CN106463385B - 辊对辊式晶片背面颗粒及污染移除 - Google Patents

辊对辊式晶片背面颗粒及污染移除 Download PDF

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Publication number
CN106463385B
CN106463385B CN201580032653.0A CN201580032653A CN106463385B CN 106463385 B CN106463385 B CN 106463385B CN 201580032653 A CN201580032653 A CN 201580032653A CN 106463385 B CN106463385 B CN 106463385B
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CN
China
Prior art keywords
substrate
cleaning article
particulate cleaning
particulate
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580032653.0A
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English (en)
Chinese (zh)
Other versions
CN106463385A (zh
Inventor
C·S·恩盖
戴辉雄
L·戈代
E·Y·叶
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of CN106463385A publication Critical patent/CN106463385A/zh
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Publication of CN106463385B publication Critical patent/CN106463385B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201580032653.0A 2014-06-19 2015-05-28 辊对辊式晶片背面颗粒及污染移除 Expired - Fee Related CN106463385B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462014278P 2014-06-19 2014-06-19
US62/014,278 2014-06-19
US14/476,398 2014-09-03
US14/476,398 US9815091B2 (en) 2014-06-19 2014-09-03 Roll to roll wafer backside particle and contamination removal
PCT/US2015/033005 WO2015195292A1 (en) 2014-06-19 2015-05-28 Roll to roll wafer backside particle and contamination removal

Publications (2)

Publication Number Publication Date
CN106463385A CN106463385A (zh) 2017-02-22
CN106463385B true CN106463385B (zh) 2020-07-14

Family

ID=54870310

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580032653.0A Expired - Fee Related CN106463385B (zh) 2014-06-19 2015-05-28 辊对辊式晶片背面颗粒及污染移除

Country Status (6)

Country Link
US (1) US9815091B2 (enExample)
JP (1) JP6573918B2 (enExample)
KR (1) KR20170018069A (enExample)
CN (1) CN106463385B (enExample)
TW (1) TWI663629B (enExample)
WO (1) WO2015195292A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
CN111250481B (zh) * 2020-01-17 2021-07-13 哈尔滨工业大学 一种利用可移动式静电电场吸附颗粒污染物的装置
JP7482657B2 (ja) * 2020-03-17 2024-05-14 東京エレクトロン株式会社 クリーニング方法及び半導体装置の製造方法
US12009227B2 (en) 2021-05-07 2024-06-11 Kla Corporation Electrostatic substrate cleaning system and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5891298A (en) * 1995-08-31 1999-04-06 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
US6374834B1 (en) * 1998-12-07 2002-04-23 Shin-Etsu Handotai Co., Ltd. Substrate processing method and processing apparatus
CN102139553A (zh) * 2009-10-27 2011-08-03 富士胶片株式会社 层叠基板的制造装置及制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232108A (ja) * 1993-01-29 1994-08-19 Hitachi Ltd 異物除去方法
US5456758A (en) 1993-04-26 1995-10-10 Sematech, Inc. Submicron particle removal using liquid nitrogen
US5972051A (en) 1993-06-17 1999-10-26 Vlsi Technology, Inc Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means
JPH07275805A (ja) * 1994-04-05 1995-10-24 Nitto Seiki Kk 薄板状体の表面清掃装置
JPH08148461A (ja) * 1994-11-18 1996-06-07 Nitto Denko Corp 半導体ウエハに付着した異物の除去方法
JPH1098090A (ja) * 1996-09-25 1998-04-14 Canon Inc 基板保持装置及び露光装置
JP3809503B2 (ja) * 1997-02-28 2006-08-16 野村マイクロ・サイエンス株式会社 半導体基板内部の洗浄方法および洗浄装置
US5753563A (en) 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
US6244944B1 (en) 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6523208B1 (en) 2000-03-24 2003-02-25 Xerox Corporation Flexible web cleaning system
JP2002083795A (ja) * 2000-09-07 2002-03-22 Toshiba Corp 半導体基板の洗浄方法およびその洗浄装置
JP4414116B2 (ja) * 2001-08-21 2010-02-10 芝浦メカトロニクス株式会社 基板清掃装置および基板清掃方法
US6695917B2 (en) * 2001-11-14 2004-02-24 Nordson Corporation Flow through felt dispenser
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US20050210610A1 (en) * 2004-03-26 2005-09-29 Zih Corp. Apparatus and methods for cleaning the components of a feed device
TWI420579B (zh) * 2005-07-12 2013-12-21 Creative Tech Corp And a foreign matter removing method for a substrate
US7264539B2 (en) 2005-07-13 2007-09-04 Micron Technology, Inc. Systems and methods for removing microfeature workpiece surface defects
JP4607748B2 (ja) * 2005-12-02 2011-01-05 東京エレクトロン株式会社 基板のパーティクル除去方法、その装置及び塗布、現像装置
US7784146B2 (en) * 2006-01-09 2010-08-31 International Business Machines Corporation Probe tip cleaning apparatus and method of use
JP6014477B2 (ja) * 2012-12-04 2016-10-25 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5891298A (en) * 1995-08-31 1999-04-06 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
US6374834B1 (en) * 1998-12-07 2002-04-23 Shin-Etsu Handotai Co., Ltd. Substrate processing method and processing apparatus
CN102139553A (zh) * 2009-10-27 2011-08-03 富士胶片株式会社 层叠基板的制造装置及制造方法

Also Published As

Publication number Publication date
KR20170018069A (ko) 2017-02-15
JP2017522726A (ja) 2017-08-10
JP6573918B2 (ja) 2019-09-11
CN106463385A (zh) 2017-02-22
US20150371879A1 (en) 2015-12-24
WO2015195292A1 (en) 2015-12-23
TWI663629B (zh) 2019-06-21
US9815091B2 (en) 2017-11-14
TW201604930A (zh) 2016-02-01

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