US20190118281A1 - Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole - Google Patents
Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole Download PDFInfo
- Publication number
- US20190118281A1 US20190118281A1 US16/227,658 US201816227658A US2019118281A1 US 20190118281 A1 US20190118281 A1 US 20190118281A1 US 201816227658 A US201816227658 A US 201816227658A US 2019118281 A1 US2019118281 A1 US 2019118281A1
- Authority
- US
- United States
- Prior art keywords
- hole
- glass substrate
- electrode
- laser beam
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/013—Arc cutting, gouging, scarfing or desurfacing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
- B26F1/28—Perforating by non-mechanical means, e.g. by fluid jet by electrical discharges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Definitions
- the present invention relates to a through-hole forming method, a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole.
- a through-hole forming method has been known such that, by irradiating a laser beam onto a glass substrate, a through-hole can be formed that passes through the glass substrate in a thickness direction of the substrate (cf. Patent Document 1, for example).
- Patent Document 1 PCT Japanese Translation Patent Publication No. 2014-501686
- a shape of the formed through-hole may be significantly deviated from a target shape.
- the present invention has been developed in view of the above-described point. There is a need for a through-hole forming method, a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole that can suppress collapse in a shape of a through-hole (e.g., a protrusion or a narrow part).
- a through-hole forming method e.g., a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole that can suppress collapse in a shape of a through-hole (e.g., a protrusion or a narrow part).
- a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate, wherein a medium between the lens and the insulation substrate is air, and wherein a converging half angle ⁇ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
- a through-hole forming apparatus configured to form a through-hole that passes through an insulation substrate in a thickness direction of the insulation substrate by condensing and irradiating a laser beam onto the insulation substrate through a lens
- the through-hole forming apparatus including a laser source configured to emit the laser beam; and an optical system configured to condense the laser beam from the laser source and configured to irradiate the condensed laser beam onto the insulation substrate, wherein the optical system includes the lens, wherein a medium between the lens and the insulation substrate is air, and wherein a converging half angle ⁇ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
- a method of manufacturing a glass substrate provided with a through-hole including a process of forming, by condensing and irradiating a laser beam onto a glass substrate through a lens, a through-hole that passes through the glass substrate in a thickness direction of the glass substrate, wherein a medium between the lens and the glass substrate is air, and wherein a converging half angle ⁇ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
- a through-hole forming method, a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole can be provided that can suppress collapse in a shape of the through-hole.
- FIG. 1 is a diagram showing a through-hole forming apparatus according to an embodiment of the present invention
- FIG. 2 is a diagram showing a vertical cross-section of a through-hole according to the embodiment of the present invention
- FIG. 3 is a diagram showing a shape of a through-hole according to the embodiment when sin ⁇ is in a range from 0.16 to 0.22;
- FIG. 4 is a diagram showing a shape of a through-hole according to a first comparative example when sin ⁇ is greater than 0.22;
- FIG. 5 is a diagram showing a shape of a through-hole according to a second comparative example when sin ⁇ is less than 0.16;
- FIG. 6 is a diagram showing a through-hole forming apparatus according to another embodiment of the present invention.
- FIG. 7 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 1;
- FIG. 8 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 2;
- FIG. 9 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 3;
- FIG. 10 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 4;
- FIG. 11 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 5;
- FIG. 12 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 6;
- FIG. 13 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 7;
- FIG. 14 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 8;
- FIG. 15 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 9;
- FIG. 16 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 10;
- FIG. 17 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 11;
- FIG. 18 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 12.
- a range from x to y is defined to be a numerical range that is greater than or equal to x and less than or equal to y (i.e., the numerical values “x” and “y” are included in the “range from x to y”).
- FIG. 1 is a diagram showing a through-hole forming apparatus 10 according to an embodiment of the present invention.
- the through-hole forming apparatus 10 may include a stage 12 ; a laser source 20 ; an optical system 30 , and so forth.
- the stage 12 can hold an insulation substrate 2 .
- the insulation substrate 2 can be a glass substrate, for example.
- the glass substrate may be a glass substrate in which various types of functional films are formed, or a glass substrate on which a resin film or the like is laminated. Thickness of the glass substrate may be in a range from 0.05 mm to 0.7 mm, for example.
- the stage 12 can fix the insulation substrate 2 by suction. Alternatively, the stage 12 may fix the insulation substrate by adhesion.
- the suction may be vacuum suction or electrostatic suction, for example.
- the stage 12 may have a function to move the insulation substrate 2 in a horizontal direction.
- the stage 12 may be formed of an XY stage, for example.
- the laser source 20 may be disposed at an opposite side of the stage 12 with respect to the insulation substrate 2 .
- the laser source 20 can emit a laser beam 22 .
- a carbon dioxide laser may be preferable.
- a cost for the device can be less expensive, and machining time for forming one through hole can be short.
- an inner wall of a through hole to be formed can be smoother.
- a YAG laser and so forth can be used as the laser source 20 .
- the optical system 30 can condense and irradiate the laser beam 22 from the laser source 20 onto the insulation substrate 2 that is held by the stage 12 .
- the laser beam 22 may perpendicularly enter the insulation substrate 2 .
- the optical system 30 may include, for example, a waveplate (retarder) 32 ; an aperture 34 ; a lens 36 , and so forth.
- the waveplate 32 can convert polarization of the laser beam 22 from linear polarization into circular polarization.
- the waveplate 32 may be formed of a quarter waveplate, for example.
- the waveplate 32 may be disposed between the laser source 20 and the aperture 34 , for example.
- a cross-sectional shape of a through-hole 4 becomes more symmetric compared with a case in which the linearly polarized laser beam 22 is irradiated onto the insulation substrate 2 .
- the waveplate 32 may be omitted.
- the optical system 30 may condense the linearly polarized laser beam 22 , and the optical system 30 may irradiate the condensed linearly polarized laser beam 22 onto the insulation substrate 2 .
- the aperture 34 may have a small circular opening 34 a that is smaller than a cross-section of the laser beam 22 .
- the aperture 34 can enhance circularity of the cross-section of the laser beam 22 by blocking a peripheral portion of the cross-section of the laser beam 22 .
- the aperture 34 can vary a converging half angle 9 by varying a diameter of an incident beam of the laser beam 22 with respect to the lens 36 .
- the aperture 34 may be disposed between the waveplate 32 and the lens 36 , so that the aperture 34 can adjust the cross-sectional shape of the laser beam 22 and/or the converging half angle ⁇ , prior to the laser beam 22 entering the lens 36 . Note that the aperture 34 can be omitted as long as the laser beam 22 that enters the lens 36 is collimating light having a circular cross-section.
- the lens 36 can condense the laser beam 22 , and the condensed laser beam 22 can be irradiated from the lens 36 onto the insulation substrate 2 that is held by the stage 12 .
- a focal point 36 a of the lens 36 can be placed on a to-be-irradiated surface 2 a (which may also be referred to as a laser irradiated surface 2 a ) of the insulation substrate 2 , for example.
- the to-be-irradiated surface 2 a is to be irradiated by the laser beam 22 .
- the focal point 36 a may be placed in the vicinity of the to-be-irradiated surface 2 a .
- the focal point 36 a of the lens 36 may be placed at a side of the laser source 20 or at a side that is opposite to the laser source 20 , with respect to the laser irradiated surface 2 a of the insulation substrate 2 .
- a distance between the focal point 36 a of the lens 36 and the laser irradiated surface 2 a of the insulation substrate 2 in a direction that is perpendicular to the laser irradiated surface 2 a may be less than or equal to 0.1 mm.
- the insulation substrate 2 By condensing the laser beam 22 and irradiating the condensed laser beam 22 onto the insulation substrate 2 , the insulation substrate 2 can be locally heated, and the heated portion can be removed. In this manner, the through-hole 4 can be formed.
- the lens 36 can be disposed between the aperture 34 and the stage 12 , for example.
- a beam expander may be disposed between the laser source 20 and the waveplate 32 .
- the through-hole forming method may include a process of forming the through-hole 4 that passes through the insulation substrate 2 in the thickness direction of the insulation substrate 2 by condensing the laser beam 22 by the lens 36 and by irradiating the condensed laser beam 22 onto the insulation substrate 2 from the lens 36 .
- the insulation substrate 2 may be locally heated by irradiating the condensed laser beam 22 , and the heated portion may be removed. In this manner, the through-hole 4 can be formed.
- the relative position, in the horizontal direction, of the stage 12 may be changed with respect to the laser source 20 and the optical system 30 , and another through-hole 4 may be formed. In this manner, more than one through-holes 4 can be formed in the insulation substrate 2 .
- either the laser source 20 and the optical system 30 or the stage 12 may be moved.
- both the laser source 20 and the optical system 30 , and the stage 12 may be moved.
- FIG. 2 is a diagram showing a vertical cross-section of the through-hole 4 according to the embodiment of the present invention.
- the dashed line shows a target shape of the through-hole 4 . Note that, in FIG. 2 , a deviation of the shape of the through-hole 4 from the target shape is exaggerated.
- the insulation substrate 2 is provided with the through-hole 4 that passes through the insulation substrate 2 in the thickness direction of the insulation substrate 2 .
- the through-hole 4 may include a first orifice 4 a that is formed at the laser irradiated surface 2 a of the insulation substrate 2 ; and a second orifice 4 b that is formed at a surface 2 b (which may also be referred to as the opposite surface 2 b , hereinafter) that is opposite to the laser irradiated surface 2 a of the insulation substrate 2 .
- the through-hole 4 can be formed by digging the hole from the laser irradiated surface 2 a toward the opposite surface 2 b .
- a hole that is to be a through-hole may be referred to as a bottomed hole (a hole with a bottom).
- the laser beam 22 that is irradiated onto the insulation substrate 2 can be roughly classified into the laser beam 22 that can reach a bottom of the bottomed hole and the laser beam 22 that may be absorbed by a side surface of the bottomed hole and that may not reach the bottom of the bottomed hole.
- the through-hole 4 can be formed such that a shape the through-hole 4 depends on strength balance of the laser beam 22 .
- a proportion of the laser beam 22 b that is absorbed in the vicinity of the entrance may be large. Consequently, removal of the glass tends to progress in the vicinity of the entrance, so that the first orifice 4 a can be greater than the second orifice 4 b . In other words, the second orifice 4 b can be smaller than the first orifice 4 a.
- a truncated cone 6 whose side surface includes the first orifice 4 a and the second orifice 4 b can be a target shape.
- the medium between the lens 36 and the insulation substrate 2 is air and that the converging half angle is ⁇ (cf. FIG. 1 )
- the deviation from the target shape (which may also be referred to as “collapse 1 n a shape,” hereinafter) can correspond to sin ⁇ .
- the converging half angle 9 can be calculated from the expression (1), which is described below.
- d is a diameter of the incident beam of the laser beam 22 with respect to the lens 36
- f is a focal length of the lens 36 .
- sin ⁇ may correspond to the converging half angle of the laser beam 22 .
- FIG. 3 is a diagram showing a shape of the through-hole 4 according to the embodiment for a case in which sin ⁇ is in a range from 0.16 to 0.22.
- FIG. 4 is a diagram showing a shape of a through-hole according to a first comparative example for a case in which sin ⁇ is greater than 0.22.
- FIG. 5 is a diagram showing a shape of a through-hole according to a second comparative example for a case in which sin ⁇ is less than 0.16.
- sin ⁇ is greater than 0.22.
- the converging half angle may be too large, and a spread of a condensed laser beam 22 A may be too large. Consequently, a proportion of the laser beam 22 A that is absorbed in the side surface of the bottomed hole may be too large, and a through-hole 4 A may have a barrel shape that expands in the vicinity of the center of the insulation substrate 2 in the thickness direction of the insulation substrate 2 .
- absorption of a laser beam by glass is large, compared to that of the YAG laser. Consequently, for a carbon dioxide laser, a rate of the laser beam 22 A that is absorbed in the side surface of the bottomed hole tends to be greater, and the collapse in the shape tends to be significant.
- sin ⁇ is less than 0.16.
- a beam diameter (which may also be referred to as a spot diameter of the laser beam 22 B) of the laser beam 22 B at a focal point may be too large, and a first orifice that can be formed at a laser irradiated surface of an insulation substrate 2 B may be too large.
- a focal depth may be too large.
- the laser beam 22 B tends to reach a bottom of the bottomed hole, and the proportion of the laser beam 22 B that can be absorbed in the bottom of the bottomed hole may be too large. Consequently, expansion of the hole diameter of the bottom of the bottomed hole tends to progress, and the through-hole 4 B may have a barrel shape.
- sin ⁇ is in a range from 0.16 to 0.22.
- the converging half angle ⁇ satisfies the following expression (2):
- the intensity of the laser beam 22 that reaches the bottom of the bottomed hole and the intensity of the laser beam 22 that is absorbed in the side surface of the bottomed hole and that does not reach the bottom surface of the bottomed hole are well-balanced.
- the shape of the through-hole 4 can be close to a linearly tapered shape, which is the target shape. Thus, the collapse in the shape of the through-hole 4 can be suppressed. In this manner, a ratio ( ⁇ 1 / ⁇ 2 ) between the diameter of the through-hole ( ⁇ 1 ) and the diameter of the truncated cone 6 ( ⁇ 2 ) at any position of the through-hole 4 in the thickness direction of the insulation substrate 2 can be regulated to be within a range from 0.7 to 1.1.
- sin ⁇ can preferably be in a range from 0.17 to 0.21, and sin ⁇ can be more preferably in a range from 0.18 to 0.20.
- a carbon dioxide laser is used such that absorption of the laser beam in the glass is large and a rate of absorption of the laser beam in the side surface of the bottomed hole tends to be large, if the above-described expression (2) is satisfied, an effect of suppressing the collapse in the shape can be significant.
- a through electrode can be formed such that the through-hole 4 has a shape that is close to a linearly tapered shape, and the through electrode has fewer defects.
- a base layer of the plating can be uniformly formed on a side surface of the through-hole 4 .
- the base layer of the plating can be formed by a sputtering method, for example.
- a through electrode can be formed in which the growth of the plating can be uniform and which has fewer defects because the base layer of the plating can be uniformly formed. Additionally, for a case of forming a through electrode by an electrically conductive paste, filling shortage and filling unevenness of the electrically conductive paste can be suppressed. Thus, a through electrode having fewer defects can be formed.
- the insulation substrate 2 having a through electrode can be used as an interposer.
- FIG. 6 is a diagram showing the through-hole forming apparatus according to another embodiment of the present invention.
- the through-hole forming apparatus according to this embodiment is different from the through-hole forming apparatus according to the above-described embodiment in a point that the through-hole forming apparatus according to this embodiment may include a machining unit 50 for electrical discharge machining to form the through-hole 4 .
- the point of difference is mainly described.
- the machining unit 50 can correct the shape of the through-hole 4 by applying electrical discharge machining to the through-hole 4 that may be obtained by laser processing.
- the ratio ( ⁇ 1 / ⁇ 2 ) at any position of the through-hole 4 in the thickness direction of the insulation substrate 2 can be adjusted to be within a range from 0.8 to 1.1 because a locally narrow part and so forth of the through-hole 4 can be removed.
- the machining unit 50 may include the stage 12 as a first electrode; a second electrode 52 ; and a direct current (DC) high-voltage power supply 54 .
- DC direct current
- the second electrode 52 can be formed to have a needle shape. An infinitesimal gap may be formed between the second electrode 52 and the insulation substrate 2 that is held by the stage 12 .
- the second electrode 52 can be disposed outside the path of the laser beam 22 , so that the second electrode 52 can avoid blocking the laser beam 22 .
- the DC current high-voltage power supply 54 can apply a direct-current voltage between the stage 12 and the second electrode 52 so as to cause an electric discharge in the through-hole 4 .
- the machining unit 50 may include the stage 12 as the first electrode.
- the machining unit 50 may include a first electrode that is different from the stage 12 .
- the first electrode may have a needle shape, similar to the second electrode 52 .
- the through-hole forming method may include a process of applying electrical discharge machining to the through-hole 4 by applying a DC voltage between the stage 12 and the second electrode 52 so as to cause an electric discharge in the through-hole 4 .
- a time period for waiting from the completion of laser processing until start of the electrical discharge machining can be less than or equal to 100 ⁇ s.
- a relative position, in the horizontal direction, between the stage 12 and the laser source 20 , the optical system 30 , and the second electrode 52 can be changed, and laser processing and electrical discharge machining can be executed again. In this manner, more than one through-holes 4 can be formed in the insulation substrate 2 .
- either the stage 12 or the laser source 20 , the optical system 30 , and the second electrode 52 may be moved.
- both the stage 12 and the laser source 20 , the optical system 30 , and the second electrode 52 may be moved.
- Test Examples 1 to 12 are described.
- the Test Examples 2 to 4 and 7 to 10 are according to the embodiment, and the Test Examples 1, 5, 6, 11, and 12 are according to the comparative example.
- An alkali-free glass substrate having a thickness of 0.4 mm was used as the glass substrate.
- a carbon dioxide laser was used as the laser source 20 .
- the output power of the laser source 20 was set to 100 W.
- the laser beam 22 was irradiated onto the glass substrate so that the laser beam 22 was focused on the laser irradiated surface 2 a of the glass substrate by the lens 36 having a focal length f of 25 mm.
- the medium between the lens 36 and the glass substrate was air.
- the table 1 and FIGS. 7 to 11 show the results of the experiments.
- the dark portions are the through-holes 4 .
- the ratio ( ⁇ 1 / ⁇ 2 ) was within a range from 0.7 to 1.1 because sin ⁇ was in a range from 0.16 to 0.22, and consequently the through-holes 4 having the shapes that were close to the target shape could be formed.
- the value of sin ⁇ was out of the range from 0.16 to 0.22, and the collapse in the shapes was significant.
- An alkali-free glass substrate having a thickness of 0.4 mm was used as the glass substrate.
- a carbon dioxide laser was used as the laser source 20 .
- the output power of the laser source 20 was set to 80 W.
- the laser beam 22 was irradiated onto the glass substrate so that the laser beam 22 was focused on the laser irradiated surface 2 a of the glass substrate by the lens 36 having a focal length f of 25 mm.
- the medium between the lens 36 and the glass substrate was air.
- the table 2 and FIGS. 12 to 18 show the results of the experiments.
- the dark portions are the through-holes 4 .
- the ratio ( ⁇ 1 / ⁇ 2 ) was within a range from 0.8 to 1.1 because sin ⁇ was in a range from 0.16 to 0.22, and consequently the through-holes 4 having the shapes that were close to the target shape could be formed.
- the value of sin ⁇ was out of the range from 0.16 to 0.22, and the collapse in the shapes was significant.
- the through-hole forming method, the through-hole forming apparatus, and the method of manufacturing a glass substrate provided with a through-hole are explained above by the embodiment.
- the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the gist that is described in the scope of the claims.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Lasers (AREA)
- Chemical & Material Sciences (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
Abstract
Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
(d/2)/f=tan θ (1), and
0.16≤sin θ≤0.22 (2).
Description
- The present application is based on and claims the benefit of priority of Japanese Priority Application No. 2014-254424 filed on Dec. 16, 2014, the entire contents of which are hereby incorporated by reference.
- The present invention relates to a through-hole forming method, a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole.
- A through-hole forming method has been known such that, by irradiating a laser beam onto a glass substrate, a through-hole can be formed that passes through the glass substrate in a thickness direction of the substrate (cf.
Patent Document 1, for example). - [Patent Document 1] PCT Japanese Translation Patent Publication No. 2014-501686
- For a case of forming a through-hole by irradiating a laser beam, a shape of the formed through-hole may be significantly deviated from a target shape.
- The present invention has been developed in view of the above-described point. There is a need for a through-hole forming method, a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole that can suppress collapse in a shape of a through-hole (e.g., a protrusion or a narrow part).
- According to an aspect of the present invention, there is provided a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate, wherein a medium between the lens and the insulation substrate is air, and wherein a converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
-
(d/2)/f=tan θ (1), and -
0.16≤sin θ≤0.22 (2). - According to another aspect of the present invention, there is provided a through-hole forming apparatus configured to form a through-hole that passes through an insulation substrate in a thickness direction of the insulation substrate by condensing and irradiating a laser beam onto the insulation substrate through a lens, the through-hole forming apparatus including a laser source configured to emit the laser beam; and an optical system configured to condense the laser beam from the laser source and configured to irradiate the condensed laser beam onto the insulation substrate, wherein the optical system includes the lens, wherein a medium between the lens and the insulation substrate is air, and wherein a converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
-
(d/2)/f=tan θ (1), and -
0.16≤sin θ≤0.22 (2). - According to another aspect of the present invention, there is provided a method of manufacturing a glass substrate provided with a through-hole, the method including a process of forming, by condensing and irradiating a laser beam onto a glass substrate through a lens, a through-hole that passes through the glass substrate in a thickness direction of the glass substrate, wherein a medium between the lens and the glass substrate is air, and wherein a converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):
-
(d/2)/f=tan θ (1), and -
0.16≤sin θ≤0.22 (2). - According to the embodiment of the present invention, a through-hole forming method, a through-hole forming apparatus, and a method of manufacturing a glass substrate provided with a through-hole can be provided that can suppress collapse in a shape of the through-hole.
- Other objects, features and advantages of the present invention will become more apparent from the following detailed description when read in conjunction with the accompanying drawings.
-
FIG. 1 is a diagram showing a through-hole forming apparatus according to an embodiment of the present invention; -
FIG. 2 is a diagram showing a vertical cross-section of a through-hole according to the embodiment of the present invention; -
FIG. 3 is a diagram showing a shape of a through-hole according to the embodiment when sin θ is in a range from 0.16 to 0.22; -
FIG. 4 is a diagram showing a shape of a through-hole according to a first comparative example when sin θ is greater than 0.22; -
FIG. 5 is a diagram showing a shape of a through-hole according to a second comparative example when sin θ is less than 0.16; -
FIG. 6 is a diagram showing a through-hole forming apparatus according to another embodiment of the present invention; -
FIG. 7 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 1; -
FIG. 8 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 2; -
FIG. 9 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 3; -
FIG. 10 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 4; -
FIG. 11 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 5; -
FIG. 12 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 6; -
FIG. 13 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 7; -
FIG. 14 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 8; -
FIG. 15 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 9; -
FIG. 16 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 10; -
FIG. 17 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 11; and -
FIG. 18 is a diagram showing a photograph of a vertical cross-section of a typical through-hole that is obtained in Test Example 12. - Hereinafter, an embodiment of the present invention is described by referring to the accompanying drawings. In the figures, like reference numerals may be attached to similar components, and thereby duplicate description may be omitted. In the following description, “a range from x to y” is defined to be a numerical range that is greater than or equal to x and less than or equal to y (i.e., the numerical values “x” and “y” are included in the “range from x to y”).
-
FIG. 1 is a diagram showing a through-hole forming apparatus 10 according to an embodiment of the present invention. As shown inFIG. 1 , the through-hole forming apparatus 10 may include astage 12; alaser source 20; anoptical system 30, and so forth. - The
stage 12 can hold aninsulation substrate 2. Theinsulation substrate 2 can be a glass substrate, for example. The glass substrate may be a glass substrate in which various types of functional films are formed, or a glass substrate on which a resin film or the like is laminated. Thickness of the glass substrate may be in a range from 0.05 mm to 0.7 mm, for example. Thestage 12 can fix theinsulation substrate 2 by suction. Alternatively, thestage 12 may fix the insulation substrate by adhesion. The suction may be vacuum suction or electrostatic suction, for example. Thestage 12 may have a function to move theinsulation substrate 2 in a horizontal direction. Thestage 12 may be formed of an XY stage, for example. - The
laser source 20 may be disposed at an opposite side of thestage 12 with respect to theinsulation substrate 2. Thelaser source 20 can emit alaser beam 22. As thelaser source 20, a carbon dioxide laser may be preferable. For a carbon dioxide laser, a cost for the device can be less expensive, and machining time for forming one through hole can be short. Additionally, because of the thermal process, for drilling with a carbon dioxide laser, an inner wall of a through hole to be formed can be smoother. In addition, as thelaser source 20, a YAG laser and so forth can be used. - The
optical system 30 can condense and irradiate thelaser beam 22 from thelaser source 20 onto theinsulation substrate 2 that is held by thestage 12. Thelaser beam 22 may perpendicularly enter theinsulation substrate 2. Theoptical system 30 may include, for example, a waveplate (retarder) 32; anaperture 34; alens 36, and so forth. - The
waveplate 32 can convert polarization of thelaser beam 22 from linear polarization into circular polarization. Thewaveplate 32 may be formed of a quarter waveplate, for example. Thewaveplate 32 may be disposed between thelaser source 20 and theaperture 34, for example. For a case of irradiating the circularly polarizedlaser beam 22 onto theinsulation substrate 2, a cross-sectional shape of a through-hole 4 becomes more symmetric compared with a case in which the linearlypolarized laser beam 22 is irradiated onto theinsulation substrate 2. Thewaveplate 32 may be omitted. Theoptical system 30 may condense the linearlypolarized laser beam 22, and theoptical system 30 may irradiate the condensed linearlypolarized laser beam 22 onto theinsulation substrate 2. - The
aperture 34 may have a smallcircular opening 34 a that is smaller than a cross-section of thelaser beam 22. Theaperture 34 can enhance circularity of the cross-section of thelaser beam 22 by blocking a peripheral portion of the cross-section of thelaser beam 22. Additionally, theaperture 34 can vary a converging half angle 9 by varying a diameter of an incident beam of thelaser beam 22 with respect to thelens 36. Theaperture 34 may be disposed between the waveplate 32 and thelens 36, so that theaperture 34 can adjust the cross-sectional shape of thelaser beam 22 and/or the converging half angle θ, prior to thelaser beam 22 entering thelens 36. Note that theaperture 34 can be omitted as long as thelaser beam 22 that enters thelens 36 is collimating light having a circular cross-section. - The
lens 36 can condense thelaser beam 22, and thecondensed laser beam 22 can be irradiated from thelens 36 onto theinsulation substrate 2 that is held by thestage 12. As shown inFIG. 1 , afocal point 36 a of thelens 36 can be placed on a to-be-irradiated surface 2 a (which may also be referred to as a laser irradiatedsurface 2 a) of theinsulation substrate 2, for example. Here, the to-be-irradiated surface 2 a is to be irradiated by thelaser beam 22. Alternatively, thefocal point 36 a may be placed in the vicinity of the to-be-irradiated surface 2 a. For the case in which thefocal point 36 a is placed in the vicinity of the to-be-irradiated surface 2 a, thefocal point 36 a of thelens 36 may be placed at a side of thelaser source 20 or at a side that is opposite to thelaser source 20, with respect to the laser irradiatedsurface 2 a of theinsulation substrate 2. A distance between thefocal point 36 a of thelens 36 and the laser irradiatedsurface 2 a of theinsulation substrate 2 in a direction that is perpendicular to the laser irradiatedsurface 2 a may be less than or equal to 0.1 mm. By condensing thelaser beam 22 and irradiating thecondensed laser beam 22 onto theinsulation substrate 2, theinsulation substrate 2 can be locally heated, and the heated portion can be removed. In this manner, the through-hole 4 can be formed. Thelens 36 can be disposed between theaperture 34 and thestage 12, for example. - Though it is not shown in the figures, in order to enlarge a beam diameter of the
laser beam 22, a beam expander may be disposed between thelaser source 20 and thewaveplate 32. - Next, a through-hole forming method that uses the above-described through-
hole forming apparatus 10 is described. The through-hole forming method may include a process of forming the through-hole 4 that passes through theinsulation substrate 2 in the thickness direction of theinsulation substrate 2 by condensing thelaser beam 22 by thelens 36 and by irradiating thecondensed laser beam 22 onto theinsulation substrate 2 from thelens 36. In the above-described process of forming the through-hole 4, theinsulation substrate 2 may be locally heated by irradiating thecondensed laser beam 22, and the heated portion may be removed. In this manner, the through-hole 4 can be formed. After forming the through-hole 4, the relative position, in the horizontal direction, of thestage 12 may be changed with respect to thelaser source 20 and theoptical system 30, and another through-hole 4 may be formed. In this manner, more than one through-holes 4 can be formed in theinsulation substrate 2. - Note that, for changing the relative position, in the horizontal direction, of the
stage 12, with respect to thelaser source 20 and theoptical system 30, either thelaser source 20 and theoptical system 30 or thestage 12 may be moved. Alternatively, both thelaser source 20 and theoptical system 30, and thestage 12 may be moved. -
FIG. 2 is a diagram showing a vertical cross-section of the through-hole 4 according to the embodiment of the present invention. InFIG. 2 , the dashed line shows a target shape of the through-hole 4. Note that, inFIG. 2 , a deviation of the shape of the through-hole 4 from the target shape is exaggerated. - As shown in
FIG. 2 , theinsulation substrate 2 is provided with the through-hole 4 that passes through theinsulation substrate 2 in the thickness direction of theinsulation substrate 2. The through-hole 4 may include afirst orifice 4 a that is formed at the laser irradiatedsurface 2 a of theinsulation substrate 2; and asecond orifice 4 b that is formed at asurface 2 b (which may also be referred to as theopposite surface 2 b, hereinafter) that is opposite to the laser irradiatedsurface 2 a of theinsulation substrate 2. - The through-
hole 4 can be formed by digging the hole from the laser irradiatedsurface 2 a toward theopposite surface 2 b. Hereinafter, a hole that is to be a through-hole (prior to forming the through-hole) may be referred to as a bottomed hole (a hole with a bottom). Thelaser beam 22 that is irradiated onto theinsulation substrate 2 can be roughly classified into thelaser beam 22 that can reach a bottom of the bottomed hole and thelaser beam 22 that may be absorbed by a side surface of the bottomed hole and that may not reach the bottom of the bottomed hole. Thus, the through-hole 4 can be formed such that a shape the through-hole 4 depends on strength balance of thelaser beam 22. - Within the
laser beam 22 that is absorbed by the side surface of the bottomed hole, a proportion of the laser beam 22 b that is absorbed in the vicinity of the entrance may be large. Consequently, removal of the glass tends to progress in the vicinity of the entrance, so that thefirst orifice 4 a can be greater than thesecond orifice 4 b. In other words, thesecond orifice 4 b can be smaller than thefirst orifice 4 a. - A
truncated cone 6 whose side surface includes thefirst orifice 4 a and thesecond orifice 4 b can be a target shape. Assuming that the medium between thelens 36 and theinsulation substrate 2 is air and that the converging half angle is θ (cf.FIG. 1 ), the deviation from the target shape (which may also be referred to as “collapse 1 n a shape,” hereinafter) can correspond to sin θ. Here, the converging half angle 9 can be calculated from the expression (1), which is described below. -
(d/2)/f=tan θ (1) - In the above-described expression (1), “d” is a diameter of the incident beam of the
laser beam 22 with respect to thelens 36, and “f” is a focal length of thelens 36. - Here, sin θ may correspond to the converging half angle of the
laser beam 22. -
FIG. 3 is a diagram showing a shape of the through-hole 4 according to the embodiment for a case in which sin θ is in a range from 0.16 to 0.22.FIG. 4 is a diagram showing a shape of a through-hole according to a first comparative example for a case in which sin θ is greater than 0.22.FIG. 5 is a diagram showing a shape of a through-hole according to a second comparative example for a case in which sin θ is less than 0.16. - In the first comparative example that is shown in
FIG. 4 , sin θ is greater than 0.22. In this case, the converging half angle may be too large, and a spread of acondensed laser beam 22A may be too large. Consequently, a proportion of thelaser beam 22A that is absorbed in the side surface of the bottomed hole may be too large, and a through-hole 4A may have a barrel shape that expands in the vicinity of the center of theinsulation substrate 2 in the thickness direction of theinsulation substrate 2. Especially, for a carbon dioxide laser, absorption of a laser beam by glass is large, compared to that of the YAG laser. Consequently, for a carbon dioxide laser, a rate of thelaser beam 22A that is absorbed in the side surface of the bottomed hole tends to be greater, and the collapse in the shape tends to be significant. - In the second comparative example that is shown in
FIG. 5 , sin θ is less than 0.16. In this case, a beam diameter (which may also be referred to as a spot diameter of thelaser beam 22B) of thelaser beam 22B at a focal point may be too large, and a first orifice that can be formed at a laser irradiated surface of aninsulation substrate 2B may be too large. Further, in this case, a focal depth may be too large. As a result of these, thelaser beam 22B tends to reach a bottom of the bottomed hole, and the proportion of thelaser beam 22B that can be absorbed in the bottom of the bottomed hole may be too large. Consequently, expansion of the hole diameter of the bottom of the bottomed hole tends to progress, and the through-hole 4B may have a barrel shape. - In the embodiment that is shown in
FIG. 3 , sin θ is in a range from 0.16 to 0.22. Namely, the converging half angle θ satisfies the following expression (2): -
0.16≤sin θ≤0.22 (2) - In this case, the intensity of the
laser beam 22 that reaches the bottom of the bottomed hole and the intensity of thelaser beam 22 that is absorbed in the side surface of the bottomed hole and that does not reach the bottom surface of the bottomed hole are well-balanced. The shape of the through-hole 4 can be close to a linearly tapered shape, which is the target shape. Thus, the collapse in the shape of the through-hole 4 can be suppressed. In this manner, a ratio (Φ1/Φ2) between the diameter of the through-hole (Φ1) and the diameter of the truncated cone 6 (Φ2) at any position of the through-hole 4 in the thickness direction of theinsulation substrate 2 can be regulated to be within a range from 0.7 to 1.1. Here, sin θ can preferably be in a range from 0.17 to 0.21, and sin θ can be more preferably in a range from 0.18 to 0.20. For a case where a carbon dioxide laser is used such that absorption of the laser beam in the glass is large and a rate of absorption of the laser beam in the side surface of the bottomed hole tends to be large, if the above-described expression (2) is satisfied, an effect of suppressing the collapse in the shape can be significant. - An inflated part and/or a narrow part can be prevented from being formed in the through-
hole 4 because the ratio (Φ1/Φ2) of the through-hole 4 at any position of the through-hole 4 in the thickness direction of theinsulation substrate 2 can be within the range from 0.7 to 1.1. Thus, a through electrode can be formed such that the through-hole 4 has a shape that is close to a linearly tapered shape, and the through electrode has fewer defects. For example, for a case of forming a through electrode by plating, a base layer of the plating can be uniformly formed on a side surface of the through-hole 4. The base layer of the plating can be formed by a sputtering method, for example. A through electrode can be formed in which the growth of the plating can be uniform and which has fewer defects because the base layer of the plating can be uniformly formed. Additionally, for a case of forming a through electrode by an electrically conductive paste, filling shortage and filling unevenness of the electrically conductive paste can be suppressed. Thus, a through electrode having fewer defects can be formed. Theinsulation substrate 2 having a through electrode can be used as an interposer. -
FIG. 6 is a diagram showing the through-hole forming apparatus according to another embodiment of the present invention. The through-hole forming apparatus according to this embodiment is different from the through-hole forming apparatus according to the above-described embodiment in a point that the through-hole forming apparatus according to this embodiment may include amachining unit 50 for electrical discharge machining to form the through-hole 4. Hereinafter, the point of difference is mainly described. - The
machining unit 50 can correct the shape of the through-hole 4 by applying electrical discharge machining to the through-hole 4 that may be obtained by laser processing. The ratio (Φ1/Φ2) at any position of the through-hole 4 in the thickness direction of theinsulation substrate 2 can be adjusted to be within a range from 0.8 to 1.1 because a locally narrow part and so forth of the through-hole 4 can be removed. - The
machining unit 50 may include thestage 12 as a first electrode; asecond electrode 52; and a direct current (DC) high-voltage power supply 54. - The
second electrode 52 can be formed to have a needle shape. An infinitesimal gap may be formed between thesecond electrode 52 and theinsulation substrate 2 that is held by thestage 12. Thesecond electrode 52 can be disposed outside the path of thelaser beam 22, so that thesecond electrode 52 can avoid blocking thelaser beam 22. - The DC current high-
voltage power supply 54 can apply a direct-current voltage between thestage 12 and thesecond electrode 52 so as to cause an electric discharge in the through-hole 4. - The
machining unit 50 according to the embodiment may include thestage 12 as the first electrode. Alternatively, themachining unit 50 may include a first electrode that is different from thestage 12. In this case, the first electrode may have a needle shape, similar to thesecond electrode 52. - Next, a through-hole forming method by using the above-described through-hole forming apparatus is described. The through-hole forming method may include a process of applying electrical discharge machining to the through-
hole 4 by applying a DC voltage between thestage 12 and thesecond electrode 52 so as to cause an electric discharge in the through-hole 4. In order to enhance the throughput, a time period for waiting from the completion of laser processing until start of the electrical discharge machining can be less than or equal to 100 μs. - After applying the electrical discharge machining, a relative position, in the horizontal direction, between the
stage 12 and thelaser source 20, theoptical system 30, and thesecond electrode 52 can be changed, and laser processing and electrical discharge machining can be executed again. In this manner, more than one through-holes 4 can be formed in theinsulation substrate 2. - Note that, for changing the relative position, in the horizontal direction, between the
stage 12 and thelaser source 20, theoptical system 30, and thesecond electrode 52, either thestage 12 or thelaser source 20, theoptical system 30, and thesecond electrode 52 may be moved. Alternatively, both thestage 12 and thelaser source 20, theoptical system 30, and thesecond electrode 52 may be moved. - Hereinafter, Test Examples 1 to 12 are described. The Test Examples 2 to 4 and 7 to 10 are according to the embodiment, and the Test Examples 1, 5, 6, 11, and 12 are according to the comparative example.
- In the Test Examples 1 to 5, approximately ten thousand through-holes were formed in a glass substrate under substantially the same condition, except for changing sin θ by varying a diameter of an opening of the
aperture 34 and changing a time period for irradiation, as shown in Table 1. For forming a through-hole, the through-hole forming apparatus that is shown inFIG. 1 was used. Note that, in the Test Example 5, theaperture 34 that is shown inFIG. 1 was not used, and a laser beam having a circular cross-section with a diameter of 15 mm directly entered thelens 36, as it was. In the Test Examples 1 to 5, the laser beam that entered thelens 36 was collimating light having a circular cross-section. In the Test Examples 1 to 5, electrical discharge machining was not executed. - First, major conditions that were common among the Test Examples 1 to 5 are described. An alkali-free glass substrate having a thickness of 0.4 mm was used as the glass substrate. A carbon dioxide laser was used as the
laser source 20. The output power of thelaser source 20 was set to 100 W. Thelaser beam 22 was irradiated onto the glass substrate so that thelaser beam 22 was focused on the laser irradiatedsurface 2 a of the glass substrate by thelens 36 having a focal length f of 25 mm. The medium between thelens 36 and the glass substrate was air. - The table 1 and
FIGS. 7 to 11 show the results of the experiments. InFIGS. 7 to 11 , the dark portions are the through-holes 4. -
TABLE 1 Irradiation Aperture time opening Φ1/Φ2 period diameter Minimum Maximum (μs) (mm) sin θ value value Test 500 6.0 0.12 0.54 1.19 Example 1 Test 420 8.0 0.16 0.70 1.07 Example 2 Test 345 10.0 0.20 0.81 1.02 Example 3 Test 310 11.0 0.22 0.74 1.06 Example 4 Test 280 None 0.29 0.72 1.22 Example 5 - As clearly seen from Table 1 and
FIGS. 7 to 11 , in the Test Examples 2 to 4, the ratio (Φ1/Φ2) was within a range from 0.7 to 1.1 because sin θ was in a range from 0.16 to 0.22, and consequently the through-holes 4 having the shapes that were close to the target shape could be formed. Whereas, in the Test Examples 1 and 5, the value of sin θ was out of the range from 0.16 to 0.22, and the collapse in the shapes was significant. - In the Test Examples 6 to 12, approximately ten thousand through-holes were formed in a glass substrate under substantially the same condition, except for changing sin θ by varying a diameter of an opening of the
aperture 34 and changing a time period for irradiation, as shown in Table 2. For forming a through-hole, the through-hole forming apparatus that is shown inFIG. 6 was used. Note that, in the Test Example 12, theaperture 34 that is shown inFIG. 6 was not used, and a laser beam having a circular cross-section with a diameter of 15 mm directly entered thelens 36, as it was. In the Test Examples 6 to 12, the laser beam that entered thelens 36 was collimating light having a circular cross-section. In the Test Examples 6 to 12, electrical discharge machining was executed after laser processing. - First, major conditions that were common among the Test Examples 6 to 12 are described. An alkali-free glass substrate having a thickness of 0.4 mm was used as the glass substrate. A carbon dioxide laser was used as the
laser source 20. The output power of thelaser source 20 was set to 80 W. Thelaser beam 22 was irradiated onto the glass substrate so that thelaser beam 22 was focused on the laser irradiatedsurface 2 a of the glass substrate by thelens 36 having a focal length f of 25 mm. The medium between thelens 36 and the glass substrate was air. - The table 2 and
FIGS. 12 to 18 show the results of the experiments. InFIGS. 12 to 18 , the dark portions are the through-holes 4. -
TABLE 2 Irradiation Aperture time opening Φ1/Φ2 period diameter Minimum Maximum (μs) (mm) sin θ value value Test 460 7.0 0.14 0.67 1.14 Example 6 Test 420 8.0 0.16 0.83 1.00 Example 7 Test 380 9.0 0.18 0.86 1.00 Example 8 Test 345 10.0 0.20 0.83 1.00 Example 9 Test 310 11.0 0.22 0.84 1.00 Example 10 Test 300 13.0 0.24 0.77 1.12 Example 11 Test 280 None 0.29 1.00 1.31 Example 12 - As clearly seen from Table 2 and
FIGS. 12 to 18 , in the Test Examples 7 to 10, the ratio (Φ1/Φ2) was within a range from 0.8 to 1.1 because sin θ was in a range from 0.16 to 0.22, and consequently the through-holes 4 having the shapes that were close to the target shape could be formed. Whereas, in the Test Examples 6, 11 and 12, the value of sin θ was out of the range from 0.16 to 0.22, and the collapse in the shapes was significant. - The through-hole forming method, the through-hole forming apparatus, and the method of manufacturing a glass substrate provided with a through-hole are explained above by the embodiment. However, the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the gist that is described in the scope of the claims.
Claims (17)
1-19. (canceled)
20. A glass substrate provided with a through-hole, wherein the through-hole comprises a first opening edge at a first surface of the glass substrate and a second opening edge at a second surface opposite to the first surface of the glass substrate,
wherein the second opening edge is smaller than the first opening edge, and
wherein at any position of the through-hole in a plate thickness direction, a ratio (Φ1/Φ2) between a diameter (Φ1) of the through-hole and a diameter (Φ2) of a circular truncated cone, surfaces of the circular truncated cone comprising the first opening edge and the second opening edge, is greater than or equal to 0.7 and less than or equal to 1.1.
21. The glass substrate according to claim 20 , wherein the through-hole has a linearly tapered shape.
22. The glass substrate according to claim 20 , wherein the glass substrate with the through-hole is an interposer.
23. The glass substrate according to claim 20 , wherein the through-hole is configured for forming a through electrode.
24. The glass substrate according to claim 23 , wherein the through electrode is formed by plating.
25. The glass substrate according to claim 23 , wherein the through electrode is an electrode formed of an electrically conductive paste.
26. The glass substrate according to claim 21 , wherein the glass substrate with the through-hole is an interposer.
27. The glass substrate according to claim 21 , wherein the through-hole is configured for forming a through electrode.
28. The glass substrate according to claim 22 , wherein the through-hole is configured for forming a through electrode.
29. The glass substrate according to claim 26 , wherein the through-hole is configured for forming a through electrode.
30. The glass substrate according to claim 27 , wherein the through electrode is formed by plating.
31. The glass substrate according to claim 28 , wherein the through electrode is formed by plating.
32. The glass substrate according to claim 29 , wherein the through electrode is formed by plating.
33. The glass substrate according to claim 27 , wherein the through electrode is an electrode formed of an electrically conductive paste.
34. The glass substrate according to claim 28 , wherein the through electrode is an electrode formed of an electrically conductive paste.
35. The glass substrate according to claim 29 , wherein the through electrode is an electrode formed of an electrically conductive paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/227,658 US20190118281A1 (en) | 2014-12-16 | 2018-12-20 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014254424 | 2014-12-16 | ||
JP2014-254424 | 2014-12-16 | ||
US14/965,111 US10201867B2 (en) | 2014-12-16 | 2015-12-10 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
US16/227,658 US20190118281A1 (en) | 2014-12-16 | 2018-12-20 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/965,111 Continuation US10201867B2 (en) | 2014-12-16 | 2015-12-10 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
Publications (1)
Publication Number | Publication Date |
---|---|
US20190118281A1 true US20190118281A1 (en) | 2019-04-25 |
Family
ID=56110485
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/965,111 Active US10201867B2 (en) | 2014-12-16 | 2015-12-10 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
US16/227,658 Abandoned US20190118281A1 (en) | 2014-12-16 | 2018-12-20 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/965,111 Active US10201867B2 (en) | 2014-12-16 | 2015-12-10 | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole |
Country Status (3)
Country | Link |
---|---|
US (2) | US10201867B2 (en) |
JP (2) | JP6104354B2 (en) |
TW (1) | TWI666083B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019021916A (en) * | 2017-07-11 | 2019-02-07 | Agc株式会社 | Glass substrate |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10668561B2 (en) * | 2016-11-15 | 2020-06-02 | Coherent, Inc. | Laser apparatus for cutting brittle material |
JP2019147166A (en) * | 2018-02-27 | 2019-09-05 | 株式会社リコー | Optical processing apparatus and production method for optical work piece |
US10470300B1 (en) * | 2018-07-24 | 2019-11-05 | AGC Inc. | Glass panel for wiring board and method of manufacturing wiring board |
US11344972B2 (en) * | 2019-02-11 | 2022-05-31 | Corning Incorporated | Laser processing of workpieces |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05330064A (en) | 1992-05-29 | 1993-12-14 | Ricoh Co Ltd | Method for molding nozzle plate |
JP3118203B2 (en) | 1997-03-27 | 2000-12-18 | 住友重機械工業株式会社 | Laser processing method |
JP2001269789A (en) | 2000-01-20 | 2001-10-02 | Komatsu Ltd | Laser beam machining device |
JP3797068B2 (en) | 2000-07-10 | 2006-07-12 | セイコーエプソン株式会社 | Laser microfabrication method |
JP4459530B2 (en) * | 2000-08-29 | 2010-04-28 | 三菱電機株式会社 | Laser processing equipment |
WO2002038323A1 (en) * | 2000-11-13 | 2002-05-16 | Micmacmo Aps | Laser ablation |
EP1295647A1 (en) | 2001-09-24 | 2003-03-26 | The Technology Partnership Public Limited Company | Nozzles in perforate membranes and their manufacture |
US20050155956A1 (en) * | 2002-08-30 | 2005-07-21 | Sumitomo Heavy Industries, Ltd. | Laser processing method and processing device |
US7880117B2 (en) * | 2002-12-24 | 2011-02-01 | Panasonic Corporation | Method and apparatus of drilling high density submicron cavities using parallel laser beams |
US20050064137A1 (en) * | 2003-01-29 | 2005-03-24 | Hunt Alan J. | Method for forming nanoscale features and structures produced thereby |
JP2008284579A (en) * | 2007-05-16 | 2008-11-27 | Fuji Xerox Co Ltd | Manufacturing method of liquid droplet ejection head, and liquid droplet ejection head |
JP5071868B2 (en) * | 2008-08-11 | 2012-11-14 | オムロン株式会社 | Laser processing method, laser processing apparatus, optical element manufacturing method, and optical element |
JP2011177735A (en) | 2010-02-26 | 2011-09-15 | Agt:Kk | Laser beam drilling method |
KR101917401B1 (en) | 2010-11-30 | 2018-11-09 | 코닝 인코포레이티드 | Methods of forming high-density arrays of holes in glass |
JP5805008B2 (en) | 2012-05-21 | 2015-11-04 | 三菱電機株式会社 | Laser processing machine for glass fine hole processing and glass fine hole processing method |
EP2964417B1 (en) * | 2013-04-04 | 2022-01-12 | LPKF Laser & Electronics AG | Method for providing through-openings in a substrate |
JP2014213338A (en) * | 2013-04-24 | 2014-11-17 | 旭硝子株式会社 | Method for forming through-hole in glass substrate by laser beam irradiation |
JP2014226710A (en) * | 2013-05-24 | 2014-12-08 | 旭硝子株式会社 | Discharge auxiliary type laser hole machining method |
JP6262039B2 (en) * | 2014-03-17 | 2018-01-17 | 株式会社ディスコ | Processing method of plate |
-
2015
- 2015-12-07 JP JP2015238406A patent/JP6104354B2/en active Active
- 2015-12-10 US US14/965,111 patent/US10201867B2/en active Active
- 2015-12-14 TW TW104141958A patent/TWI666083B/en active
-
2017
- 2017-02-27 JP JP2017035114A patent/JP6699595B2/en active Active
-
2018
- 2018-12-20 US US16/227,658 patent/US20190118281A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019021916A (en) * | 2017-07-11 | 2019-02-07 | Agc株式会社 | Glass substrate |
JP7014068B2 (en) | 2017-07-11 | 2022-02-01 | Agc株式会社 | Glass substrate |
Also Published As
Publication number | Publication date |
---|---|
TWI666083B (en) | 2019-07-21 |
JP2016113358A (en) | 2016-06-23 |
JP6104354B2 (en) | 2017-03-29 |
JP2017128505A (en) | 2017-07-27 |
TW201628755A (en) | 2016-08-16 |
US10201867B2 (en) | 2019-02-12 |
US20160168006A1 (en) | 2016-06-16 |
JP6699595B2 (en) | 2020-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190118281A1 (en) | Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole | |
US9117895B2 (en) | Laser processing method | |
JP6275412B2 (en) | Method for aligning laser beam and charged particle beam | |
US9475152B2 (en) | Laser processing method and laser processing apparatus | |
US20100044590A1 (en) | Laser processing method | |
US10442720B2 (en) | Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole | |
JP2007029952A (en) | Laser beam machining apparatus, and laser beam machining method | |
JP2016056046A (en) | Open hole formation method | |
US20180214981A1 (en) | Laser machining machines and methods for lap welding of workpieces | |
JP2016113358A5 (en) | ||
CN107685196B (en) | Method and device for processing wafer by laser | |
KR102143187B1 (en) | Laser processing apparatus and laser processing method using the same | |
US9688563B2 (en) | Apparatus and method for forming holes in glass substrate | |
TWI725155B (en) | Manufacturing method for glass substrate, method for forming hole in glass substrate, and apparatus for forming hole in glass substrate | |
US11123822B2 (en) | Manufacturing method for glass substrate, method for forming hole in glass substrate, and apparatus for forming hole in glass substrate | |
JP2006339266A (en) | Laser beam machining method | |
CN110658630A (en) | Optical device with microstructure capable of forming columnar light beam | |
KR102225208B1 (en) | System and method for treating the surface of semiconductor device | |
US8278813B2 (en) | Apparatus and method for generating femtosecond electron beam | |
KR101104484B1 (en) | Apparatus for generating femtosecond electron beam | |
JP2015193036A (en) | Penetration hole formation device and production method of glass substrate having penetration hole | |
JPH0465825A (en) | Convergent ion beam machining method | |
JP6213259B2 (en) | MALDI ion source | |
JP2003089180A (en) | Irradiation position regulator for laser module | |
JP2016147266A (en) | Discharge auxiliary type laser hole processor and discharge auxiliary type laser hole processing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |