TWI666083B - 貫通孔形成方法、貫通孔形成裝置及具有貫通孔之玻璃基板之製造方法 - Google Patents

貫通孔形成方法、貫通孔形成裝置及具有貫通孔之玻璃基板之製造方法 Download PDF

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Publication number
TWI666083B
TWI666083B TW104141958A TW104141958A TWI666083B TW I666083 B TWI666083 B TW I666083B TW 104141958 A TW104141958 A TW 104141958A TW 104141958 A TW104141958 A TW 104141958A TW I666083 B TWI666083 B TW I666083B
Authority
TW
Taiwan
Prior art keywords
hole
laser light
condenser lens
glass substrate
forming
Prior art date
Application number
TW104141958A
Other languages
English (en)
Chinese (zh)
Other versions
TW201628755A (zh
Inventor
小野元司
Original Assignee
日商Ａｇｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW201628755A publication Critical patent/TW201628755A/zh
Application granted granted Critical
Publication of TWI666083B publication Critical patent/TWI666083B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/013—Arc cutting, gouging, scarfing or desurfacing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B26F1/28—Perforating by non-mechanical means, e.g. by fluid jet by electrical discharges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Lasers (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
TW104141958A 2014-12-16 2015-12-14 貫通孔形成方法、貫通孔形成裝置及具有貫通孔之玻璃基板之製造方法 TWI666083B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-254424 2014-12-16
JP2014254424 2014-12-16

Publications (2)

Publication Number Publication Date
TW201628755A TW201628755A (zh) 2016-08-16
TWI666083B true TWI666083B (zh) 2019-07-21

Family

ID=56110485

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104141958A TWI666083B (zh) 2014-12-16 2015-12-14 貫通孔形成方法、貫通孔形成裝置及具有貫通孔之玻璃基板之製造方法

Country Status (3)

Country Link
US (2) US10201867B2 (enExample)
JP (2) JP6104354B2 (enExample)
TW (1) TWI666083B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10668561B2 (en) * 2016-11-15 2020-06-02 Coherent, Inc. Laser apparatus for cutting brittle material
US10531566B2 (en) * 2017-07-11 2020-01-07 AGC Inc. Glass substrate
JP2019147166A (ja) * 2018-02-27 2019-09-05 株式会社リコー 光加工装置及び光加工物の生産方法
US10470300B1 (en) * 2018-07-24 2019-11-05 AGC Inc. Glass panel for wiring board and method of manufacturing wiring board
US11344972B2 (en) * 2019-02-11 2022-05-31 Corning Incorporated Laser processing of workpieces
EP4055426B1 (en) * 2019-11-08 2025-04-09 Mosaic Microsystems LLC Facilitating formation of a via in a substrate
KR20220019158A (ko) 2020-08-06 2022-02-16 삼성디스플레이 주식회사 윈도우 및 이를 포함하는 표시장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005503266A (ja) * 2001-09-24 2005-02-03 ザ テクノロジー パートナーシップ ピーエルシー レーザ穿孔及び続く電気研磨ステップによる有孔膜の形成
JP2008284579A (ja) * 2007-05-16 2008-11-27 Fuji Xerox Co Ltd 液滴吐出ヘッドの製造方法、および液滴吐出ヘッド
JP2014226710A (ja) * 2013-05-24 2014-12-08 旭硝子株式会社 放電補助式レーザ孔加工方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05330064A (ja) 1992-05-29 1993-12-14 Ricoh Co Ltd ノズル板の成形方法
JP3118203B2 (ja) 1997-03-27 2000-12-18 住友重機械工業株式会社 レーザ加工方法
JP2001269789A (ja) 2000-01-20 2001-10-02 Komatsu Ltd レーザ加工装置
JP3797068B2 (ja) 2000-07-10 2006-07-12 セイコーエプソン株式会社 レーザによる微細加工方法
US6875951B2 (en) * 2000-08-29 2005-04-05 Mitsubishi Denki Kabushiki Kaisha Laser machining device
AU2002223490A1 (en) * 2000-11-13 2002-05-21 Micmacmo Aps Laser ablation
US20050155956A1 (en) * 2002-08-30 2005-07-21 Sumitomo Heavy Industries, Ltd. Laser processing method and processing device
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
US20050064137A1 (en) * 2003-01-29 2005-03-24 Hunt Alan J. Method for forming nanoscale features and structures produced thereby
JP5071868B2 (ja) * 2008-08-11 2012-11-14 オムロン株式会社 レーザ加工方法、レーザ加工装置、光学素子の製造方法、および光学素子
JP2011177735A (ja) 2010-02-26 2011-09-15 Agt:Kk レーザー穴開け加工方法
JP5905899B2 (ja) 2010-11-30 2016-04-20 コーニング インコーポレイテッド ガラスに孔の高密度アレイを形成する方法
JP5805008B2 (ja) 2012-05-21 2015-11-04 三菱電機株式会社 ガラス微細穴加工用レーザ加工機及びガラス微細穴加工方法
CN105102177B (zh) * 2013-04-04 2018-02-27 Lpkf激光电子股份公司 在基板上引入穿孔的方法和装置以及以这种方式制造的基板
JP2014213338A (ja) * 2013-04-24 2014-11-17 旭硝子株式会社 レーザ光照射によりガラス基板に貫通孔を形成する方法
JP5447899B2 (ja) * 2013-04-24 2014-03-19 日本電気株式会社 キャパシタ構造体の製造方法
JP6262039B2 (ja) * 2014-03-17 2018-01-17 株式会社ディスコ 板状物の加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005503266A (ja) * 2001-09-24 2005-02-03 ザ テクノロジー パートナーシップ ピーエルシー レーザ穿孔及び続く電気研磨ステップによる有孔膜の形成
JP2008284579A (ja) * 2007-05-16 2008-11-27 Fuji Xerox Co Ltd 液滴吐出ヘッドの製造方法、および液滴吐出ヘッド
JP2014226710A (ja) * 2013-05-24 2014-12-08 旭硝子株式会社 放電補助式レーザ孔加工方法

Also Published As

Publication number Publication date
US10201867B2 (en) 2019-02-12
TW201628755A (zh) 2016-08-16
US20190118281A1 (en) 2019-04-25
JP6104354B2 (ja) 2017-03-29
JP6699595B2 (ja) 2020-05-27
JP2017128505A (ja) 2017-07-27
JP2016113358A (ja) 2016-06-23
US20160168006A1 (en) 2016-06-16

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