TWI659849B - 積層體之剝離裝置及剝離方法、與電子裝置之製造方法 - Google Patents

積層體之剝離裝置及剝離方法、與電子裝置之製造方法 Download PDF

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Publication number
TWI659849B
TWI659849B TW104122386A TW104122386A TWI659849B TW I659849 B TWI659849 B TW I659849B TW 104122386 A TW104122386 A TW 104122386A TW 104122386 A TW104122386 A TW 104122386A TW I659849 B TWI659849 B TW I659849B
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TW
Taiwan
Prior art keywords
peeling
blade
laminated body
substrate
interface
Prior art date
Application number
TW104122386A
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English (en)
Chinese (zh)
Other versions
TW201607764A (zh
Inventor
伊藤泰則
宇津木洋
滝內圭
Original Assignee
日商Ａｇｃ股份有限公司
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Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW201607764A publication Critical patent/TW201607764A/zh
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Publication of TWI659849B publication Critical patent/TWI659849B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW104122386A 2014-07-11 2015-07-09 積層體之剝離裝置及剝離方法、與電子裝置之製造方法 TWI659849B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-143018 2014-07-11
JP2014143018A JP6354945B2 (ja) 2014-07-11 2014-07-11 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
TW201607764A TW201607764A (zh) 2016-03-01
TWI659849B true TWI659849B (zh) 2019-05-21

Family

ID=55092950

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122386A TWI659849B (zh) 2014-07-11 2015-07-09 積層體之剝離裝置及剝離方法、與電子裝置之製造方法

Country Status (4)

Country Link
JP (1) JP6354945B2 (ja)
KR (1) KR20160007400A (ja)
CN (1) CN105252881B (ja)
TW (1) TWI659849B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904532B (zh) * 2017-12-11 2021-04-13 北京小米移动软件有限公司 电池剥离模组及终端
CN109693847B (zh) * 2019-02-22 2024-05-14 苏州威兹泰克自动化科技有限公司 自动标签剥离机构
JP7057337B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板剥離装置、基板処理装置、及び基板剥離方法
JP6900540B1 (ja) * 2020-04-08 2021-07-07 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
JP7166571B2 (ja) * 2020-09-07 2022-11-08 株式会社丸仲鉄工所 フィルム状部材の分離方法
JP7280391B1 (ja) * 2021-04-28 2023-05-23 ヒョンホ ボン 自動車スモークフィルムスチーム剥離装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201321191Y (zh) 2008-12-11 2009-10-07 唐颖 防伪瓶塞
CN102171745A (zh) * 2009-02-06 2011-08-31 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置
TW201334090A (zh) * 2012-01-19 2013-08-16 Asahi Glass Co Ltd 剝離裝置及電子元件之製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2607907B2 (ja) * 1988-03-22 1997-05-07 株式会社ムラオ・アンド・カンパニー 粗糸ボビンの残粗糸除去装置
KR100543024B1 (ko) * 1998-01-21 2006-05-25 삼성전자주식회사 액정표시장치의 편광판 제거장치
JP4241697B2 (ja) * 2005-09-06 2009-03-18 ユーテック株式会社 フィルム剥離装置
CN102202994B (zh) 2009-08-31 2014-03-12 旭硝子株式会社 剥离装置
JP5870000B2 (ja) 2012-09-19 2016-02-24 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201321191Y (zh) 2008-12-11 2009-10-07 唐颖 防伪瓶塞
CN102171745A (zh) * 2009-02-06 2011-08-31 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置
TW201334090A (zh) * 2012-01-19 2013-08-16 Asahi Glass Co Ltd 剝離裝置及電子元件之製造方法

Also Published As

Publication number Publication date
JP6354945B2 (ja) 2018-07-11
CN105252881B (zh) 2019-03-19
CN105252881A (zh) 2016-01-20
TW201607764A (zh) 2016-03-01
KR20160007400A (ko) 2016-01-20
JP2016016983A (ja) 2016-02-01

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