TWI667735B - 具有遮罩邊緣的支撐環 - Google Patents

具有遮罩邊緣的支撐環 Download PDF

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Publication number
TWI667735B
TWI667735B TW106118280A TW106118280A TWI667735B TW I667735 B TWI667735 B TW I667735B TW 106118280 A TW106118280 A TW 106118280A TW 106118280 A TW106118280 A TW 106118280A TW I667735 B TWI667735 B TW I667735B
Authority
TW
Taiwan
Prior art keywords
support ring
coating
tapered
thickness
annular body
Prior art date
Application number
TW106118280A
Other languages
English (en)
Chinese (zh)
Other versions
TW201737409A (zh
Inventor
比傑鎂瑞
譚諾曼Ｌ
杭特亞倫穆依爾
拉尼許喬瑟夫Ｍ
中西孝之
中川敏行
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201737409A publication Critical patent/TW201737409A/zh
Application granted granted Critical
Publication of TWI667735B publication Critical patent/TWI667735B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Semiconductors (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
TW106118280A 2013-12-31 2014-12-31 具有遮罩邊緣的支撐環 TWI667735B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361922451P 2013-12-31 2013-12-31
US61/922,451 2013-12-31
US14/218,597 2014-03-18
US14/218,597 US9330955B2 (en) 2013-12-31 2014-03-18 Support ring with masked edge

Publications (2)

Publication Number Publication Date
TW201737409A TW201737409A (zh) 2017-10-16
TWI667735B true TWI667735B (zh) 2019-08-01

Family

ID=53482656

Family Applications (3)

Application Number Title Priority Date Filing Date
TW106118280A TWI667735B (zh) 2013-12-31 2014-12-31 具有遮罩邊緣的支撐環
TW105121783A TWI594361B (zh) 2013-12-31 2014-12-31 具有遮罩邊緣的支撐環
TW103146598A TWI578437B (zh) 2013-12-31 2014-12-31 具有遮罩邊緣的支撐環

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW105121783A TWI594361B (zh) 2013-12-31 2014-12-31 具有遮罩邊緣的支撐環
TW103146598A TWI578437B (zh) 2013-12-31 2014-12-31 具有遮罩邊緣的支撐環

Country Status (6)

Country Link
US (4) US9330955B2 (enExample)
JP (2) JP6408606B2 (enExample)
KR (3) KR102424719B1 (enExample)
CN (2) CN110223949B (enExample)
TW (3) TWI667735B (enExample)
WO (1) WO2015102781A1 (enExample)

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MX349112B (es) * 2011-05-13 2017-07-12 Dow Global Technologies Llc Formulaciones de aislamiento.
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge
WO2018187679A1 (en) 2017-04-07 2018-10-11 Applied Materials, Inc. Plasma density control on substrate edge
CN107121892B (zh) * 2017-04-26 2018-12-28 武汉华星光电技术有限公司 一种基板曝边设备
KR102723235B1 (ko) * 2018-03-13 2024-10-31 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 분무 코팅을 갖는 지지 링
CN110920254B (zh) 2018-09-19 2021-03-16 精工爱普生株式会社 打印头控制电路及液体喷出装置
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
US20250305141A1 (en) * 2024-03-27 2025-10-02 Applied Materials, Inc. Multi-section substrate supports and related methods, process kits, and processing chambers for semiconductor manufacturing
KR102944097B1 (ko) * 2024-09-23 2026-03-27 주식회사 비아트론 웨이퍼 지지용 에지링
KR20260104246A (ko) * 2024-12-26 2026-07-06 주식회사 비아트론 웨이퍼 지지용 에지링

Citations (2)

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TWM410975U (en) * 2009-12-01 2011-09-01 Lam Res Corp Component of edge ring assembly used in plasma etching chamber

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Publication number Priority date Publication date Assignee Title
US6280183B1 (en) * 1998-04-01 2001-08-28 Applied Materials, Inc. Substrate support for a thermal processing chamber
TWM410975U (en) * 2009-12-01 2011-09-01 Lam Res Corp Component of edge ring assembly used in plasma etching chamber

Also Published As

Publication number Publication date
TW201639073A (zh) 2016-11-01
US20180315639A1 (en) 2018-11-01
JP6758353B2 (ja) 2020-09-23
JP2019036736A (ja) 2019-03-07
US10056286B2 (en) 2018-08-21
CN110223949B (zh) 2023-03-21
CN105830207A (zh) 2016-08-03
TWI578437B (zh) 2017-04-11
JP6408606B2 (ja) 2018-10-17
US9842759B2 (en) 2017-12-12
JP2017508303A (ja) 2017-03-23
TW201532183A (zh) 2015-08-16
WO2015102781A1 (en) 2015-07-09
CN110223949A (zh) 2019-09-10
KR102279150B1 (ko) 2021-07-19
KR20220107084A (ko) 2022-08-01
US20180102274A1 (en) 2018-04-12
US20150187630A1 (en) 2015-07-02
US10373859B2 (en) 2019-08-06
US9330955B2 (en) 2016-05-03
KR102424719B1 (ko) 2022-07-25
TW201737409A (zh) 2017-10-16
KR20160103128A (ko) 2016-08-31
KR20210091360A (ko) 2021-07-21
US20160247708A1 (en) 2016-08-25
TWI594361B (zh) 2017-08-01
KR102569159B1 (ko) 2023-08-23
CN105830207B (zh) 2019-05-31

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