KR20160007400A - 적층체의 박리 장치 및 박리 방법, 그리고 전자 디바이스의 제조 방법 - Google Patents

적층체의 박리 장치 및 박리 방법, 그리고 전자 디바이스의 제조 방법 Download PDF

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Publication number
KR20160007400A
KR20160007400A KR1020150097081A KR20150097081A KR20160007400A KR 20160007400 A KR20160007400 A KR 20160007400A KR 1020150097081 A KR1020150097081 A KR 1020150097081A KR 20150097081 A KR20150097081 A KR 20150097081A KR 20160007400 A KR20160007400 A KR 20160007400A
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KR
South Korea
Prior art keywords
peeling
edge
substrate
interface
laminate
Prior art date
Application number
KR1020150097081A
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English (en)
Korean (ko)
Inventor
야스노리 이토
히로시 우츠기
게이 다키우치
Original Assignee
아사히 가라스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아사히 가라스 가부시키가이샤 filed Critical 아사히 가라스 가부시키가이샤
Publication of KR20160007400A publication Critical patent/KR20160007400A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020150097081A 2014-07-11 2015-07-08 적층체의 박리 장치 및 박리 방법, 그리고 전자 디바이스의 제조 방법 KR20160007400A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014143018A JP6354945B2 (ja) 2014-07-11 2014-07-11 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JPJP-P-2014-143018 2014-07-11

Publications (1)

Publication Number Publication Date
KR20160007400A true KR20160007400A (ko) 2016-01-20

Family

ID=55092950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150097081A KR20160007400A (ko) 2014-07-11 2015-07-08 적층체의 박리 장치 및 박리 방법, 그리고 전자 디바이스의 제조 방법

Country Status (4)

Country Link
JP (1) JP6354945B2 (ja)
KR (1) KR20160007400A (ja)
CN (1) CN105252881B (ja)
TW (1) TWI659849B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904532B (zh) * 2017-12-11 2021-04-13 北京小米移动软件有限公司 电池剥离模组及终端
CN109693847B (zh) * 2019-02-22 2024-05-14 苏州威兹泰克自动化科技有限公司 自动标签剥离机构
JP7057337B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板剥離装置、基板処理装置、及び基板剥離方法
JP6900540B1 (ja) * 2020-04-08 2021-07-07 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
JP7166571B2 (ja) * 2020-09-07 2022-11-08 株式会社丸仲鉄工所 フィルム状部材の分離方法
JP7280391B1 (ja) * 2021-04-28 2023-05-23 ヒョンホ ボン 自動車スモークフィルムスチーム剥離装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011024689A1 (ja) 2009-08-31 2011-03-03 旭硝子株式会社 剥離装置
JP2014060346A (ja) 2012-09-19 2014-04-03 Tokyo Electron Ltd 剥離装置、剥離システムおよび剥離方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2607907B2 (ja) * 1988-03-22 1997-05-07 株式会社ムラオ・アンド・カンパニー 粗糸ボビンの残粗糸除去装置
KR100543024B1 (ko) * 1998-01-21 2006-05-25 삼성전자주식회사 액정표시장치의 편광판 제거장치
JP4241697B2 (ja) * 2005-09-06 2009-03-18 ユーテック株式会社 フィルム剥離装置
CN201321191Y (zh) 2008-12-11 2009-10-07 唐颖 防伪瓶塞
CN102171745B (zh) * 2009-02-06 2014-10-08 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置
JP5807554B2 (ja) * 2012-01-19 2015-11-10 旭硝子株式会社 剥離装置、及び電子デバイスの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011024689A1 (ja) 2009-08-31 2011-03-03 旭硝子株式会社 剥離装置
JP2014060346A (ja) 2012-09-19 2014-04-03 Tokyo Electron Ltd 剥離装置、剥離システムおよび剥離方法

Also Published As

Publication number Publication date
JP6354945B2 (ja) 2018-07-11
TWI659849B (zh) 2019-05-21
CN105252881B (zh) 2019-03-19
CN105252881A (zh) 2016-01-20
TW201607764A (zh) 2016-03-01
JP2016016983A (ja) 2016-02-01

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