TWI663629B - 滾輪對滾輪晶圓背面顆粒及汙染移除 - Google Patents

滾輪對滾輪晶圓背面顆粒及汙染移除 Download PDF

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Publication number
TWI663629B
TWI663629B TW104118139A TW104118139A TWI663629B TW I663629 B TWI663629 B TW I663629B TW 104118139 A TW104118139 A TW 104118139A TW 104118139 A TW104118139 A TW 104118139A TW I663629 B TWI663629 B TW I663629B
Authority
TW
Taiwan
Prior art keywords
substrate
particle
particle cleaning
cleaning article
cleaning product
Prior art date
Application number
TW104118139A
Other languages
English (en)
Chinese (zh)
Other versions
TW201604930A (zh
Inventor
倪克里斯多夫Ｓ
戴輝雄
葛迪魯多維
葉怡利
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201604930A publication Critical patent/TW201604930A/zh
Application granted granted Critical
Publication of TWI663629B publication Critical patent/TWI663629B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104118139A 2014-06-19 2015-06-04 滾輪對滾輪晶圓背面顆粒及汙染移除 TWI663629B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462014278P 2014-06-19 2014-06-19
US62/014,278 2014-06-19
US14/476,398 2014-09-03
US14/476,398 US9815091B2 (en) 2014-06-19 2014-09-03 Roll to roll wafer backside particle and contamination removal

Publications (2)

Publication Number Publication Date
TW201604930A TW201604930A (zh) 2016-02-01
TWI663629B true TWI663629B (zh) 2019-06-21

Family

ID=54870310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104118139A TWI663629B (zh) 2014-06-19 2015-06-04 滾輪對滾輪晶圓背面顆粒及汙染移除

Country Status (6)

Country Link
US (1) US9815091B2 (enExample)
JP (1) JP6573918B2 (enExample)
KR (1) KR20170018069A (enExample)
CN (1) CN106463385B (enExample)
TW (1) TWI663629B (enExample)
WO (1) WO2015195292A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
CN111250481B (zh) * 2020-01-17 2021-07-13 哈尔滨工业大学 一种利用可移动式静电电场吸附颗粒污染物的装置
JP7482657B2 (ja) * 2020-03-17 2024-05-14 東京エレクトロン株式会社 クリーニング方法及び半導体装置の製造方法
US12009227B2 (en) 2021-05-07 2024-06-11 Kla Corporation Electrostatic substrate cleaning system and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010021627A1 (en) * 1999-08-31 2001-09-13 Elledge Jason B. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6374834B1 (en) * 1998-12-07 2002-04-23 Shin-Etsu Handotai Co., Ltd. Substrate processing method and processing apparatus
US20030066543A1 (en) * 2000-03-24 2003-04-10 Xerox Corporation Flexible web cleaning process
US20070161332A1 (en) * 2005-07-13 2007-07-12 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
US20100197204A1 (en) * 2003-02-11 2010-08-05 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces

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JPH06232108A (ja) * 1993-01-29 1994-08-19 Hitachi Ltd 異物除去方法
US5456758A (en) 1993-04-26 1995-10-10 Sematech, Inc. Submicron particle removal using liquid nitrogen
US5972051A (en) 1993-06-17 1999-10-26 Vlsi Technology, Inc Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means
JPH07275805A (ja) * 1994-04-05 1995-10-24 Nitto Seiki Kk 薄板状体の表面清掃装置
JPH08148461A (ja) * 1994-11-18 1996-06-07 Nitto Denko Corp 半導体ウエハに付着した異物の除去方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JPH1098090A (ja) * 1996-09-25 1998-04-14 Canon Inc 基板保持装置及び露光装置
JP3809503B2 (ja) * 1997-02-28 2006-08-16 野村マイクロ・サイエンス株式会社 半導体基板内部の洗浄方法および洗浄装置
US5753563A (en) 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
JP2002083795A (ja) * 2000-09-07 2002-03-22 Toshiba Corp 半導体基板の洗浄方法およびその洗浄装置
JP4414116B2 (ja) * 2001-08-21 2010-02-10 芝浦メカトロニクス株式会社 基板清掃装置および基板清掃方法
US6695917B2 (en) * 2001-11-14 2004-02-24 Nordson Corporation Flow through felt dispenser
US20050210610A1 (en) * 2004-03-26 2005-09-29 Zih Corp. Apparatus and methods for cleaning the components of a feed device
TWI420579B (zh) * 2005-07-12 2013-12-21 Creative Tech Corp And a foreign matter removing method for a substrate
JP4607748B2 (ja) * 2005-12-02 2011-01-05 東京エレクトロン株式会社 基板のパーティクル除去方法、その装置及び塗布、現像装置
US7784146B2 (en) * 2006-01-09 2010-08-31 International Business Machines Corporation Probe tip cleaning apparatus and method of use
JP2011093113A (ja) * 2009-10-27 2011-05-12 Fujifilm Corp 積層基板の製造装置及び製造方法
JP6014477B2 (ja) * 2012-12-04 2016-10-25 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6374834B1 (en) * 1998-12-07 2002-04-23 Shin-Etsu Handotai Co., Ltd. Substrate processing method and processing apparatus
US20010021627A1 (en) * 1999-08-31 2001-09-13 Elledge Jason B. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US20030066543A1 (en) * 2000-03-24 2003-04-10 Xerox Corporation Flexible web cleaning process
US20100197204A1 (en) * 2003-02-11 2010-08-05 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US20070161332A1 (en) * 2005-07-13 2007-07-12 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects

Also Published As

Publication number Publication date
KR20170018069A (ko) 2017-02-15
JP2017522726A (ja) 2017-08-10
JP6573918B2 (ja) 2019-09-11
CN106463385A (zh) 2017-02-22
CN106463385B (zh) 2020-07-14
US20150371879A1 (en) 2015-12-24
WO2015195292A1 (en) 2015-12-23
US9815091B2 (en) 2017-11-14
TW201604930A (zh) 2016-02-01

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MM4A Annulment or lapse of patent due to non-payment of fees