプレート及びその製造方法、並びにパターン形成方法
JP5693941B2 (ja) * 2010-03-31 2015-04-01 株式会社東芝 テンプレートの表面処理方法及び装置並びにパターン形成方法
FI123645B (fi) * 2010-04-20 2013-08-30 Beneq Oy Aerosoliavusteinen kaasukasvatusjärjestelmä
JP5964953B2 (ja) * 2011-05-31 2016-08-03 スリーエム イノベイティブ プロパティズ カンパニー 非連続的なトポグラフィーを有する微細構造化ツールを作成するための方法、及びこれにより製造される物品
JP2012253343A (ja) * 2011-06-02 2012-12-20 Tokyo Ohka Kogyo Co Ltd 基板処理装置及び基板処理方法
JP5630415B2 (ja) * 2011-10-06 2014-11-26 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6303268B2 (ja) * 2013-02-20 2018-04-04 大日本印刷株式会社 インプリントモールド、インプリント方法及び半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201038394A (en) * 2009-04-30 2010-11-01 Toshiba Kk Patterning method, patterning apparatus, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
CN107735237A (zh) 2018-02-23
TW201703108A (zh) 2017-01-16
JP6532419B2 (ja) 2019-06-19
KR20170130557A (ko) 2017-11-28
JP2016195247A (ja) 2016-11-17
KR102022074B1 (ko) 2019-09-18
US20180016673A1 (en) 2018-01-18
CN107735237B (zh) 2019-11-19

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