TWI667779B - 固態成像裝置，固態成像裝置之製造方法及電子設備 - Google Patents

固態成像裝置，固態成像裝置之製造方法及電子設備 Download PDF

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Publication number
TWI667779B
TWI667779B TW104111027A TW104111027A TWI667779B TW I667779 B TWI667779 B TW I667779B TW 104111027 A TW104111027 A TW 104111027A TW 104111027 A TW104111027 A TW 104111027A TW I667779 B TWI667779 B TW I667779B
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TW
Taiwan
Prior art keywords
signal processing
pixel
processing circuit
imaging device
solid
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TW104111027A
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English (en)
Chinese (zh)
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TW201541622A (zh
Inventor
泉原邦彦
Kunihiko Izuhara
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日商新力股份有限公司
Sony Corporation
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Publication of TW201541622A publication Critical patent/TW201541622A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW104111027A 2014-04-21 2015-04-02 固態成像裝置，固態成像裝置之製造方法及電子設備 TWI667779B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-087603 2014-04-21
JP2014087603 2014-04-21
JP2014-129952 2014-06-25
JP2014129952A JP6245474B2 (ja) 2014-04-21 2014-06-25 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器

Publications (2)

Publication Number Publication Date
TW201541622A TW201541622A (zh) 2015-11-01
TWI667779B true TWI667779B (zh) 2019-08-01

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Country Status (7)

Country Link
US (4) US10217785B2 (https=)
EP (2) EP3134918B1 (https=)
JP (1) JP6245474B2 (https=)
KR (5) KR102807159B1 (https=)
CN (2) CN110957339B (https=)
TW (1) TWI667779B (https=)
WO (1) WO2015162867A1 (https=)

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Also Published As

Publication number Publication date
US10811454B2 (en) 2020-10-20
KR102383181B1 (ko) 2022-04-06
US10217785B2 (en) 2019-02-26
KR102506010B1 (ko) 2023-03-06
US20200403020A1 (en) 2020-12-24
CN110957339A (zh) 2020-04-03
KR102807159B1 (ko) 2025-05-14
CN110957339B (zh) 2024-02-13
CN105940493A (zh) 2016-09-14
EP3565001A1 (en) 2019-11-06
WO2015162867A1 (en) 2015-10-29
JP2015216334A (ja) 2015-12-03
US20170040371A1 (en) 2017-02-09
TW201541622A (zh) 2015-11-01
KR102678404B1 (ko) 2024-06-27
EP3134918B1 (en) 2019-06-19
CN105940493B (zh) 2019-12-17
KR20230035463A (ko) 2023-03-13
KR20160145577A (ko) 2016-12-20
JP6245474B2 (ja) 2017-12-13
KR20250069695A (ko) 2025-05-19
US12046619B2 (en) 2024-07-23
US20190189666A1 (en) 2019-06-20
KR20240100469A (ko) 2024-07-01
KR20220042251A (ko) 2022-04-04
US20240332336A1 (en) 2024-10-03
EP3134918A1 (en) 2017-03-01
EP3565001B1 (en) 2022-07-20

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