TWI665239B - 組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體 - Google Patents
組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體 Download PDFInfo
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- TWI665239B TWI665239B TW104131521A TW104131521A TWI665239B TW I665239 B TWI665239 B TW I665239B TW 104131521 A TW104131521 A TW 104131521A TW 104131521 A TW104131521 A TW 104131521A TW I665239 B TWI665239 B TW I665239B
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Abstract
提供一種組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體,所述組成物的彈性體的溶解性良好,可提高固體成分濃度,可形成乾燥性、表面狀態及耐熱性優異的膜。該組成物含有:自25℃起以20℃/min升溫的5%熱質量減少溫度為375℃以上的彈性體;下述通式(1)所表示的沸點為160℃以上的溶劑;及沸點小於120℃的溶劑。通式(1)中,R1
~R6
分別獨立地表示氫原子或脂肪族烴基。
Description
本發明是有關於一種組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體。更詳細而言,本發明是有關於一種於半導體裝置等的製造中可較佳地使用的組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體。
於積體電路(Integrated Circuit,IC)或大規模積體電路(Large Scale Integration,LSI)等半導體元件的製造製程(process)中,於元件晶圓上形成多個IC晶片,並藉由切割(dicing)而單片化。
伴隨著電子設備的進一步的小型化及高性能化的需求(needs),對搭載於電子設備上的IC晶片亦要求進一步的小型化及高積體化,但元件晶圓的面方向上的積體電路的高積體化已接近極限。
作為自IC晶片內的積體電路向IC晶片的外部端子的電性連接方法,一直以來打線接合(wire bonding)法廣為人知,但為了實現IC晶片的小型化,近年來已知以下方法:於元件晶圓中設置貫通孔,將作為外部端子的金屬插塞(plug)以於貫通孔內貫
穿的方式連接於積體電路的所謂形成矽貫通電極(Through Silicon Via,TSV)的方法。然而,僅形成矽貫通電極的方法無法充分應對所述近年來的對IC晶片的進一步高積體化的需求。
鑒於以上情況,已知以下技術:使IC晶片內的積體電路多層化,藉此提高元件晶圓的每單位面積的積體度。然而,積體電路的多層化會使IC晶片的厚度增大,故必須實現構成IC晶片的構件的薄型化。關於此種構件的薄型化,例如已研究了元件晶圓的薄型化,此方法不僅有助於IC晶片的小型化,而且可使矽貫通電極的製造中的元件晶圓的貫通孔製造步驟省力,故被視為有前途。另外,於功率元件(power device)、影像感測器(image sensor)等半導體元件中,亦就提高所述積體度或提高元件結構的自由度的觀點而言,正在嘗試薄型化。
作為元件晶圓,具有約700μm~900μm的厚度者已廣為人知,近年來,以IC晶片的小型化等為目的,正在嘗試使元件晶圓的厚度變薄至200μm以下。
然而,厚度200μm以下的元件晶圓非常薄,以其作為基材的半導體元件製造用構件亦非常薄,故於對此種構件實施進一步的處理、或單移動此種構件的情形時,難以穩定且無損傷地支撐構件。
為了解決如上所述的問題,已知藉由暫時接著劑將薄型化前的元件晶圓與支撐基板暫時固定(暫時接著(temporary bonding)),將元件晶圓的背面磨削而薄型化後,使支撐基板自元
件晶圓脫離的技術。
於專利文獻1中記載:使用含有苯乙烯系彈性體、乙酸乙酯、十氫萘的接著劑組成物形成接著層,且使用形成有接著層的接著膜將晶圓與晶圓的支撐基板貼附。
另一方面,於專利文獻2中記載:使相對於苯乙烯系彈性體100重量份而含有150重量份~2400重量份的有機溶劑、100重量份~1500重量份的水、及1重量份~20重量份的親水性-親油性均衡(Hydrophile-Lipophile Balance,HLB)值為6~17的非離子性界面活性劑的苯乙烯系彈性體分散溶液含浸於纖維質基材後,使其乾燥而製造片狀物。
[現有技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2014-37458號公報
[專利文獻2]日本專利特開平11-117180號公報
於將元件晶圓的表面與支撐基板暫時接著的情形時,為了穩定地支撐元件晶圓,而對元件晶圓的表面與支撐基板之間的暫時接著層要求一定強度的接著力,並且謀求可容易地解除元件晶圓與支撐基板的暫時接著狀態的特性。當形成滿足此種特性的暫時接著層時,正研究使用彈性體。
另外,於使用片將元件晶圓與支撐基板暫時接著的情形時,
為了確保對元件晶圓的表面形狀(例如金屬凸塊(metal bump)、墊、通孔(via)等結構體)的追隨性,而期望片具有某種程度的厚度。
然而,本發明者等人對專利文獻1所揭示的組成物進行研究的結果可知:專利文獻1的組成物的彈性體的溶解性低,難以形成具有厚度的片。進而可知,專利文獻1的組成物的乾燥性差,有膜中的溶劑的殘留量增加的傾向。
作為提高組成物的乾燥性的方法,考慮使用沸點低的溶劑,但可知若使用沸點低的溶劑,則容易產生乾燥不均或厚度不均等,有膜表面的表面狀態惡化的傾向。若膜表面的表面狀態差,則有對元件晶圓或支撐基板的接著性差的傾向。
另外,近年來,於元件的製造製程中,有時將元件供於更高溫下的處理。因此,為了應對各種製造製程,對暫時接著膜亦謀求耐熱性的進一步提高。
另一方面,於專利文獻2中,使苯乙烯系彈性體分散溶液含浸於纖維質基材,並快速乾燥,而獲得具有天然皮革之手感的片。亦即,專利文獻2是將苯乙烯系彈性體分散溶液用作纖維質基材的集束劑。然而,專利文獻2中並未針對使用苯乙烯系彈性體分散溶液來形成片等進行記載。進而,並未針對提高彈性體的溶解性、乾燥後的表面狀態、耐熱性進行記載。
本發明是鑒於所述背景而成,其目的在於提供一種組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體,所述
組成物的彈性體的溶解性良好,可提高固體成分濃度,可形成乾燥性、表面狀態及耐熱性優異的膜。
本發明者等人為了解決所述課題而進行了潛心研究,結果發現,藉由將自25℃起以20℃/min(20℃/分)升溫的5%熱質量減少(mass reduction)溫度為375℃以上的彈性體、後述的通式(1)所表示的沸點為160℃以上的溶劑、與沸點小於120℃的溶劑併用,而可達成所述目的,從而完成了本發明。本發明提供以下內容。
<1>一種組成物,其含有:自25℃起以20℃/min升溫的5%熱質量減少溫度為375℃以上的彈性體;下述通式(1)所表示的沸點為160℃以上的溶劑;及沸點小於120℃的溶劑,
通式(1)中,R1~R6分別獨立地表示氫原子或脂肪族烴基。
<2>如<1>所記載的組成物,其中彈性體是以25質量%以上的比例而含有於組成物中。
<3>如<1>或<2>所記載的組成物,其中彈性體為含有來源於苯乙烯的重複單元的彈性體。
<4>如<1>至<3>中任一項所記載的組成物,其中彈性體為氫化產物(hydrogenated product)。
<5>如<1>至<4>中任一項所記載的組成物,其中彈性體為單末端或兩末端為苯乙烯嵌段的苯乙烯嵌段聚合物。
<6>如<1>至<5>中任一項所記載的組成物,其中彈性體的苯乙烯含有率為40質量%以上。
<7>如<1>至<6>中任一項所記載的組成物,其中沸點為160℃以上的溶劑的SP值為19(MPa)1/2以下。
<8>如<1>至<7>中任一項所記載的組成物,其中沸點小於120℃的溶劑的SP值為19(MPa)1/2以下。
<9>如<1>至<8>中任一項所記載的組成物,其中沸點小於120℃的溶劑為選自芳香族烴、脂環式烴及環狀醚中的一種以上。
<10>如<1>至<9>中任一項所記載的組成物,其中沸點小於120℃的溶劑是以10質量%~60質量%的比例而含有於組成物中。
<11>如<1>至<10>中任一項所記載的組成物,其中沸點為160℃以上的溶劑與沸點小於120℃的溶劑的質量比為80:20~99:1。
<12>如<1>至<11>中任一項所記載的組成物,其更含
有抗氧化劑。
<13>如<12>所記載的組成物,其中抗氧化劑是以1質量%~7質量%的比例而含有於組成物中。
<14>如<1>至<13>中任一項所記載的組成物,其用於片形成用途。
<15>如<1>至<14>中任一項所記載的組成物,其為暫時接著組成物。
<16>一種片的製造方法,其將如<1>至<15>中任一項所記載的組成物施用於支撐體上,並使其乾燥。
<17>一種片,其是使如<1>至<15>中任一項所記載的組成物乾燥而獲得。
<18>一種積層體,其於使如<1>至<15>中任一項所記載的組成物乾燥而獲得的片的單面或兩面上具有具備脫模性的支撐體。
<19>一種帶有元件晶圓的積層體,其於元件晶圓與支撐基板之間具有使如<1>至<15>中任一項所記載的組成物乾燥而獲得的片,且片的一個表面與元件晶圓的元件面接觸,另一表面與支撐基板的表面接觸。
根據本發明,可提供一種組成物、片的製造方法、片、積層體及帶有元件晶圓的積層體,所述組成物的彈性體的溶解性良好,可提高固體成分濃度,可形成乾燥性、表面狀態及耐熱性
優異的膜。
11‧‧‧片
12‧‧‧支撐基板
60‧‧‧元件晶圓
60a‧‧‧薄型元件晶圓
61‧‧‧矽基板
61a‧‧‧表面
61b、61b1‧‧‧背面
62‧‧‧元件晶片
63‧‧‧結構體
100‧‧‧接著性支撐基板
圖1為表示半導體裝置的製造方法的一實施形態的概略圖。
以下,對本發明的實施形態加以詳細說明。
於本說明書中的基團(原子團)的表述中,未記載經取代及未經取代的表述不僅包含不具有取代基的基團,亦包含具有取代基的基團。例如所謂「烷基」,不僅包含不具有取代基的烷基(未經取代的烷基),而且亦包含具有取代基的烷基(經取代的烷基)。
本說明書中的「光化射線」或「放射線」例如是指包含可見光線、紫外線、遠紫外線、電子束、X射線等。
本說明書中,所謂「光」是指光化射線或放射線。
本說明書中,所謂「曝光」只要無特別說明,則不僅是指利用水銀燈、紫外線、準分子雷射所代表的遠紫外線、X射線、極紫外線(Extreme Ultraviolet,EUV)等的曝光,亦是指利用電子束及離子束(ion beam)等粒子束的描畫。
本說明書中,「(甲基)丙烯酸酯」表示丙烯酸酯及甲基丙烯酸酯,「(甲基)丙烯酸基」表示丙烯酸基及甲基丙烯酸基,「(甲基)丙烯醯基」表示「丙烯醯基」及「甲基丙烯醯基」。
本說明書中,重量平均分子量及數量平均分子量是定義為由凝膠滲透層析法(Gel Permeation Chromatography,GPC)測定所
得的聚苯乙烯換算值。本說明書中,重量平均分子量(Mw)及數量平均分子量(Mn)例如可藉由以下方式求出:使用HLC-8220(東曹(Tosoh)(股)製造),使用TSKgel Super AWM-H(東曹(股)製造,6.0mm ID×15.0cm)作為管柱,且使用10mmol/L的溴化鋰N-甲基吡咯啶酮(N-methylpyrrolidinone,NMP)溶液作為溶離液。
本說明書中的固體成分為25℃下的固體成分。
再者,於以下所說明的實施形態中,關於已於參照圖式中說明的構件等,藉由在圖中標註相同符號或相應符號而將說明簡化或省略。
<組成物>
本發明的組成物含有:(A)自25℃起以20℃/min升溫的5%熱質量減少溫度為375℃以上的彈性體;(B)後述的通式(1)所表示的沸點為160℃以上的溶劑;及(C)沸點小於120℃的溶劑。
本發明的組成物因含有自25℃起以20℃/min升溫時的375℃下的質量減少率為5質量%以下的彈性體,故可形成耐熱性優異的片等膜。因此,例如於經過了高溫下的製程的情形時,亦可穩定地將元件晶圓暫時接著。
另外,因含有後述的通式(1)所表示的沸點為160℃以上的溶劑,故可提高彈性體的溶解性,可提高組成物的固體成分濃度。因此,可容易地製造具有厚度的片等膜。尤其於作為彈性體使用的是含有來源於苯乙烯的重複單元的彈性體的情形時,可進一步
提高彈性體的溶解性。
而且,藉由將(B)後述的通式(1)所表示的沸點為160℃以上的溶劑、與(C)沸點小於120℃的溶劑併用,而可提高組成物的乾燥性,並且可製造表面狀態優異的片等膜。
再者,於單獨使用(B)後述的通式(1)所表示的沸點為160℃以上的溶劑的情形時,因組成物的乾燥速度慢,故膜中的溶劑殘存量容易變多。另外,於單獨使用(C)沸點小於120℃的溶劑的情形時,彈性體的溶解性不充分,且難以製造具有厚度的膜。進而,因組成物的乾燥速度過快,故容易產生乾燥不均或厚度不均,表面狀態容易劣化。
本發明的組成物可較佳地用於片形成用途。
另外,本發明的組成物可較佳地用作暫時接著組成物。
以下,對本發明的組成物的各成分加以詳細說明。
<<(A)彈性體>>
本發明的組成物含有彈性體。藉由含有彈性體而亦追隨支撐基板或元件晶圓的微細的凹凸,從而藉由適度的固著效果(anchor effect)而可形成具有優異的接著性的片等膜。另外,於將支撐基板自元件晶圓剝離時,可於不對元件晶圓等施加應力的情況下將支撐基板自元件晶圓簡單地剝離,可防止元件晶圓上的元件等的破損或剝落。
再者,本說明書中,所謂彈性體,表示顯示出彈性變形的高分子化合物。即,定義為具有如下性質的高分子化合物:於施加
外力時,根據該外力而瞬間變形,且於解除外力時,短時間內恢復原本的形狀。
本發明中,彈性體較佳為具有如下性質:於將原本的大小設為100%時,可於室溫(20℃)下藉由小的外力而變形至200%,且於解除外力時,於短時間內回到130%以下。
本發明中,彈性體自25℃起以20℃/min升溫的5%熱質量減少溫度為375℃以上,較佳為380℃以上,進而佳為390℃以上,最佳為400℃以上。另外,上限值並無特別限定,例如較佳為1000℃以下,更佳為800℃以下。根據該態樣,容易形成耐熱性優異的片等膜。質量減少溫度是指藉由熱重量分析儀(Thermogravimetric Analyzer,TGA)於氮氣流下於所述升溫條件下測定的值。再者,於本發明的組成物含有兩種以上的彈性體的情形時,是指兩種以上的彈性體的混合物的值。
本發明中,彈性體的玻璃轉移溫度(以下亦稱為「Tg」)較佳為-50℃~300℃,更佳為0℃~200℃。若Tg為所述範圍,則接著時對元件晶圓表面的追隨性良好,可形成無孔隙的片等膜。再者,於彈性體具有兩點以上的Tg的情形時,所述Tg的值是指較低的玻璃轉移溫度。
本發明中,彈性體的重量平均分子量較佳為2,000~200,000,更佳為10,000~200,000,尤佳為50,000~100,000。藉由在該範圍內,即便於將支撐基板自元件晶圓剝離後將殘存於元件晶圓及/或支撐基板上的來源於彈性體的殘渣去除時,亦於溶劑
中的溶解性優異,故有不在元件晶圓或支撐基板上殘留殘渣等優點。
本發明中,作為彈性體,可使用含有來源於苯乙烯的重複單元的彈性體(聚苯乙烯系彈性體)、聚酯系彈性體、聚烯烴系彈性體、聚胺基甲酸酯系彈性體、聚醯胺系彈性體、聚丙烯酸系彈性體、矽酮系彈性體、聚醯亞胺系彈性體等。較佳為選自聚苯乙烯系彈性體、聚酯系彈性體、聚烯烴系彈性體、聚胺基甲酸酯系彈性體、聚醯胺系彈性體、聚丙烯酸系彈性體、矽酮系彈性體及聚醯亞胺系彈性體中的一種以上,就溶解性、耐熱性等的觀點而言,尤佳為聚苯乙烯系彈性體。
另外,彈性體較佳為氫化產物。尤其較佳為聚苯乙烯系彈性體的氫化產物。若彈性體為氫化產物,則容易形成耐熱性優異的片等膜。進而,容易形成剝離性及剝離後的清洗去除性優異的片等膜。於使用聚苯乙烯系彈性體的氫化產物的情形時,所述效果顯著。再者,所謂氫化產物,是指彈性體經氫化的結構的聚合物。
<<<聚苯乙烯系彈性體>>>
本發明中,聚苯乙烯系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉:苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)、苯乙烯-丁二烯-丁烯-苯乙烯共聚物(SBBS)及該些共聚物的氫化產物、苯乙烯-乙烯-丁烯苯乙烯嵌段共聚物(SEBS)、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物
(SEPS)、苯乙烯-乙烯-乙烯-丙烯-苯乙烯嵌段共聚物等。
聚苯乙烯系彈性體中的來源於苯乙烯的重複單元的含量較佳為40質量%以上,進而佳為45質量%以上,更佳為46質量%以上。上限例如可設為90質量%以下,亦可設為85質量%以下。
聚苯乙烯系彈性體較佳為苯乙烯與其他單體的嵌段共聚物,更佳為單末端或兩末端為苯乙烯嵌段的嵌段共聚物,尤佳為兩末端為苯乙烯嵌段的嵌段共聚物。若將聚苯乙烯系彈性體的兩端設定為苯乙烯嵌段(來源於苯乙烯的重複單元),則有耐熱性進一步提高的傾向。其原因在於:來源於耐熱性高的苯乙烯的重複單元存在於末端。尤其藉由苯乙烯嵌段(來源於苯乙烯的重複單元的嵌段部位)為反應性的聚苯乙烯系硬嵌段,有耐熱性、耐化學品性更優異的傾向,因而較佳。另外,可認為藉由使用為嵌段共聚物的彈性體,於200℃以上將進行硬嵌段(hard block)與軟嵌段(soft block)的相分離。可認為該相分離的形狀有助於抑制元件晶圓的基板表面產生凹凸。此外,此種彈性體就於溶劑中的溶解性及對抗蝕劑溶劑的耐性的觀點而言亦更佳。
另外,若聚苯乙烯系彈性體為氫化產物,則對熱的穩定性提高,不易引起分解或聚合等變質。進而,就於溶劑中的溶解性及對抗蝕劑溶劑的耐性的觀點而言亦更佳。
再者,本說明書中所謂「來源於苯乙烯的重複單元」,是指將苯乙烯或苯乙烯衍生物聚合時聚合物所含的來源於苯乙烯的構成單元,亦可具有取代基。苯乙烯衍生物例如可列舉:α-甲基苯乙
烯、3-甲基苯乙烯、4-丙基苯乙烯、4-環己基苯乙烯等。取代基例如可列舉:碳數1~5的烷基、碳數1~5的烷氧基、碳數1~5的烷氧基烷基、乙醯氧基、羧基等。
聚苯乙烯系彈性體的市售品例如可列舉:塔釜普蘭(Tufprene)A、塔釜普蘭(Tufprene)125、塔釜普蘭(Tufprene)126S、索爾普蘭(Solprene)T、阿薩普蘭(Asaprene)T-411、阿薩普蘭(Asaprene)T-432、阿薩普蘭(Asaprene)T-437、阿薩普蘭(Asaprene)T-438、阿薩普蘭(Asaprene)T-439、塔釜泰克(Tuftec)H1272、塔釜泰克(Tuftec)P1500、塔釜泰克(Tuftec)P5051、塔釜泰克(Tuftec)H1052、塔釜泰克(Tuftec)H1062、塔釜泰克(Tuftec)M1943、塔釜泰克(Tuftec)M1911、塔釜泰克(Tuftec)H1041、塔釜泰克(Tuftec)MP10、塔釜泰克(Tuftec)M1913、塔釜泰克(Tuftec)H1051、塔釜泰克(Tuftec)H1053、塔釜泰克(Tuftec)P2000、塔釜泰克(Tuftec)H1043(以上為旭化成(股)製造),彈性體AR-850C、彈性體AR815C、彈性體AR-840C、彈性體AR-830C、彈性體AR860C、彈性體AR-875C、彈性體AR-885C、彈性體AR-SC-15、彈性體AR-SC-0、彈性體AR-SC-5、彈性體AR-710、彈性體AR-SC-65、彈性體AR-SC-30、彈性體AR-SC-75、彈性體AR-SC-45、彈性體AR-720、彈性體AR-741、彈性體AR-731、彈性體AR-750、彈性體AR-760、彈性體AR-770、彈性體AR-781、彈性體AR-791、彈性體AR-FL-75N、彈性體AR-FL-85N、彈性體AR-FL-60N、彈性體AR-1050、彈性體
AR-1060、彈性體AR-1040(亞龍化成(Aron Kasei)製造),科騰(Kraton)D1111、科騰(Kraton)D1113、科騰(Kraton)D1114、科騰(Kraton)D1117、科騰(Kraton)D1119、科騰(Kraton)D1124、科騰(Kraton)D1126、科騰(Kraton)D1161、科騰(Kraton)D1162、科騰(Kraton)D1163、科騰(Kraton)D1164、科騰(Kraton)D1165、科騰(Kraton)D1183、科騰(Kraton)D1193、科騰(Kraton)DX406、科騰(Kraton)D4141、科騰(Kraton)D4150、科騰(Kraton)D4153、科騰(Kraton)D4158、科騰(Kraton)D4270、科騰(Kraton)D4271、科騰(Kraton)D4433、科騰(Kraton)D1170、科騰(Kraton)D1171、科騰(Kraton)D1173、卡里弗萊克斯(Cariflex)IR0307、卡里弗萊克斯(Cariflex)IR 0310、卡里弗萊克斯(Cariflex)IR0401、科騰(Kraton)D0242、科騰(Kraton)D1101、科騰(Kraton)D1102、科騰(Kraton)D1116、科騰(Kraton)D1118、科騰(Kraton)D1133、科騰(Kraton)D1152、科騰(Kraton)D1153、科騰(Kraton)D1155、科騰(Kraton)D1184、科騰(Kraton)D1186、科騰(Kraton)D1189、科騰(Kraton)D1191、科騰(Kraton)D1192、科騰(Kraton)DX405、科騰(Kraton)DX408、科騰(Kraton)DX410、科騰(Kraton)DX414、科騰(Kraton)DX415、科騰(Kraton)A1535、科騰(Kraton)A1536、科騰(Kraton)FG1901、科騰(Kraton)FG1924、科騰(Kraton)G1640、科騰(Kraton)G1641、科騰(Kraton)G1642、科騰(Kraton)G1643、科騰(Kraton)G1645、科騰(Kraton)G1633、科騰(Kraton)G1650、科騰(Kraton)G1651、科騰(Kraton)G1652、科騰(Kraton)
G1654、科騰(Kraton)G1657、科騰(Kraton)G1660、科騰(Kraton)G1726、科騰(Kraton)G1701、科騰(Kraton)G1702、科騰(Kraton)G1730、科騰(Kraton)G1750、科騰(Kraton)G1765、科騰(Kraton)G4609、科騰(Kraton)G4610(科騰(Kraton)製造),TR2000、TR2001、TR2003、TR2250、TR2500、TR2601、TR2630、TR2787、TR2827、TR1086、TR1600、SIS5002、SIS5200、SIS5250、SIS5405、SIS5505、代那隆(Dynaron)6100P、代那隆(Dynaron)4600P、代那隆(Dynaron)6200P、代那隆(Dynaron)4630P、代那隆(Dynaron)8601P、代那隆(Dynaron)8630P、代那隆(Dynaron)8600P、代那隆(Dynaron)8903P、代那隆(Dynaron)6201B、代那隆(Dynaron)1321P、代那隆(Dynaron)1320P、代那隆(Dynaron)2324P、代那隆(Dynaron)9901P(捷時雅(JSR)(股)製造),電化STR(Denka STR)系列(電氣化學工業(股)製造),可因塔克(Quintac)3520、可因塔克(Quintac)3433N、可因塔克(Quintac)3421、可因塔克(Quintac)3620、可因塔克(Quintac)3450、可因塔克(Quintac)3460(日本瑞翁(Zeon)製造),TPE-SB系列(住友化學(股)製造),拉巴隆(Rabalon)系列(三菱化學(股)製造),賽普頓(Septon)S1001、賽普頓(Septon)S8004、賽普頓(Septon)S4033、賽普頓(Septon)S2104、賽普頓(Septon)S8007、賽普頓(Septon)S2007、賽普頓(Septon)S2004、賽普頓(Septon)S2063、賽普頓(Septon)HG252、賽普頓(Septon)S8076、賽普頓(Septon)S2002、賽普頓(Septon)S1020、賽普
頓(Septon)S8104、賽普頓(Septon)S2005、賽普頓(Septon)S2006、賽普頓(Septon)S4055、賽普頓(Septon)S4044、賽普頓(Septon)S4077、賽普頓(Septon)S4099、賽普頓(Septon)S8006、賽普頓(Septon)V9461、海布拉(Hybrar)7311、海布拉(Hybrar)7125、海布拉(Hybrar)5127、海布拉(Hybrar)5125(以上為可樂麗(Kuraray)製造),蘇米弗萊克斯(Sumiflex)(住友電木(Sumitomo Bakelite)(股)製造),萊奧斯托馬(Leostomer)、愛克提馬(Actymer)(以上為理研乙烯基工業製造)等。
<<<聚酯系彈性體>>>
聚酯系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉使二羧酸或其衍生物與二醇化合物或其衍生物進行縮聚所得的聚酯系彈性體。
二羧酸例如可列舉:對苯二甲酸、間苯二甲酸、萘二羧酸等芳香族二羧酸及該些二羧酸的芳香核的氫原子經甲基、乙基、苯基等取代而成的芳香族二羧酸,己二酸、癸二酸、十二烷二羧酸等碳數2~20的脂肪族二羧酸,及環己烷二羧酸等脂環式二羧酸等。該些二羧酸可單獨使用一種,亦可併用兩種以上。
二醇化合物例如可列舉:乙二醇、1,3-丙二醇、1,4-丁二醇、1,6-己二醇、1,10-癸二醇、1,4-環己二醇等脂肪族二醇,脂環式二醇,下述結構式所表示的二元酚等。
[化2]
所述式中,YDO表示碳原子數1~10的伸烷基、碳原子數4~8的伸環烷基、-O-、-S-及-SO2-的任一個,或表示苯環彼此的直接鍵結(單鍵)。RDO1及RDO2分別獨立地表示鹵素原子或碳原子數1~12的烷基。pdo1及pdo2分別獨立地表示0~4的整數,ndo1表示0或1。
聚酯系彈性體的具體例可列舉:雙酚A、雙-(4-羥基苯基)甲烷、雙-(4-羥基-3-甲基苯基)丙烷、間苯二酚等。該些聚酯系彈性體可單獨使用一種,亦可併用兩種以上。
另外,亦可使用以芳香族聚酯(例如聚對苯二甲酸丁二酯)部分作為硬段(hard segment)成分、以脂肪族聚酯(例如聚四亞甲基二醇)部分作為軟段(soft segment)成分的多嵌段共聚物作為聚酯系彈性體。多嵌段共聚物中,可根據硬段與軟段的種類、比率及分子量的差異而列舉各種級別(grade)。具體例可列舉:海特萊(Hytrel)(東麗杜邦(Toray Dupont)(股)製造),佩爾普蘭(Pelprene)(東洋紡績(股)製造),普利馬羅(Primalloy)(三菱化學製造),奴貝蘭(Nouvelan)(帝人化成製造),艾斯佩爾(Espel)1612、艾斯佩爾(Espel)1620(日立化成工業(股)製造),普利馬羅(Primalloy)CP300(三菱化學公司製造)等。
<<<聚烯烴系彈性體>>>
聚烯烴系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉:乙烯、丙烯、1-丁烯、1-己烯、4-甲基-戊烯等碳數2~20的α-烯烴的共聚物等。例如可列舉乙烯-丙烯共聚物(EPR)、乙烯-丙烯-二烯共聚物(EPDM)等。另外可列舉:二環戊二烯、1,4-己二烯、環辛二烯、亞甲基降冰片烯、亞乙基降冰片烯、丁二烯、異戊二烯等碳數2~20的非共軛二烯與α-烯烴共聚物等。另外可列舉:於丁二烯-丙烯腈共聚物上共聚合甲基丙烯酸而成的羧基改質腈橡膠。具體可列舉:乙烯.α-烯烴共聚物橡膠、乙烯.α-烯烴-非共軛二烯共聚物橡膠、丙烯.α-烯烴共聚物橡膠、丁烯.α-烯烴共聚物橡膠等。
市售品可列舉:米拉斯托馬(Milastomer)(三井化學(股)製造)、賽墨蘭(Thermorun)(三菱化學製造)、愛克賽特(EXACT)(艾克森(Exxon)化學製造)、英佳吉(ENGAGE)(陶氏化學(The Dow Chemical)製造)、艾斯伯萊克斯(Espolex)(住友化學製造)、沙林(Sarlink)(東洋紡製造)、紐康(Newcon)(日本聚丙烯(Polypro)製造)、愛克賽林(EXCELINK)(捷時雅(JSR)製造)等。
<<<聚胺基甲酸酯系彈性體>>>
聚胺基甲酸酯系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉:含有包含低分子的二醇及二異氰酸酯的硬段、與包含高分子(長鏈)二醇及二異氰酸酯的軟段的結構單元的彈
性體等。
高分子(長鏈)二醇可列舉:聚丙二醇、聚四亞甲基氧化物、聚(1,4-伸丁基己二酸酯)、聚(伸乙基.1,4-伸丁基己二酸酯)、聚己內酯、聚(1,6-伸己基碳酸酯)、聚(1,6-伸己基.伸新戊基己二酸酯)等。高分子(長鏈)二醇的數量平均分子量較佳為500~10,000。
低分子的二醇可使用乙二醇、丙二醇、1,4-丁二醇、雙酚A等短鏈二醇。短鏈二醇的數量平均分子量較佳為48~500。
聚胺基甲酸酯系彈性體的市售品可列舉:潘德克斯(PANDEX)T-2185、潘德克斯(PANDEX)T-2983N(迪愛生(DIC)(股)製造)、美拉龍(Miractran)(日本美拉龍(Miractran)製造),愛拉絲托蘭(Elastollan)(巴斯夫(BASF)製造)、賴薩明(Resamine)(大日精化工業製造)、佩萊散(Pellethane)(陶氏化學(The Dow Chemical)製造)、愛昂來巴(IronRubber)(諾克(NOK)公司製造)、莫比龍(Mobilon)(日清紡化學(Nisshinbo Chemical)製造)等。
<<<聚醯胺系彈性體>>>
聚醯胺系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉:將聚醯胺-6、聚醯胺-11、聚醯胺-12等聚醯胺用於硬段且將聚氧乙烯、聚氧丙烯、聚四亞甲基二醇等聚醚及/或聚酯用於軟段的彈性體等。該彈性體大致分為聚醚嵌段醯胺型、聚醚酯嵌段醯胺型這兩種。
市售品可列舉:優貝(UBE)聚醯胺彈性體、優貝斯達
(UBESTA)XPA(宇部興產(股)製造),帶阿米德(Daiamide)(大賽璐-赫斯(Daicel-Huls)(股)製造),佩巴克斯(PEBAX)(東麗(Toray)(股)製造),葛麗倫(Grilon)ELY(日本艾曼斯(EMS-Group Japan)(股)製造),諾瓦米德(Novamid)(三菱化學(股)製造),葛麗拉克斯(Grilax)(迪愛生(DIC)(股)製造),聚醚酯醯胺PA-200、聚醚酯醯胺PA-201、聚醚酯醯胺TPAE-12、聚醚酯醯胺TPAE-32、聚酯醯胺TPAE-617、聚酯醯胺TPAE-617C(T&K托卡(T&K TOKA)(股)製造)等。
<<<聚醯亞胺系彈性體>>>
聚醯亞胺系彈性體並無特別限制,可根據目的而適當選擇。例如可較佳地使用:包含芳香族聚醯亞胺等工程塑膠(engineering plastic)、及作為軟段的分子量為幾百~千的聚醚或聚酯或聚烯烴等橡膠成分,且硬段與軟段交替縮聚而成的嵌段聚合物。市售品的具體例例如可列舉優貝斯達(UBESTA)XPA9040F1(宇部興產(股)製造)等。
<<<聚丙烯酸系彈性體>>>
聚丙烯酸系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉:以丙烯酸乙酯、丙烯酸丁酯、丙烯酸甲氧基乙酯、丙烯酸乙氧基乙酯等丙烯酸酯作為主成分的聚丙烯酸系彈性體,或丙烯酸酯與甲基丙烯酸縮水甘油酯、烯丙基縮水甘油醚等。更可列舉將丙烯腈或乙烯等交聯點單體共聚合而成的聚丙烯酸系彈性體等。具體可列舉:丙烯腈-丙烯酸丁酯共聚物、丙烯腈-丙烯酸
丁酯-丙烯酸乙酯共聚物、丙烯腈-丙烯酸丁酯-甲基丙烯酸縮水甘油酯共聚物等。
<<<矽酮系彈性體>>>
矽酮系彈性體並無特別限制,可根據目的而適當選擇。例如可列舉:以有機聚矽氧烷作為主成分的矽酮系彈性體,且其為聚二甲基矽氧烷系、聚甲基苯基矽氧烷系、聚二苯基矽氧烷等。市售品的具體例可列舉:KE系列(信越化學工業(股)製造)、SE系列、CY系列、SH系列(以上為東麗道康寧矽酮(Toray-Dow corning silicone)(股)製造)等。
<<<其他彈性體>>>
本發明中,可使用經橡膠改質的環氧樹脂(環氧系彈性體)作為彈性體。環氧系彈性體例如是藉由以下方式而獲得:利用兩末端羧酸改質型丁二烯-丙烯腈橡膠、末端胺基改質矽酮橡膠等,將雙酚F型環氧樹脂、雙酚A型環氧樹脂、水楊醛型環氧樹脂、苯酚酚醛清漆型環氧樹脂或甲酚酚醛清漆型環氧樹脂的一部分或全部的環氧基加以改質。
本發明的組成物較佳為於組成物中以25質量%以上的比例而含有彈性體,更佳為28質量%以上,進而更佳為30質量%以上。本發明的組成物因彈性體的溶解性良好,故可提高彈性體濃度。藉由提高組成物的彈性體濃度,可形成具有厚度的片等膜。
另外,較佳為本發明的組成物的總固體成分的80質量%以上為彈性體,更佳為85質量%以上。
彈性體亦可含有多種上述所列舉的種類。
另外,彈性體較佳為含有50質量%~100質量%的苯乙烯系彈性體,更佳為含有80質量%~100質量%,進而佳為含有90質量%~100質量%,進而更佳為含有95質量%~100質量%,尤佳為實質上僅由苯乙烯系彈性體所構成。
<<(B)通式(1)所表示的沸點為160℃以上的溶劑>>
本發明的組成物含有(B)通式(1)所表示的沸點為160℃以上的溶劑(以下亦稱為溶劑(B))。
通式(1)中,R1~R6分別獨立地表示氫原子或脂肪族烴基。
再者,通式(1)的R1~R6不相互鍵結。亦即,通式(1)所表示的化合物為單環的芳香族烴。
R1~R6所表示的脂肪族烴基可列舉烷基、烯基、炔基等,較佳為烷基。
烷基的碳數較佳為1~20,更佳為1~10,進而佳為1~5。烷基較佳為直鏈或分支。
烯基的碳數較佳為2~20,更佳為2~10,進而佳為2~5。烯基較佳為直鏈或分支。
炔基的碳數較佳為2~20,更佳為2~10,進而佳為2~5。炔基較佳為直鏈或分支。
R1~R6中較佳為2個~4個為脂肪族烴基,更佳為2個~3個為脂肪族烴基。
溶劑(B)的沸點為160℃以上,較佳為160℃~250℃,更佳為160℃~220℃。若為該範圍,則組成物的乾燥性良好。進而容易形成乾燥不均或厚度不均得到抑制的表面狀態良好的片等膜。
溶劑(B)的SP值(溶解度參數(solubility parameter))較佳為19(MPa)1/2以下,更佳為18.5(MPa)1/2以下。下限例如較佳為16.5(MPa)1/2以上。若溶劑(B)的SP值為19(MPa)1/2以下,則可進一步提高彈性體的溶解性。
再者,本發明中,SP值使用藉由Hoy法所得的值。Hoy法的文獻可較佳地列舉「H.L.霍伊:塗料技術雜誌(H.L.Hoy:J.Paint Tech.)」(42(540)、76-118(1970))或「SP值 基礎.應用與計算方法」(山本;資訊機構;2005)。
溶劑(B)的具體例可列舉:均三甲苯(mesitylene)(沸點165℃,SP值18.0(MPa)1/2)、對二異丙基苯(沸點210℃,
SP值17.6(MPa)1/2)、對二乙基苯(沸點181℃,SP值18.0(MPa)1/2)、間二乙基苯(沸點182℃,SP值17.8(MPa)1/2)、1,3,5-三乙基苯(沸點218℃,SP值18.0(MPa)1/2)等。
本發明的組成物較佳為於組成物中以50質量%~75質量%的比例而含有溶劑(B),更佳為55質量%~70質量%,進而更佳為60質量%~70質量%。若溶劑(B)的含量為所述範圍,則彈性體的溶解性及乾燥性良好。
<<(C)沸點小於120℃的溶劑>>
本發明的組成物含有(C)沸點小於120℃的溶劑(以下亦稱為溶劑(C))。
溶劑(C)的沸點小於120℃,較佳為110℃以下,進而更佳為105℃以下。下限較佳為60℃以上,更佳為65℃以上,進而佳為70℃以上。若為該範圍,則組成物的乾燥性良好。進而容易形成乾燥不均或厚度不均得到抑制的表面狀態良好的片等膜。
溶劑(C)的SP值較佳為19(MPa)1/2以下,更佳為18.5(MPa)1/2以下。下限例如較佳為16.5(MPa)1/2以上。若溶劑(C)的SP值為19(MPa)1/2以下,則可進一步提高彈性體的溶解性。
溶劑(C)可使用選自芳香族烴、脂環式烴及環狀醚中的一種以上。
芳香族烴可列舉甲苯(沸點111℃,SP值18.2(MPa)1/2)、苯(沸點80℃,SP值18.5(MPa)1/2)等。
脂環式烴可列舉環己烷(沸點81℃,SP值16.8(MPa)1/2)、甲基環己烷(沸點101℃,SP值16.0(MPa)1/2)等。
環狀醚可列舉四氫呋喃(沸點66℃,SP值19.5(MPa)1/2)等。
本發明的組成物較佳為於組成物中以5質量%~65質量%的比例而含有溶劑(C),更佳為5質量%~60質量%,進而更佳為10質量%~60質量%。若溶劑(C)的含量為所述範圍,則彈性體的溶解性及乾燥性良好。
本發明的組成物中溶劑(B)與溶劑(C)的質量比較佳為溶劑(B):溶劑(C)=80:20~99:1,更佳為85:15~99:1,進而佳為90:10~99:1。若溶劑(B)與溶劑(C)的質量比為所述範圍,則彈性體的溶解性良好,容易形成提高乾燥性並且表面狀態良好的片等膜。
<<抗氧化劑>>
本發明的組成物較佳為含有抗氧化劑。藉由含有抗氧化劑,可進一步提高所獲得的膜的耐熱性。進而容易形成層壓性優異的片等膜。
抗氧化劑可使用:酚系抗氧化劑、硫系抗氧化劑、磷系抗氧化劑、醌系抗氧化劑、胺系抗氧化劑等。
酚系抗氧化劑例如可列舉:對甲氧基苯酚、2,6-二-第三丁基-4-甲基苯酚,巴斯夫(BASF)(股)製造的「易加樂斯(Irganox)(註冊商標)1010」、「易加樂斯(Irganox)(註冊商標)1330」、「易
加樂斯(Irganox)(註冊商標)3114」、「易加樂斯(Irganox)(註冊商標)1035」,住友化學(股)製造的「蘇米萊澤(Sumilizer)(註冊商標)MDP-S」、「蘇米萊澤(Sumilizer)(註冊商標)GA-80」等。
硫系抗氧化劑例如可列舉:3,3'-硫代二丙酸二硬脂酯,住友化學(股)製造的「蘇米萊澤(Sumilizer)(註冊商標)TPM」、「蘇米萊澤(Sumilizer)(註冊商標)TPS」、「蘇米萊澤(Sumilizer)(註冊商標)TP-D」等。
磷系抗氧化劑例如可列舉:亞磷酸三(2,4-二-第三丁基苯基)酯、雙(2,4-二-第三丁基苯基)季戊四醇二亞磷酸酯、聚(二丙二醇)苯基亞磷酸酯、亞磷酸二苯基異癸基酯、亞磷酸-2-乙基己基二苯基酯、亞磷酸三苯酯,巴斯夫(BASF)(股)製造的「豔佳佛(Irgafos)(註冊商標)168」、「豔佳佛(Irgafos)(註冊商標)38」等。
醌系抗氧化劑例如可列舉對苯醌、2-第三丁基-1,4-苯醌等。
胺系抗氧化劑例如可列舉二甲基苯胺或啡噻嗪等。
抗氧化劑較佳為易加樂斯(Irganox)(註冊商標)1010、易加樂斯(Irganox)(註冊商標)1330、3,3'-硫代二丙酸二硬脂酯、蘇米萊澤(Sumilizer)(註冊商標)TP-D,更佳為易加樂斯(Irganox)(註冊商標)1010、易加樂斯(Irganox)(註冊商標)1330,尤佳為易加樂斯(Irganox)(註冊商標)1010。
另外,所述抗氧化劑中,較佳為將酚系抗氧化劑與硫系抗氧化劑或磷系抗氧化劑併用,最佳為將酚系抗氧化劑與硫系抗氧化
劑併用。尤其於使用聚苯乙烯系彈性體作為彈性體的情形時,較佳為將酚系抗氧化劑與硫系抗氧化劑併用。藉由設定為此種組合,可期待可高效地抑制由氧化反應所致的彈性體的劣化的效果。進而容易形成層壓性優異的片等膜。
於將酚系抗氧化劑與硫系抗氧化劑併用的情形時,酚系抗氧化劑與硫系抗氧化劑的質量比較佳為酚系抗氧化劑:硫系抗氧化劑=95:5~5:95,更佳為25:75~75:25。若為該範圍,則可有效地防止將膜暴露於高溫下時的分解。
抗氧化劑的組合較佳為易加樂斯(Irganox)(註冊商標)1010與蘇米萊澤(Sumilizer)(註冊商標)TP-D、易加樂斯(Irganox)(註冊商標)1330與蘇米萊澤(Sumilizer)(註冊商標)TP-D、及蘇米萊澤(Sumilizer)(註冊商標)GA-80與蘇米萊澤(Sumilizer)(註冊商標)TP-D,更佳為易加樂斯(Irganox)(註冊商標)1010與蘇米萊澤(Sumilizer)(註冊商標)TP-D、易加樂斯(Irganox)(註冊商標)1330與蘇米萊澤(Sumilizer)(註冊商標)TP-D,尤佳為易加樂斯(Irganox)(註冊商標)1010與蘇米萊澤(Sumilizer)(註冊商標)TP-D。
就防止加熱中的昇華的觀點而言,抗氧化劑的分子量較佳為400以上,更佳為600以上,尤佳為750以上。
抗氧化劑較佳為以1質量%~7質量%的比例而含有於組成物中。下限更佳為1.2質量%以上,進而佳為1.5質量%以上。上限較佳為6質量%以下,進而佳為5質量%以下。若為該範圍,
則容易形成表面狀態良好且耐熱性及層壓性優異的片等膜。
抗氧化劑可僅為一種,亦可為兩種以上。於抗氧化劑為兩種以上的情形時,較佳為其合計為所述範圍。
<<<高分子化合物>>>
本發明的組成物視需要亦可含有除上文所述的彈性體以外的高分子化合物。
本發明中,高分子化合物可使用任意者。高分子化合物為重量平均分子量為2000以上的化合物,通常為不含聚合性基的化合物。高分子化合物的重量平均分子量較佳為10,000~1,000,000,進而佳為50,000~500,000,更佳為100,000~300,000。
高分子化合物的具體例例如可列舉:烴樹脂、酚醛清漆樹脂、酚樹脂、環氧樹脂、三聚氰胺樹脂、脲樹脂、不飽和聚酯樹脂、醇酸樹脂、聚氯乙烯樹脂、聚乙酸乙烯酯樹脂、鐵氟龍(Teflon)(註冊商標)、聚醯胺樹脂、聚縮醛樹脂、聚碳酸酯樹脂、聚對苯二甲酸丁二酯樹脂、聚對苯二甲酸乙二酯樹脂、聚碸樹脂、聚醚碸樹脂、聚芳酯樹脂等合成樹脂,或天然橡膠等天然樹脂。其中,較佳為烴樹脂、酚醛清漆樹脂,更佳為烴樹脂。高分子化合物視需要亦可組合使用兩種以上。
烴樹脂可任意使用。
烴樹脂是指基本上僅包含碳原子及氫原子的樹脂,但若基本骨架為烴樹脂,則亦可含有其他原子作為側鏈。即,除了僅包含碳原子及氫原子的烴樹脂以外,如丙烯酸系樹脂、聚乙烯醇樹脂、
聚乙烯基縮醛樹脂、聚乙烯基吡咯啶酮樹脂般烴基以外的官能基直接鍵結於主鏈的情形亦包含在本發明的烴樹脂中,於該情形時,相對於樹脂的所有重複單元,烴基直接鍵結於主鏈而成的重複單元的含量較佳為30mol%(莫耳百分比)以上。
符合所述條件的烴樹脂例如可列舉:萜烯樹脂、萜烯酚樹脂、改質萜烯樹脂、氫化萜烯樹脂、氫化萜烯酚樹脂、松香、松香酯、氫化松香、氫化松香酯、聚合松香、聚合松香酯、改質松香、松香改質酚樹脂、烷基酚樹脂、脂肪族石油樹脂、芳香族石油樹脂、氫化石油樹脂、改質石油樹脂、脂環族石油樹脂、薰草咔(coumarone)石油樹脂、茚石油樹脂、聚苯乙烯-聚烯烴共聚物、烯烴聚合物(例如甲基戊烯共聚物)、及環烯烴聚合物(例如降冰片烯共聚物、二環戊二烯共聚物、四環十二烯共聚物)等。
其中,烴樹脂較佳為萜烯樹脂、松香、石油樹脂、氫化松香、聚合松香、烯烴聚合物或環烯烴聚合物,更佳為萜烯樹脂、松香、烯烴聚合物或環烯烴聚合物,尤佳為環烯烴聚合物。
環烯烴聚合物可列舉:降冰片烯系聚合物、單環的環狀烯烴的聚合物、環狀共軛二烯的聚合物、乙烯基脂環式烴聚合物及該些聚合物的氫化物(hydride)等。環烯烴聚合物的較佳例可列舉:含有至少一種下述通式(II)所表示的重複單元的加成(共)聚合物、及更含有至少一種通式(I)所表示的重複單元而成的加成(共)聚合物。另外,環烯烴聚合物的其他較佳例可列舉含有至少一種通式(III)所表示的環狀重複單元的開環(共)聚合物。
式中,m表示0~4的整數。R1~R6分別表示氫原子或碳數1~10的烴基,X1~X3及Y1~Y3分別表示氫原子、碳數1~10的烴基、鹵素原子、經鹵素原子取代的碳數1~10的烴基、-(CH2)nCOOR11、-(CH2)nOCOR12、-(CH2)nNCO、-(CH2)nNO2、-(CH2)nCN、-(CH2)nCONR13R14、-(CH2)nNR15R16、-(CH2)nOZ、-(CH2)nW,或者由X1與Y1、X2與Y2或X3與Y3所構成的(-CO)2O、(-CO)2NR17。R11、R12、R13、R14、R15、R16及R17分別表示氫原子或烴基(較佳為碳數1~20的烴基),Z表示烴基或經鹵素取代的烴基,W表示SiR18 pD3-p(R18表示碳數1~10的烴基,D表示鹵素原子,表示-OCOR18或-OR18,p表示0~3的整數)。n表示0~10的整數。
降冰片烯系聚合物是揭示於日本專利特開平10-7732號公報、日本專利特表2002-504184號公報、US2004/229157A1號公報或WO2004/070463A1號公報等中。降冰片烯系聚合物可藉由使降冰片烯系多環狀不飽和化合物彼此進行加成聚合而獲得。另
外,視需要亦可使降冰片烯系多環狀不飽和化合物與以下化合物進行加成聚合:乙烯、丙烯、丁烯;丁二烯、異戊二烯般的共軛二烯;亞乙基降冰片烯般的非共軛二烯。該降冰片烯系聚合物是由三井化學(股)以愛佩爾(APL)的商品名而銷售,有玻璃轉移溫度(Tg)不同的例如愛佩爾(APL)8008T(Tg為70℃)、愛佩爾(APL)6013T(Tg為125℃)或愛佩爾(APL)6015T(Tg為145℃)等級別。由寶理塑膠(Poly plastics)(股)銷售托帕斯(TOPAS)8007、托帕斯(TOPAS)5013、托帕斯(TOPAS)6013、托帕斯(TOPAS)6015等的顆粒。進而,由費拉尼亞(Ferrania)公司銷售愛比亞(Appear)3000。
如日本專利特開平1-240517號公報、日本專利特開平7-196736號公報、日本專利特開昭60-26024號公報、日本專利特開昭62-19801號公報、日本專利特開2003-1159767號公報或日本專利特開2004-309979號公報等所揭示般,降冰片烯系聚合物的氫化物可藉由使多環狀不飽和化合物進行加成聚合或複分解(metathesis)開環聚合後,加以氫化而製造。
通式(III)中,R5及R6較佳為氫原子或甲基,X3及Y3較佳為氫原子,其他基團可適當選擇。該降冰片烯系聚合物是由捷時雅(JSR)(股)以雅頓(Arton)G或雅頓(Arton)F等商品名而銷售,另外由日本瑞翁(Zeon)(股)以瑞奧(Zeonor)ZF14、瑞奧(Zeonor)ZF16、瑞諾(Zeonex)250、瑞諾(Zeonex)280、瑞諾(Zeonex)480R等商品名而市售,可使用該些商品。
於本發明的組成物含有高分子化合物的情形時,相對於本發明的組成物的總固體成分,高分子化合物的含量較佳為5質量%以上,更佳為10質量%以上,進而佳為20質量%以上。另外,相對於本發明的組成物的總固體成分,高分子化合物的含量的上限較佳為70質量%以下,更佳為60質量%以下,進而佳為50質量%以下,尤佳為40質量%以下。
本發明的組成物亦可設定為實質上不含彈性體以外的高分子化合物的構成。所謂「實質上不含高分子化合物」,例如相對於彈性體的總固體成分,高分子化合物的含量較佳為1質量%以下,更佳為0.1質量%以下,進而更佳為不含高分子化合物。
<<<界面活性劑>>>
本發明的組成物亦可含有界面活性劑。界面活性劑可使用氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑、矽酮系界面活性劑等各種界面活性劑,較佳為氟系界面活性劑。藉由含有界面活性劑,溶液特性(特別是流動性)提高,於塗佈形成接著膜的情形時,可進一步改善塗佈厚度的均勻性或省液性。
氟系界面活性劑的氟含有率較佳為3質量%~40質量%,更佳為5質量%~30質量%,進而佳為7質量%~25質量%。氟含有率為該範圍內的氟系界面活性劑於塗佈膜的厚度的均勻性或省液性的方面有效果。進而,溶解性亦良好。
氟系界面活性劑例如可列舉:迪愛生(DIC)(股)製造
的美佳法(Megafac)F-251、美佳法(Megafac)F-281、美佳法(Megafac)F-430、美佳法(Megafac)F-444、美佳法(Megafac)F-477、美佳法(Megafac)F-510、美佳法(Megafac)F-552、美佳法(Megafac)F-553、美佳法(Megafac)F-554、美佳法(Megafac)F-555、美佳法(Megafac)F-556、美佳法(Megafac)F-557、美佳法(Megafac)F-558、美佳法(Megafac)F-559、美佳法(Megafac)F-560、美佳法(Megafac)F-561、美佳法(Megafac)F-562、美佳法(Megafac)F-563、美佳法(Megafac)F-565、美佳法(Megafac)F-567、美佳法(Megafac)F-568、美佳法(Megafac)F-569、美佳法(Megafac)F-570、美佳法(Megafac)F-571、美佳法(Megafac)R-40、美佳法(Megafac)R-41、美佳法(Megafac)R-43、美佳法(Megafac)R-94,住友3M(股)製造的FC-4430、FC-4432,AGC清美化學(AGC Seimi Chemical)(股)製造的沙福隆(Surflon)S-242、沙福隆(Surflon)S-243、沙福隆(Surflon)S-386、沙福隆(Surflon)S-651、沙福隆(Surflon)S-611、沙福隆(Surflon)S-420,歐諾法(OMNOVA)公司製造的PF-636、PF-656、PF-6320、PF-6520、PF-7002等。
非離子系界面活性劑可列舉:甘油、三羥甲基丙烷、三羥甲基乙烷以及該些化合物的乙氧基化物及丙氧基化物(例如丙氧基化甘油、乙氧基化甘油等)、聚氧伸乙基月桂基醚、聚氧伸乙基硬脂基醚、聚氧伸乙基油基醚、聚氧伸乙基辛基苯基醚、聚氧伸乙基壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯
等。
陽離子系界面活性劑可列舉:森下產業(股)製造的EFKA-745,共榮社化學(股)製造的寶理弗洛(Polyflow)No.75、No.90、No.95等。
矽酮系界面活性劑可列舉:邁圖高新材料日本有限公司(Momentive Performance Materials Japan LLC)製造的TSF-4440、TSF-4300、TSF-4445、TSF-4460、TSF-4452,信越矽酮(股)製造的KP-341、KF-6001、KF-6002,畢克化學(BYK Chemie)(股)製造的BYK-307、BYK-323、BYK-330等。
於本發明的組成物含有界面活性劑的情形時,界面活性劑較佳為以0.001質量%~2.0質量%的比例而含有於本發明的組成物中,更佳為0.005質量%~1.0質量%。
界面活性劑可僅為一種,亦可為兩種以上。於界面活性劑為兩種以上的情形時,較佳為其合計為所述範圍。
<<其他添加劑>>
本發明的組成物可於不損及本發明的效果的範圍內,視需要而調配各種添加物,例如硬化劑、硬化觸媒、填充劑、密接促進劑、紫外線吸收劑、抗凝聚劑等。於調配該些添加劑的情形時,其合計調配量較佳為組成物的總固體成分的3質量%以下。
<組成物的製備>
本發明的組成物可混合所述各成分來製備。通常於0℃~100℃的範圍下進行各成分的混合。另外,於混合各成分後,例如
較佳為藉由過濾器進行過濾。過濾可以多階段來進行亦可重複進行多次。另外,亦可對經過濾的液體進行再過濾。
過濾器只要為一直以來用於過濾用途等的過濾器,則可無特別限定地使用。例如可列舉由聚四氟乙烯(polytetrafluoroethylene,PTFE)等氟樹脂;尼龍-6、尼龍-6,6等聚醯胺系樹脂;聚乙烯、聚丙烯(polypropylene,PP)等聚烯烴樹脂(包含高密度、超高分子量)等而得的過濾器。該些原材料中,較佳為聚丙烯(包含高密度聚丙烯)及尼龍。
過濾器的孔徑例如適宜為0.003μm~5.0μm左右。藉由設為該範圍,而可抑制過濾堵塞,且可確實地去除組成物中所含的雜質或凝聚物等微細的異物。
於使用過濾器時,亦可將不同的過濾器組合。此時,利用第1過濾器的過濾可僅進行一次,亦可進行兩次以上。於將不同的過濾器組合而進行兩次以上的過濾的情形時,較佳為第2次以後的孔徑與第1次過濾的孔徑相同或較第1次過濾的孔徑小。另外,亦可將於所述範圍內孔徑不同的第1過濾器組合。此處的孔徑可參照過濾器廠商(filter maker)的標稱值。市售的過濾器例如可自日本頗爾(pall)股份有限公司、愛德萬東洋(Advantec Toyo)股份有限公司、日本英特格(Entegris)股份有限公司(原日本密科理(Mykrolis)股份有限公司)或北澤微濾器(KITZ Micro Filter)股份有限公司等提供的各種過濾器中選擇。
本發明的組成物較佳為固體成分濃度為25質量%~40質量
%。下限更佳為26質量%以上,進而佳為27質量%以上。上限更佳為38質量%以下,進而佳為36質量%以下。
本發明的組成物的彈性體的溶解性良好,可提高固體成分濃度。藉由將固體成分濃度設為所述範圍,亦可形成具有厚度的片。
<片、積層體、片的製造方法>
本發明的片的製造方法包括將所述組成物施用於支撐體上,並使其乾燥的步驟。
另外,本發明的片是使所述組成物乾燥而獲得者。
另外,本發明的積層體於使所述組成物乾燥而獲得的片的單面或兩面上具有具備脫模性的支撐體。
以下,使用本發明的片的製造方法亦一併對片及積層體進行說明。
於本發明的片的製造方法中,組成物的施用方法可列舉:利用壓力自狹縫狀的開口中擠出組成物而施用的方法;利用凹版或網紋輥轉印組成物而施用的方法;一面自噴霧器(spray)或分注器(dispenser)中噴出組成物一面掃描而施用的方法;將組成物蓄積於槽(tank)中,使支撐體於其中通過,由此進行浸漬塗佈的方法;利用線棒一面推動組成物一面刮取,由此而施用的方法等。
施用組成物的支撐體可列舉轉筒(drum)、帶(band)等。另外,支撐體亦可使用脫模膜(具有脫模性的支撐體)。
將組成物施用於支撐體上後,加以乾燥而成為經固體化
的片後,將片自支撐體上機械剝離,由此可獲得單體的片(膜)。
乾燥條件較佳為於100℃~210℃下進行120秒~900秒。乾燥溫度更佳為105℃~200℃,進而佳為110℃~190℃。乾燥時間更佳為150秒~800秒,進而佳為180秒~600秒。
乾燥亦可分成兩階段而階段性地提升溫度來實施。
另外,於使用脫模膜作為供施用組成物的支撐體的情形時,亦可不將片自支撐體上剝離而殘留,製成帶有脫模膜的片(積層體)。
藉由連續地進行該些處理,可獲得輥狀的長條片。長條片的長度並無特別限定,下限例如較佳為5000mm以上,更佳為1000mm以上。上限例如較佳為500000mm以下,更佳為200000mm以下。
另外,亦可於片的兩面上貼合脫模膜(具有脫模性的支撐體),製成兩面帶有脫模膜的片(積層體)。
藉由於膜的單面或兩面上貼合脫模膜,可防止對片的表面造成損傷、或於保管中貼附的困擾(trouble)。脫模膜可於使用時剝離去除。例如於在兩面上貼合有脫模膜的情形時,可將單面的脫模膜剝下,將片表面層壓於元件晶圓或支撐體等上後,將剩餘的脫模膜剝下,由此可儘可能地保持片表面的清潔。
本發明中,片的平均厚度並無特別限定,例如較佳為40μm~140μm,更佳為50μm~130μm,進而佳為60μm~120μm。若片的平均厚度為所述範圍,則對元件晶圓的表面形狀的追隨性
良好,可均勻地貼合於元件晶圓的元件面。進而,亦不易產生暫時接著後的加工時的逸氣增加、或貼合時的偏移等。
再者,本發明中,片的平均厚度是定義為藉由測微計(micrometer)在沿著片的一方向的剖面中自一個端面向另一端面以等間隔對5處的厚度進行測定所得的值的平均值。
再者,本發明中,所謂「沿著片的一方向的剖面」,於片為多邊形狀的情形時,是指與長邊方向正交的剖面。另外,於片為正方形狀的情形時,是指與任一邊正交的剖面。另外,於片為圓形或橢圓形的情形時,是指通過重心的剖面。
片較佳為於沿著片的一方向的剖面中,最大膜厚與最小膜厚之差為平均膜厚的10%以下,更佳為5%以下。
本發明中,片的溶劑含有率較佳為1質量%以下,更佳為0.1質量%以下,理想的是實質上不含有,例如為0質量%。
<接著性支撐基板>
繼而,對使用本發明的片的接著性支撐基板加以說明。
接著性支撐基板於支撐基板的表面上具有本發明的片。
可於支撐基板上層壓上文所述的本發明的片而形成暫時接著用積層體。例如可列舉:將片安置於真空層壓機中,利用該裝置使片位於支撐基板上,於真空下使片與支撐基板接觸,利用輥等壓接而將片固定(積層)於支撐基板上的方法等。另外,固定於支撐基板的片亦可切割成例如圓形狀等所需形狀。
接著性支撐基板中,支撐基板並無特別限定,例如可列
舉矽基板、玻璃基板、金屬基板、化合物半導體基板等。其中,鑒於不易污染作為半導體裝置的基板而代表性地使用的矽基板的方面、或可使用於半導體裝置的製造步驟中廣泛使用的靜電夾盤(chuck)的方面等,較佳為矽基板。
支撐基板的厚度並無特別限定,例如較佳為300μm~100mm,更佳為300μm~10mm。
亦可於支撐基板的表面上設置脫模層。脫模層較佳為含有氟原子及/或矽原子的低表面能量層,較佳為具有含有氟原子及/或矽原子的材料。脫模層的氟含有率較佳為30質量%~80質量%,更佳為40質量%~76質量%,尤佳為60質量%~75質量%。
<帶有元件晶圓的積層體>
繼而,對本發明的帶有元件晶圓的積層體加以說明。
本發明的帶有元件晶圓的積層體是於元件晶圓與支撐基板之間具有上文所述的本發明的片,且片的一個表面與元件晶圓的元件面接觸,另一表面與支撐基板的表面接觸。
元件晶圓可無限制地使用公知者,例如可列舉矽基板、化合物半導體基板等。化合物半導體基板的具體例可列舉:SiC基板、SiGe基板、ZnS基板、ZnSe基板、GaAs基板、InP基板、GaN基板等。
亦可於元件晶圓的表面上形成有機械結構或電路。形成有機械結構或電路的元件晶圓例如可列舉:微機電系統(Micro Electro Mechanical Systems,MEMS)、功率元件、影像感測器(image
sensor)、微感測器(microsensor)、發光二極體(Light Emitting Diode,LED)、光學元件、內插器(interposer)、嵌埋型元件、微元件等。
元件晶圓較佳為具有金屬岸堤(bank)等結構。根據本發明,對於表面上具有結構的元件晶圓,亦可穩定地暫時接著,並且可容易地解除對元件晶圓的暫時接著。結構的高度並無特別限定,例如較佳為1μm~150μm,更佳為5μm~100μm。
實施機械處理或化學處理之前的元件晶圓的膜厚較佳為500μm以上,更佳為600μm以上,進而佳為700μm以上。上限例如較佳為2000μm以下,更佳為1500μm以下。
實施機械處理或化學處理而薄膜化後的元件晶圓的膜厚例如較佳為小於500μm,更佳為400μm以下,進而佳為300μm以下。下限例如較佳為1μm以上,更佳為5μm以上。
於本發明的帶有元件晶圓的積層體中,支撐基板與上文所述的接著性支撐基板中說明的支撐基板為相同含意,較佳範圍亦相同。
本發明的帶有元件晶圓的積層體亦可於支撐基板與元件晶圓之間配置上文所述的本發明的片,進行加熱壓接而製造。
<半導體裝置的製造方法>
以下,一面參照圖1,一面對經過製造帶有元件晶圓的積層體的步驟的半導體裝置的製造方法的一實施形態加以說明。再者,本發明不限定於以下的實施形態。
圖1的(A)~圖1的(E)分別為對支撐基板與元件晶圓的暫時接著加以說明的概略剖面圖(圖1的(A)、圖1的(B))、表示暫時接著於支撐基板上的元件晶圓經薄型化的狀態(圖1的(C))、將支撐基板與元件晶圓剝離的狀態(圖1的(D))、自元件晶圓上去除接著層後的狀態(圖1的(E))的概略剖面圖。
該實施形態中,如圖1的(A)所示,首先準備於支撐基板12上設置片11而成的接著性支撐基板100。接著性支撐基板100可利用上文所述的方法來製造。接著性支撐基板100較佳為實質上不含溶劑的態樣。
元件晶圓60是於矽基板61的表面61a上設置多個元件晶片62而成。
矽基板61的厚度例如較佳為200μm~1200μm。元件晶片62例如較佳為金屬結構體,高度較佳為10μm~100μm。
繼而,如圖1的(B)所示,使接著性支撐基板100與元件晶圓60壓接,使支撐基板12與元件晶圓60暫時接著。
片11較佳為將元件晶片62完全覆蓋,於將元件晶片的高度設為Xμm、片的厚度設為Yμm的情形時,較佳為滿足「X+100≧Y>X」的關係。
片11將元件晶片62完全被覆的情況於欲進一步減小薄型元件晶圓的總厚度變動(Total Thickness Variation,TTV)的情形(即,欲進一步提高薄型元件晶圓的平坦性的情形)時有效。
即,於將元件晶圓加以薄型化時,藉由利用片11來保護多個
元件晶片62,可使與支撐基板12的接觸面中幾乎不存在凹凸形狀。因此,即便於如此般支撐的狀態下加以薄型化,亦減少將來源於多個元件晶片62的形狀轉印至薄型元件晶圓的背面61b1之虞,結果可進一步減小最終獲得的薄型元件晶圓的TTV。
繼而,如圖1的(C)所示,對矽基板61的背面61b實施機械處理或化學處理(並無特別限定,例如研削(grinding)或化學機械研磨(Chemical-Mechanical Polishing,CMP)等薄膜化處理,化學氣相成長(Chemical Vapor Deposition,CVD)或物理氣相成長(Physical Vapor Deposition,PVD)等高溫.真空下的處理,使用有機溶劑、酸性處理液或鹼性處理液等化學品的處理,鍍敷處理,光化射線的照射,加熱.冷卻處理等),如圖1的(C)所示,使矽基板61的厚度變薄(例如較佳為平均厚度小於500μm,更佳為1μm~200μm),獲得薄型元件晶圓60a。
另外,亦可進行以下處理作為機械處理或化學處理:於薄膜化處理後,形成自薄型元件晶圓60a的背面61b1貫穿矽基板的貫通孔(未圖示),於該貫通孔內形成矽貫通電極(未圖示)。具體而言,加熱處理中的最高到達溫度較佳為130℃~400℃,更佳為180℃~350℃。加熱處理的最高到達溫度較佳為設定為低於片的軟化點的溫度。加熱處理較佳為最高到達溫度下的30秒鐘~30分鐘的加熱,更佳為最高到達溫度下的1分鐘~10分鐘的加熱。
繼而,如圖1的(D)所示,使支撐基板12自薄型元件晶圓60a脫離。脫離的方法並無特別限定,較佳為不進行任何處
理而自薄型元件晶圓60a的端部相對於薄型元件晶圓60a沿垂直方向上拉而剝離。此時,關於剝離界面,較佳為於支撐基板12與片11的界面上剝離。於該情形時,若將支撐基板12與片11的界面的剝離強度設為A、元件晶圓表面61a與片11的剝離強度設為B,則較佳為滿足以下的式子。
A<B....式(1)
另外,亦可使片11與後述剝離液接觸,其後,視需要使薄型元件晶圓60a相對於支撐基板12而滑動後,自薄型元件晶圓60a的端部相對於元件晶圓沿垂直方向上拉而剝離。
<剝離液>
以下,對剝離液加以詳細說明。
剝離液可使用水及溶劑(有機溶劑)。
另外,剝離液較佳為溶解片11的有機溶劑。有機溶劑例如可列舉:脂肪族烴類(己烷、庚烷,艾索帕(Isopar)E、艾索帕(Isopar)H、艾索帕(Isopar)G(埃索化學(Esso Chemical)(股)製造)等)、芳香族烴類(甲苯、二甲苯等)、鹵化烴(二氯甲烷、二氯乙烯、三氯乙烯、單氯苯等)、極性溶劑。極性溶劑可列舉:醇類(甲醇、乙醇、丙醇、異丙醇、1-丁醇、1-戊醇、1-己醇、1-庚醇、1-辛醇、2-辛醇、2-乙基-1-己醇、1-壬醇、1-癸醇、苄醇、乙二醇單甲醚、2-乙氧基乙醇、二乙二醇單乙醚、二乙二醇單己醚、三
乙二醇單甲醚、丙二醇單乙醚、丙二醇單甲醚、聚乙二醇單甲醚、聚丙二醇、四乙二醇、乙二醇單丁醚、乙二醇單苄醚、乙二醇單苯醚、丙二醇單苯醚、甲基苯基原醇、正戊醇、甲基戊醇等)、酮類(丙酮、甲基乙基酮、乙基丁基酮、甲基異丁基酮、環己酮等)、酯類(乙酸乙酯、乙酸丙酯、乙酸丁酯、乙酸戊酯、乙酸苄酯、乳酸甲酯、乳酸丁酯、乙二醇單丁基乙酸酯、丙二醇單甲醚乙酸酯、二乙二醇乙酸酯、鄰苯二甲酸二乙酯、乙醯丙酸丁酯等)、其他(磷酸三乙酯、磷酸三甲苯酯、N-苯基乙醇胺、N-苯基二乙醇胺、N-甲基二乙醇胺、N-乙基二乙醇胺、4-(2-羥基乙基)嗎啉、N,N-二甲基乙醯胺、N-甲基吡咯啶酮等)等。
進而,就剝離性的觀點而言,剝離液亦可含有鹼、酸及界面活性劑。於調配該些成分的情形時,調配量分別較佳為剝離液的0.1質量%~5.0質量%。
進而,就剝離性的觀點而言,將兩種以上的有機溶劑及水、兩種以上的鹼、酸及界面活性劑混合的形態亦較佳。
鹼例如可使用:磷酸三鈉、磷酸三鉀、磷酸三銨、磷酸氫二鈉、磷酸氫二鉀、磷酸氫二銨、碳酸鈉、碳酸鉀、碳酸銨、碳酸氫鈉、碳酸氫鉀、碳酸氫銨、硼酸鈉、硼酸鉀、硼酸銨、氫氧化鈉、氫氧化銨、氫氧化鉀及氫氧化鋰等無機鹼劑,或單甲胺、二甲胺、三甲胺、單乙胺、二乙胺、三乙胺、單異丙胺、二異丙胺、三異丙胺、正丁胺、單乙醇胺、二乙醇胺、三乙醇胺、單異丙醇胺、二異丙醇胺、伸乙基亞胺、乙二胺、吡啶、氫氧化四甲
基銨等有機鹼劑。該些鹼劑可單獨使用或組合使用兩種以上。
酸可使用:鹵化氫、硫酸、硝酸、磷酸、硼酸等無機酸,或甲磺酸、乙磺酸、苯磺酸、對甲苯磺酸、三氟甲磺酸、乙酸、檸檬酸、甲酸、葡萄糖酸、乳酸、草酸、酒石酸等有機酸。
界面活性劑可使用陰離子系、陽離子系、非離子系、兩性離子系的界面活性劑。於該情形時,相對於鹼性水溶液的總量,界面活性劑的含量較佳為1質量%~20質量%,更佳為1質量%~10質量%。
藉由將界面活性劑的含量設定為所述範圍內,有可進一步提高片11與薄型元件晶圓60a的剝離性的傾向。
陰離子系界面活性劑並無特別限定,可列舉:脂肪酸鹽類、松香酸鹽類、羥基烷烴磺酸鹽類、烷烴磺酸鹽類、二烷基磺基琥珀酸鹽類、直鏈烷基苯磺酸鹽類、分支鏈烷基苯磺酸鹽類、烷基萘磺酸鹽類、烷基二苯基醚(二)磺酸鹽類、烷基苯氧基聚氧伸乙基烷基磺酸鹽類、聚氧伸乙基烷基磺基苯基醚鹽類、N-烷基-N-油基牛磺酸鈉類、N-烷基磺基琥珀酸單醯胺二鈉鹽類、石油磺酸鹽類、硫酸化蓖麻油、硫酸化牛脂油、脂肪酸烷基酯的硫酸酯鹽類、烷基硫酸酯鹽類、聚氧伸乙基烷基醚硫酸酯鹽類、脂肪酸單甘油酯硫酸酯鹽類、聚氧伸乙基烷基苯基醚硫酸酯鹽類、聚氧伸乙基苯乙烯基苯基醚硫酸酯鹽類、烷基燐酸酯鹽類、聚氧伸乙基烷基醚燐酸酯鹽類、聚氧伸乙基烷基苯基醚燐酸酯鹽類、苯乙烯-馬來酸酐共聚物的部分皂化物類、烯烴-馬來酸酐共聚物的部分皂
化物類、萘磺酸鹽福馬林縮合物類等。其中,可較佳地使用烷基苯磺酸鹽類、烷基萘磺酸鹽類、烷基二苯基醚(二)磺酸鹽類。
陽離子系界面活性劑並無特別限定,可使用以前公知的陽離子系界面活性劑。例如可列舉烷基胺鹽類、四級銨鹽類、烷基咪唑鎓鹽、聚氧伸乙基烷基胺鹽類、聚乙烯多胺衍生物。
非離子系界面活性劑並無特別限定,可列舉:聚乙二醇型的高級醇環氧乙烷加成物、烷基苯酚環氧乙烷加成物、烷基萘酚環氧乙烷加成物、苯酚環氧乙烷加成物、萘酚環氧乙烷加成物、脂肪酸環氧乙烷加成物、多元醇脂肪酸酯環氧乙烷加成物、高級烷基胺環氧乙烷加成物、脂肪酸醯胺環氧乙烷加成物、油脂的環氧乙烷加成物、聚丙二醇環氧乙烷加成物、二甲基矽氧烷-環氧乙烷嵌段共聚物、二甲基矽氧烷-(環氧丙烷-環氧乙烷)嵌段共聚物、多元醇型的甘油的脂肪酸酯、季戊四醇的脂肪酸酯、山梨醇及山梨醇酐的脂肪酸酯、蔗糖的脂肪酸酯、多元醇的烷基醚、烷醇胺類的脂肪酸醯胺等。其中,較佳為具有芳香環及環氧乙烷鏈,更佳為經烷基取代或未經取代的苯酚環氧乙烷加成物或者經烷基取代或未經取代的萘酚環氧乙烷加成物。
兩性離子系界面活性劑並無特別限定,可列舉:烷基二甲基氧化胺等氧化胺系、烷基甜菜鹼等甜菜鹼系、烷基胺基脂肪酸鈉等胺基酸系。尤其可較佳地使用可具有取代基的烷基二甲基氧化胺、可具有取代基的烷基羧基甜菜鹼、可具有取代基的烷基磺基甜菜鹼。具體可使用:日本專利特開2008-203359號公報的
段落編號[0256]的式(2)所表示的化合物,日本專利特開2008-276166號公報的段落編號[0028]的式(I)、式(II)、式(VI)所表示的化合物,日本專利特開2009-47927號公報的段落編號[0022]~段落編號[0029]所表示的化合物。
進而,視需要亦可含有如消泡劑及硬水軟化劑般的添加劑。
繼而,如圖1的(E)所示,將片11自薄型元件晶圓60a去除,藉此可獲得薄型元件晶圓。
片11的去除方法例如可列舉:將片11保持膜狀而剝離去除(機械剝離)的方法;利用剝離液使片11膨潤後剝離去除的方法;對片11噴射剝離液而破壞去除的方法;使片11溶解於剝離液中而溶解去除的方法;藉由光化射線、放射線或熱的照射使片11分解、氣化而去除的方法等。可較佳地使用將片11保持膜狀而剝離去除的方法、使片11溶解於水溶液或有機溶劑中而溶解去除的方法。就減少溶劑的使用量的觀點而言,較佳為保持膜狀而去除,為了保持膜狀而去除,較佳為元件晶圓表面61a與片11的剝離強度B滿足以下的式(2)。
B≦4N/cm....式(2)
本發明中,將支撐基板12自薄型元件晶圓60a剝離時,較佳為不加任何處理而自薄型元件晶圓60a的端部相對於元件晶
圓沿垂直方向上拉而剝離,將元件晶圓表面61a上的片11去除的方法較佳為保持膜狀而去除。
若將支撐基板12與片11的界面的剝離強度設為A、元件晶圓表面61a與片11的剝離強度設為B,則藉由一併滿足上文所述的式(1)及式(2),可將支撐基板12、片11以如上所述的態樣自元件晶圓去除。
再者,於自元件晶圓剝離支撐基板時的於元件晶圓與片11的界面上剝離的情形(即,於元件晶圓側不殘留片11的情形)中,圖1的(E)的步驟亦可省略。
使支撐基板12自薄型元件晶圓60a脫離後,視需要對薄型元件晶圓60a實施各種公知的處理,製造具有薄型元件晶圓60a的半導體裝置。
另外,於片11附著於支撐基板上的情形時,可藉由將片11去除而再生支撐基板。關於將片11去除的方法,若保持膜狀,則可列舉:藉由毛刷、超音波、冰粒子、氣霧劑(aerosol)的噴附而物理去除的方法;溶解於水溶液或有機溶劑中而溶解去除的方法;藉由光化射線、放射線、熱的照射而使之分解、氣化的方法等化學去除的方法,亦可對應於支撐基板而利用以前已知的清洗方法。
例如於使用矽基板作為支撐基板的情形時,可使用以前已知的矽晶圓的清洗方法,例如化學去除的情形時可使用的水溶液或有機溶劑可列舉強酸、強鹼、強氧化劑或該些物質的混合物,具
體可列舉:硫酸、鹽酸、氫氟酸、硝酸、有機酸等酸類,四甲基銨、氨、有機鹼等鹼類,過氧化氫等氧化劑,或氨與過氧化氫的混合物、鹽酸與過氧化氫水的混合物、硫酸與過氧化氫水的混合物、氫氟酸與過氧化氫水的混合物、氫氟酸與氟化銨的混合物等。
就使用再生的支撐基板的情形的接著性的觀點而言,較佳為使用清洗液。
清洗液較佳為含有pKa小於0的酸(強酸)及過氧化氫。pKa小於0的酸是選自碘化氫、過氯酸、溴化氫、氯化氫、硝酸、硫酸等無機酸、或烷基磺酸、芳基磺酸等有機酸中。就清洗性的觀點而言,較佳為無機酸,最佳為硫酸。
過氧化氫可較佳地使用30質量%過氧化氫水,所述強酸與30質量%過氧化氫水的混合比以質量比計而較佳為0.1:1~100:1,更佳為1:1~10:1,最佳為3:1~5:1。
[實施例]
以下,藉由實施例對本發明進行更具體說明,但本發明只要不超出其主旨,則不限定於以下的實施例。另外,只要無特別說明,則「份」、「%」為質量基準。
於將以下的原料混合而製成均勻的溶液後,使用具有5μm的細孔徑的聚四氟乙烯製過濾器進行過濾來製備組成物。
<組成物的組成>
.表1記載的(A)聚合物:表1記載的質量份
.表1記載的(B)沸點為160℃以上的溶劑:表1記載的質
量份
.表1記載的(C)沸點小於120℃的溶劑:表1記載的質量份
.(D)抗氧化劑(易加樂斯(Irganox)(註冊商標)1010(巴斯夫(BASF)公司製造)與蘇米萊澤(Sumilizer)(註冊商標)TP-D(住友化學(股)製造)的1:1混合物):表1中所示的質量份
.代付利(DAIFREE)FB-962(大金工業(股)製造):0.05質量份
.美佳法(Megafac)F-557(迪愛生(DIC)(股)製造):0.1質量份
表中記載的化合物如以下所述。
<(A)聚合物>
(A-1)賽普頓(Septon)S2104(聚苯乙烯系彈性體,苯乙烯含量65%,氫化,5%熱質量減少溫度=400℃,可樂麗(Kuraray)(股)製造)
(A-2)塔釜泰克(Tuftec)P2000(聚苯乙烯系彈性體,苯乙烯含量67%,氫化,5%熱質量減少溫度=400℃,旭化成(股)製造)
(A-3)塔釜泰克(Tuftec)P5051(聚苯乙烯系彈性體,苯乙烯含量47%,氫化,5%熱質量減少溫度=396℃,旭化成(股)製造)
(A-4)賽普頓(Septon)S2006(聚苯乙烯系彈性體,苯乙烯含量35%,氫化,5%熱質量減少溫度=392℃,可樂麗(Kuraray)
(股)製造)
(A-5)賽普頓(Septon)S2007(聚苯乙烯系彈性體,苯乙烯含量30%,氫化,5%熱質量減少溫度=390℃,可樂麗(Kuraray)(股)製造)
(A-6)賽普頓(Septon)S2005(聚苯乙烯系彈性體,苯乙烯含量20%,氫化,5%熱質量減少溫度=380℃,可樂麗(Kuraray)(股)製造)
(A-7)阿薩普蘭(Asaprene)T-439(聚苯乙烯系彈性體,苯乙烯含量45%,非氫化,5%熱質量減少溫度=380℃,旭化成(股)製造)
(A-8)PSJ聚苯乙烯HF-77(聚苯乙烯,苯乙烯含量100%,非氫化,5%熱質量減少溫度=400℃,PS日本(股)製造)
(A-9)尼珀(Nipol)1043(丙烯腈丁二烯橡膠,苯乙烯含量0%,非氫化,5%熱質量減少溫度=370℃,日本瑞翁(Zeon)(股)公司製造)
<(B)沸點為160℃以上的溶劑>
(B-1)均三甲苯(沸點165℃,SP值18.0(MPa)1/2,東洋合成工業(股)製造)
(B-2)對二異丙基苯(沸點210℃,SP值17.6(MPa)1/2,東京化成工業(股)製造)
(B-3)對二乙基苯(沸點181℃,SP值18.0(MPa)1/2,東麗(股)製造)
(B-4)間二乙基苯(沸點182℃,SP值17.8(MPa)1/2,東麗(股)製造)
(B-5)1,3,5-三乙基苯(沸點218℃,SP值18.0(MPa)1/2,東京化成工業(股)製造)
(B-6)對二甲苯(沸點139℃,SP值17.9(MPa)1/2,三菱氣體化學(股)製造)
(B-7)十氫萘(沸點186℃,SP值18.0(MPa)1/2,新日鐵住金化學(股)製造)
(B-8)1,2,3,4-四氫萘(沸點207℃,SP值19.9(MPa)1/2,新日鐵住金化學(股)製造)
<(C)沸點小於120℃的溶劑>
(C-1)環己烷(沸點81℃,SP值16.8(MPa)1/2,出光興產(股)製造)
(C-2)甲苯(沸點111℃,SP值18.2(MPa)1/2,JX日礦日石能源(股)製造)
(C-3)四氫呋喃(沸點66℃,SP值19.5(MPa)1/2,岸田化學(Kishida Chemical)(股)製造)
(C-4)甲基環己烷(沸點101℃,SP值16.0(MPa)1/2,三協化學(股)製造)
(C-5)乙酸丁酯(沸點126℃,SP值17.4(MPa)1/2,岸田化學(Kishida Chemical)(股)製造)
再者,(A)聚合物的5%熱質量減少溫度藉由以下方法而測
定。
<5%熱質量減少溫度>
藉由熱重量分析裝置Q500(TA公司製造),使2mg的試樣於鋁鍋上於60mL/min的氮氣流下、於自初始溫度25℃起20℃/min的一定升溫條件下升溫,測定試樣的質量減少5質量%時的溫度。
<片的製造>
藉由線棒將各組成物以1m/min的速度塗佈於厚度75μm的聚對苯二甲酸乙二酯膜(脫模膜)上,於140℃下乾燥10分鐘,藉此製作厚度100μm的片。使脫模膜殘留而製成帶有脫模膜的片。
關於表面黏性強的片,進而於片的經塗佈的面上貼合厚度75μm的聚對苯二甲酸乙二酯膜(脫模膜)。
<接著性支撐基板的製造>
將藉由所述方法獲得的片(帶有脫模膜的片)安置於真空層壓機中,於兩面具有聚對苯二甲酸乙二酯膜(脫模膜)的情形時將單側的膜剝離後,使片位於100mm的矽(Si)晶圓上,於真空下使片表面與Si晶圓接觸,利用輥將片與Si晶圓固定,藉此製作接著性支撐基板。此處,不將接著性支撐基板的最上部所殘留的聚對苯二甲酸乙二酯膜(脫模膜)剝離而殘留。
<試片的製作>
將接著性支撐基板的聚對苯二甲酸乙二酯膜(脫模膜)剝離後,對接著性支撐基板的片表面與元件晶圓的元件面於真空下、110℃下以0.11MPa的壓力進行3分鐘壓接,製作試片。元件晶圓
是使用於100mm的Si晶圓上以200μm的間距形成有直徑80μm、高度40μm的包含銅的凸塊者。
<評價>
<<溶解度的評價>>
以表1記載的比例將組成物混合。進而,於表1中添加(A)聚合物,製備固體成分濃度31質量%的試樣。
再者,關於未溶解的試樣,添加以下溶劑而使其完全溶解。
(追加添加的溶劑)
於添加有(B)溶劑與(C)溶劑的組成物中,添加以添加至各組成物的質量比例將(B)溶劑與(C)溶劑混合而得的混合溶劑。
於單獨添加有(B)溶劑的組成物中追加(B)溶劑。
於單獨添加有(C)溶劑的組成物中追加(C)溶劑。
(評價基準)
A:可製備固體成分濃度31質量%的試樣。
B:可製備固體成分濃度30質量%以上且小於31質量%的試樣。
C:可製備固體成分濃度29質量%以上且小於30質量%的試樣。
D:可製備固體成分濃度小於29質量%的試樣。
<<表面狀態>>
以乾燥後的膜厚成為100μm的方式將組成物塗佈於聚對苯
二甲酸乙二酯膜(脫模膜)上,目測觀察在140℃下乾燥10分鐘後的表面狀態,按照以下基準進行評價。
A:未觀察到乾燥不均或厚度不均。
B:於一部分觀察到乾燥不均或厚度不均。
C:於整個面觀察到乾燥不均或厚度不均。
<<乾燥性>>
以乾燥後的膜厚成為100μm的方式將組成物塗佈於聚對苯二甲酸乙二酯膜(脫模膜)上,按照以下基準對在140℃下乾燥10分鐘後的乾燥性進行評價。
A:完全乾燥,表面無黏性。
B:於一部分溶劑未揮發,於該部位確認到表面的黏性。
C:於整個面溶劑未揮發,確認到表面的黏性。
D:溶劑殘存,表面仍為高黏度的液體。
<<耐熱性>>
使用烘箱將試片於250℃下加熱1小時。將加熱後的試片與切割框架一起安置於切割膠帶安裝機(dicing tape mounter)的中央,使切割膠帶位於上方。利用輥(及真空)將試片與切割膠帶固定,於切割框架上將切割膠帶切割,於切割膠帶上安裝試片。
將試片以500mm/min的條件朝片的垂直方向拉伸,確認剝離性,按照以下基準進行評價。再者,目測確認Si晶圓有無破損。
A:能以小於10N的最大剝離力剝離。
B:能以10N以上且小於15N的最大剝離力剝離。
C:能以15N以上且小於20N的最大剝離力剝離。
D:能以20N以上的最大剝離力剝離,或Si晶圓破損。
<<層壓性>>
於接著性支撐基板的製造時,按照以下基準對將片層壓於Si晶圓上時的層壓性進行評價。
A:片完全熔融,無孔隙地貼合於Si晶圓上。
B:片的熔融不充分,於片的一部分確認到孔隙。
C:片的熔融不充分,於片的整個面確認到孔隙。
根據所述結果,實施例的組成物的溶解性良好,可形成乾燥性、表面狀態及耐熱性優異的片。另外,藉由含有抗氧化劑,亦可提高層壓性。
相對於此,比較例1~比較例9的溶解性、乾燥性、表面狀態、耐熱性中的任一者差。
Claims (19)
- 一種組成物,其含有:自25℃起以20℃/min升溫的5%熱質量減少溫度為375℃以上的彈性體;下述通式(1)所表示的沸點為160℃以上的溶劑;及沸點小於120℃的溶劑,所述組成物的固體成分濃度為25質量%~40質量%,通式(1)中,R1~R6分別獨立地表示氫原子或脂肪族烴基。
- 如申請專利範圍第1項所述的組成物,其中所述彈性體是以25質量%以上的比例而含有於所述組成物中。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述彈性體為含有來源於苯乙烯的重複單元的彈性體。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述彈性體為氫化產物。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述彈性體為單末端或兩末端為苯乙烯嵌段的苯乙烯嵌段聚合物。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述彈性體的苯乙烯含有率為40質量%以上。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述沸點為160℃以上的溶劑的SP值為19(MPa)1/2以下。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述沸點小於120℃的溶劑的SP值為19(MPa)1/2以下。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述沸點小於120℃的溶劑為選自芳香族烴、脂環式烴及環狀醚中的一種以上。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述沸點小於120℃的溶劑是以10質量%~60質量%的比例而含有於所述組成物中。
- 如申請專利範圍第1項或第2項所述的組成物,其中所述沸點為160℃以上的溶劑與所述沸點小於120℃的溶劑的質量比為80:20~99:1。
- 如申請專利範圍第1項或第2項所述的組成物,其更含有抗氧化劑。
- 如申請專利範圍第12項所述的組成物,其中所述抗氧化劑是以1質量%~7質量%的比例而含有於所述組成物中。
- 如申請專利範圍第1項或第2項所述的組成物,其用於片形成用途。
- 如申請專利範圍第1項或第2項所述的組成物,其為暫時接著組成物。
- 一種片的製造方法,其將如申請專利範圍第1項至第15項中任一項所述的組成物施用於支撐體上,並使其乾燥。
- 一種片,其是使如申請專利範圍第1項至第15項中任一項所述的組成物乾燥而獲得。
- 一種積層體,其於使如申請專利範圍第1項至第15項中任一項所述的組成物乾燥而獲得的片的單面或兩面上具有具備脫模性的支撐體。
- 一種帶有元件晶圓的積層體,其於元件晶圓與支撐基板之間具有使如申請專利範圍第1項至第15項中任一項所述的組成物乾燥而獲得的片,且所述片的一個表面與所述元件晶圓的元件面接觸,另一表面與所述支撐基板的表面接觸。
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US10533137B2 (en) * | 2015-03-19 | 2020-01-14 | Zeon Corporation | Liquid crystal composition, method for producing retardation layer, and circularly polarizing plate |
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JP7201342B2 (ja) * | 2018-06-06 | 2023-01-10 | 株式会社ディスコ | ウエーハの加工方法 |
JP2019220550A (ja) | 2018-06-19 | 2019-12-26 | 株式会社ディスコ | ウエーハの加工方法 |
JP7181020B2 (ja) * | 2018-07-26 | 2022-11-30 | 株式会社ディスコ | ウエーハの加工方法 |
JP7035915B2 (ja) * | 2018-09-03 | 2022-03-15 | 信越化学工業株式会社 | 薄型ウエハの製造方法 |
JP7074879B2 (ja) * | 2018-10-18 | 2022-05-24 | 富士フイルム株式会社 | 仮接着用組成物、キットおよび積層体 |
JP7221046B2 (ja) | 2018-12-26 | 2023-02-13 | 東京応化工業株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法 |
US11064615B2 (en) * | 2019-09-30 | 2021-07-13 | Texas Instruments Incorporated | Wafer level bump stack for chip scale package |
KR20220119599A (ko) | 2019-12-27 | 2022-08-30 | 도오꾜오까고오교 가부시끼가이샤 | 접착제 조성물, 적층체, 적층체의 제조 방법, 및 전자 부품의 제조 방법 |
JP6832462B1 (ja) | 2019-12-27 | 2021-02-24 | 東京応化工業株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法 |
JP2023117970A (ja) | 2022-02-14 | 2023-08-24 | 東京応化工業株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法 |
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JP2023173589A (ja) | 2022-05-26 | 2023-12-07 | 東京応化工業株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法 |
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WO2016052315A1 (ja) | 2016-04-07 |
KR20170046167A (ko) | 2017-04-28 |
KR101927110B1 (ko) | 2018-12-10 |
TW201613989A (en) | 2016-04-16 |
JPWO2016052315A1 (ja) | 2017-06-22 |
CN107075187A (zh) | 2017-08-18 |
US10442961B2 (en) | 2019-10-15 |
JP6379210B2 (ja) | 2018-08-22 |
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