KR20160007400A - Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to a peeling apparatus for a laminate which is a rectangular laminate having a first substrate and a second substrate to be able to be detachable therefrom. The peeling apparatus for a laminate makes peeling at an interface of the first substrate and the second substrate comprises a peeling knife which has a flat plate shape, has the end of a blade on an edge part, and has a certain amount of the end of the blade inserted into the interface from the corner part of the laminate to form a peeling starting part on the interface; a peeling means making peeling at the interface starting from the peeling starting part; an insertion position changing means changing the relative position of the peeling knife and the laminate on a plane; and a control means controlling the insertion position change means to change the insertion position of the end of the blade of the peeling knife inserted into the interface.

Description

TECHNICAL FIELD [0001] The present invention relates to a peeling apparatus and a peeling method for a laminate, and a method of manufacturing an electronic device.

The present invention relates to a peeling apparatus and a peeling method of a laminate, and a method of manufacturing an electronic device.

BACKGROUND ART [0002] As electronic devices such as display panels, solar cells, thin-film secondary batteries and the like have become thinner and lighter, thinning of substrates (first substrate) such as glass plates, resin plates and metal plates used for these electronic devices has been demanded.

However, if the thickness of the substrate is reduced, the handling properties of the substrate deteriorate, and it becomes difficult to form functional layers (thin film transistors (TFTs) and color filters (CF)) for electronic devices on the surface of the substrate .

Accordingly, a manufacturing method of an electronic device in which a reinforcing plate (second substrate) is attached to the back surface of a substrate to construct a laminated body reinforced by a reinforcing plate, and a functional layer is formed on the surface of the substrate in a laminated state Has been proposed. In this manufacturing method, since the handling property of the substrate is improved, the functional layer can be formed well on the surface of the substrate. And the reinforcing plate is peeled from the substrate after formation of the functional layer.

The method of peeling off a reinforcing plate disclosed in Patent Document 1 is a method of peeling a reinforcing plate made by bending a reinforcing plate or a substrate or both of the two corner portions located on a diagonal line of the rectangular laminate from one side to the other, All. At this time, in order to smoothly carry out the peeling, a peeling start portion is formed at one corner of the laminate. The peeling initiation portion is formed by punching a predetermined amount of the edge of the peeling knife at the interface between the substrate and the reinforcing plate from one corner portion of the laminate.

Patent Document 2 also discloses a peeling apparatus in which a blade (edge portion) of a sharpening member (peeling knife) is inserted into the interface between a substrate to be treated (first substrate) and a support substrate (second substrate) .

International Publication No. 2011/024689 Japanese Patent Application Laid-Open No. 2014-60346

In the peeling apparatuses of Patent Documents 1 and 2, when a peeling start portion is formed on the interface by a peeling knife, when the edge of the fin touches the fine wave glass adhered to one corner portion of the laminate, there was. There is a problem in that it is not possible to reliably form the edge of the edge at the next interface with the defective edge, so that it is not possible to surely form the edge at the next interface which contributes to the separation at the interface.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a peeling apparatus, a peeling method, and a manufacturing method of an electronic device which can reliably form a peeling start portion at the interface of a laminate by the edge of a peeling knife do.

In order to attain the above object, the present invention provides a laminate peeling apparatus comprising: a laminated body peeling apparatus for peeling a laminate at an interface between the first substrate and the second substrate with respect to a rectangular laminate body in which a first substrate and a second substrate are detachably attached, A peeling apparatus for a laminated body, comprising: a peeling knife having a flat plate shape and a sharp edge along a rim portion, the peeling start portion being formed on the interface by a predetermined amount of the knife edge being inserted into the interface from the corner portion of the laminate A peeling means for peeling the peeling knife and the laminate from each other with the knife and the peeling start portion as a starting point; a jig position changing means for changing a relative position on the plane between the peeling knife and the laminate; And the control means controls the insertion position changing means so as to change the insertion position of the blade tip.

In order to achieve the above-described object, the present invention provides a method for peeling a laminated body, comprising the steps of: peeling off the interface between the first substrate and the second substrate, with respect to a rectangular stacked body in which a first substrate and a second substrate are detachably attached, A peeling initiation portion forming step of forming a peeling start portion on the interface by inserting a blade provided along a rim of a flat plate type separation knife in a predetermined amount from a corner portion of the laminate to the interface in a peeling method of the laminate, And a peeling step of peeling off from the interface with the peeling start portion as a starting point, wherein the peeling start portion forming step includes a step of changing a position of insertion of the edge of the peeling knife inserted into the interface .

In order to achieve the above-described object, a method of manufacturing an electronic device of the present invention is a method for forming a functional layer on an exposed surface of a first substrate and a second substrate on a rectangular stacked body in which the second substrate is removably attached And a separating step of separating the second substrate from the first substrate on which the functional layer is formed, wherein the separating step includes a step of separating the second substrate from the first substrate, A peeling initiation portion forming step of forming a peeling initiation portion in the interface by inserting a predetermined amount of a blade tip into the interface between the first substrate and the second substrate from a corner portion of the stacked body, And a peeling step of peeling off the peeling blade from the peeling blade, wherein in the peeling start portion forming step, And a step of changing an embedment position to be changed.

According to the present invention, in the step of changing the insertion position, the control means controls the insertion position changing means to change the insertion position of the cutting edge of the separation knife inserted into the interface. Therefore, according to one aspect of the present invention, when the position of the knife edge is changed, a normal knife edge free from defects is used at the next knitting, so that the peeling start portion can be surely formed at the interface of the laminate.

The peeling knife of the present invention has a flat plate-like shape, and has a flat edge shape with a sharp edge along its edge.

On the other hand, the edge of the edge actually used for forming the peeling start portion is extremely small compared with the total length (also called the effective length) of the edge. In the conventional peeling apparatus, if a slight defect occurs in the very small part, the peeling start portion can not be surely formed. Therefore, it is necessary to replace the peeling knife with the new peeling knife that has no defect.

On the other hand, according to the present invention, since the substantially entire length of the edge of the edge provided along the rim can be effectively used as the edge for forming the peeling start portion, the frequency of replacement of the peeling knife can be reduced, .

Since the insert position changing means of the present invention is means for changing the relative position on the plane of the peeling knife and the laminate, the drive mechanism may be provided for each of the peeling knife and the laminate to change their relative positions. The relative position may be changed by providing a drive mechanism on one side. That is, the peeling apparatus of the present invention includes a single-axis driving mechanism for inserting the edge of the peeling knife into the interface, and a single-axis driving mechanism for changing the relative position. The two drive mechanisms may be separated from each other to form the one drive mechanism on the peeling-off side and the other drive mechanism on the side of the stack, or the biaxial drive mechanism may be provided on either side.

The amount of change of the knitting position of the knife by the knitting position changing means is determined by the amount of the knitting of the knitting edge and the angle (also referred to as a self-fitting angle) formed by the edge of one edge having the vertex angle and the edge of the other edge . That is, it is possible to infer the amount of deflection (length) of the blade edge by the amount of self-infeed of the blade edge and the angle of insertion of the blade edge. Therefore, it is possible to change the relative position to a pitch not used for next insertion, It is preferable to make the edge of the blade be shifted along the longitudinal direction of the blade edge. This makes it possible to effectively use the entire length of the blade edge.

In one embodiment of the laminate peeling apparatus of the present invention, it is preferable that the control means controls the insert position changing means so as to change the insert position of the blade from the previous insert position every time at least one of the peeling start portions is created Do.

In one embodiment of the laminate peeling method and the electronic device manufacturing method of the present invention, the above-mentioned insertion position changing step is carried out so as to change the insert position of the blade edge from the previous insert position every time at least one of the peel- .

According to this aspect of the present invention, in the insertion position changing step, every time the at least one separation start portion is created, the insertion position of the blade tip is changed from the previous insertion position. Therefore, when the position of the edge of the edge is changed every time one peel-off start portion is prepared, a normal edge having no defect can be used at the next time of jig insertion. Therefore, the peeling initiation portion can be reliably formed in the laminate. Further, the position of the edge of the edge may be changed each time the two or more peeling start portions are formed. In the above embodiment of the present invention, even if no defect occurs at the edge of the blade at the time of last insert, the edge used for the last insert is not used at the next insert, and a normal edge adjacent to the end of the edge is used . The control means memorizes the position of the edge of the last insertion, and changes the position of the edge in accordance with the last position of the edge.

Another aspect of the laminate peeling apparatus of the present invention includes a detecting means for detecting a defect of the edge of the peeling knife, and when the edge of the edge is detected by the detecting means, It is preferable to control the changing means.

In another aspect of the laminate peeling method and the electronic device manufacturing method of the present invention, in the step of changing the insert position, when the edge of the edge of the peeling knife is detected, the edge position of the edge is changed .

According to another aspect of the present invention, in the step of changing the insertion position, when the deficiency of the blade is detected by the detection means, the position of the blade tip is changed from the previous position of insertion, You can use the tip. Therefore, the peeling initiation portion can be reliably formed in the laminate. In another embodiment of the present invention, when a defect of a blade is detected, a normal blade adjacent to the blade edge is used for the next blade, so that the service life of the blade can be further extended. The control means memorizes the position of the edge of the last insertion, and changes the position of the edge in accordance with the last position of the edge.

In the present invention, it is preferable that an angle formed between the one edge and the edge of the edge, and an angle formed by the edge and the edge of the other edge, at one edge and the other edge having vertices of the edge of the laminate, It is preferable that the control means controls the insertion position changing means so that the edge of the larger angle side is changed to the next insertion position.

In the present invention, in the one side edge and the other edge side, in which the corner portion of the laminated body into which the edge of the peeling knife is inserted is formed as a vertex angle, the step of changing the insert position is performed by changing the angle formed by the one edge and the edge, It is preferable that the angle between the edge portion and the blade edge is changed so that the blade edge on the larger angle side is changed to the next fitting position.

In this case, since the new blade edge on the larger angle side is changed to the next insert position, compared with the case where the new blade edge on the smaller angle side is changed to the next insert position, the amount of change of the relative position, Can be reduced. Therefore, the overall length of the blade edge can be more effectively utilized.

According to the peeling apparatus, the peeling method, and the electronic device manufacturing method of the laminate according to the present invention, the peeling start portion can surely be formed in the laminate by the edge of the peeling knife.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an enlarged side view showing an example of a laminate provided in a manufacturing process of an electronic device. Fig.
Fig. 2 is an enlarged side view of an essential part showing an example of a laminate formed in the middle of a manufacturing process of an LCD (liquid crystal display).
3 (A) to 3 (E) are explanatory diagrams showing a peeling start portion creating method by the peeling start portion creating device.
4 is a plan view of the layered product in which the peeling initiation portion is prepared by the peeling initiation portion forming method.
5 is a side view showing the entire configuration of the peeling initiation part producing device.
Fig. 6 is a plan view of the peeling initiation part producing device shown in Fig. 5. Fig.
7 is a longitudinal sectional view showing the configuration of the peeling apparatus in the embodiment.
Fig. 8 is a plan view of a flexible plate schematically showing an arrangement position of the movable body with respect to the peeling unit. Fig.
9 (A) to 9 (C) are explanatory diagrams showing the configuration of the peeling unit.
10 is a longitudinal sectional view of the peeling apparatus peeling off from the interface of the laminate.
Figs. 11A to 11C are explanatory diagrams in time series showing a peeling method for peeling a reinforcing plate of a laminate on which a peeling start portion is formed by a peeling start portion making method. Fig.
Figs. 12 (A) to 12 (C) are explanatory diagrams of a method of peeling off a reinforcing plate of a laminate in a time-wise manner following Figs. 11 (A) to 11 (C).
13 is a plan view showing a state in which the edge of a knife is in contact with the corner of the corner cut portion of the laminate.
14 (A) to 14 (F) are plan views showing an example of the peeling start portion forming step by the peeling start portion forming device.
15 (A) to 15 (B) are plan views showing the shape of a knife edge.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

Hereinafter, the case where the peeling apparatus and the peeling method of the laminate according to the present invention are used in a manufacturing process of an electronic device will be described.

The electronic device refers to electronic parts such as a display panel, a solar cell, and a thin film secondary battery. Examples of the display panel include a liquid crystal display (LCD) panel, a plasma display panel (PDP), and an organic electro luminescence display (OELD) panel.

[Electronic device manufacturing process]

An electronic device is manufactured by forming a functional layer for an electronic device (TFT, thin film transistor (TFT), color filter (CF)) on the surface of a substrate made of glass, resin, metal or the like.

The substrate is formed of a laminate by attaching the back surface of the substrate to the reinforcing plate before forming the functional layer. Thereafter, the functional layer is formed on the surface of the substrate in the state of the laminate. After formation of the functional layer, the reinforcing plate is peeled from the substrate.

That is, the manufacturing process of the electronic device includes a functional layer forming step of forming a functional layer on the surface of the substrate in the state of the laminate, and a separating step of separating the reinforcing plate from the substrate on which the functional layer is formed. In this separation step, the peeling apparatus and the peeling method of the laminate according to the present invention are applied.

[Layered product (1)]

Fig. 1 is an enlarged side view of the main part showing an example of the layered product 1. Fig.

The laminate 1 includes a substrate 2 on which a functional layer is formed and a reinforcing plate 3 for reinforcing the substrate 2. The reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the surface 3a and a back surface 2b of the substrate 2 on the resin layer 4. [ That is, the substrate 2 is peeled off from the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting between the resin layer 4 and the resin layer 4, Lt; / RTI >

[Substrate (2)]

In the substrate 2, a functional layer is formed on the surface 2a thereof. As the substrate 2, a glass substrate, a ceramics substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these substrates, the glass substrate is suitable as the substrate 2 for an electronic device because it has excellent chemical resistance, moisture permeability and low coefficient of linear expansion. As the coefficient of linear expansion becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be lost at the time of cooling.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glass containing silicon oxide as a main component. As the oxide-based glass, a glass having a silicon oxide content of 40 to 90 mass% in terms of an oxide is preferable.

It is preferable to select glass suitable for the type of electronic device to be manufactured and glass suitable for the production process of the glass substrate. For example, it is preferable to employ glass (alkali-free glass) which does not substantially contain an alkali metal component in the glass substrate for a liquid crystal panel.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness thereof is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably 0.1 mm or less, in order to reduce the weight and thickness of the electronic device do. When the thickness is 0.3 mm or less, good flexibility can be given to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate can be rolled up in a roll shape. However, from the viewpoint of manufacturing the glass substrate and handling the glass substrate, the thickness is preferably 0.03 mm or more.

Although the substrate 2 is composed of a single substrate in Fig. 1, the substrate 2 may be composed of a plurality of substrates. That is, the substrate 2 may be formed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 becomes the thickness of the substrate 2.

[Stiffening plate (3)]

As the reinforcing plate 3, a glass substrate, a ceramics substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified.

The thickness of the reinforcing plate 3 is set to 0.7 mm or less and is set according to the type, thickness, etc. of the substrate 2 to be reinforced. The thickness of the reinforcing plate 3 may be thicker or thinner than that of the substrate 2, but it is preferable that the thickness of the reinforcing plate 3 is 0.4 mm or more in order to reinforce the substrate 2.

Although the reinforcing plate 3 is composed of a single substrate in this example, the reinforcing plate 3 may be a laminate obtained by laminating a plurality of substrates. In this case, the total thickness of all the boards constituting the reinforcing plate 3 is equal to the thickness of the reinforcing plate 3.

[Resin Layer (4)]

The bonding strength between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding strength between the resin layer 4 and the reinforcing plate 3 in order to prevent peeling between the resin layer 4 and the reinforcing plate 3 do. Thus, in the peeling step, it is peeled from the interface between the resin layer 4 and the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a silicone resin and a polyimide silicone resin. Several kinds of resins may be mixed and used. Among them, a silicone resin and a polyimide silicone resin are preferable from the viewpoint of heat resistance and releasability.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 탆, and more preferably 4 to 20 탆. The thickness of the resin layer 4 is set to 1 탆 or more to absorb the thickness of bubbles or foreign matter due to the deformation of the resin layer 4 when bubbles or foreign matter are mixed between the resin layer 4 and the substrate 2 can do. On the other hand, by setting the thickness of the resin layer 4 to 50 m or less, the formation time of the resin layer 4 can be shortened and the resin of the resin layer 4 is not used more than necessary.

The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4 Do. The outer shape of the resin layer 4 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2 so that the resin layer 4 can closely contact the entire substrate 2. [

Although the resin layer 4 is composed of one layer in Fig. 1, the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is equal to the thickness of the resin layer 4. In this case, the kinds of resins constituting each layer may be different.

Although the resin layer 4, which is an organic film, is used as the adsorption layer in the embodiment, an inorganic layer may be used instead of the resin layer 4. [ The inorganic film constituting the inorganic layer includes at least one selected from the group consisting of, for example, a metal silicide, a nitride, a carbide and a carbonitride.

1 includes the resin layer 4 as the adsorption layer. However, the resin layer 4 may be omitted, and the structure including the substrate 2 and the reinforcing plate 3 may be employed. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by a van der Waals force acting between the substrate 2 and the reinforcing plate 3 or the like. When the substrate 2 and the reinforcing plate 3 are glass substrates, the substrate 2 as a glass substrate and the reinforcing plate 3 as a glass plate are bonded to the surface 3a of the reinforcing plate 3 It is preferable to form an inorganic thin film.

[Layered product (6) of the embodiment in which the functional layer is formed]

The functional layer is formed on the surface 2a of the substrate 2 of the layered product 1 by performing the functional layer forming process. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method and a sputtering method are used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

Fig. 2 is an enlarged side view of the main part showing an example of the rectangular laminate 6 produced during the manufacturing process of the LCD.

The laminate 6 is obtained by stacking the reinforcing plate 3A, the resin layer 4A, the substrate 2A, the functional layer 7, the substrate 2B, the resin layer 4B and the reinforcing plate 3B in this order Respectively. That is, the laminate 6 of Fig. 2 corresponds to a laminate in which the laminate 1 shown in Fig. 1 is arranged symmetrically with the functional layer 7 interposed therebetween. The laminate including the substrate 2A, the resin layer 4A and the reinforcing plate 3A is referred to as a first laminate 1A and the substrate 2B, the resin layer 4B, and the reinforcing plate 3A, Is referred to as a second layered product 1B.

A thin film transistor (TFT) as a functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first layered product 1A and a surface 2Ba of the substrate 2B of the second layered product 1B is formed. A color filter CF as the functional layer 7 is formed.

The first layered product 1A and the second layered product 1B are integrated with the surfaces 2Aa and 2Ba of the substrates 2A and 2B superimposed on each other. Thereby, a laminate 6 having a structure in which the first layered product 1A and the second layered product 1B are arranged symmetrically with the functional layer 7 interposed therebetween is produced.

The laminate 6 is formed such that the peeling start portion is formed at its interface by the blade edge of the knife (peeling knife) in the peeling start portion forming step of the separating step and then the reinforcing plates 3A and 3B are sequentially peeled Thereafter, a polarizing plate, a backlight, and the like are provided to manufacture an LCD, which is a product.

(Peeling Initiation Part Making Apparatus (10))

3 (A) to 3 (E) show a recessed part configuration of the peeling initiation part creating device 10 used in the peeling initiation part creating step and a peeling initiation part creating method by the peeling initiation part creating device 10 Fig. 3 (A) is an explanatory view showing the positional relationship between the laminate 6 and the knife (release knife) N, Fig. 3 (B) 3 (C) is an explanatory view showing a state immediately before the peeling start section 30 is formed on the interface 28, and FIG. 3 (D) 3 (E) is an explanatory diagram of the layered product 6 in which the peeling start portions 26, 30 are formed. The peeling start portion 30 is formed on the interface 28 by the knife N. As shown in Fig.

4 is a plan view of the layered product 6 in which the peeling start portions 26 and 30 are formed.

5 is a side view showing the overall configuration of the peeling initiation part producing device 10, and Fig. 6 is a plan view of the peeling initiation part producing device 10 shown in Fig.

In Fig. 4, the corner cut portions 6A, 6B, 6C, and 6D are provided at the respective corners of the layered product 6. Fig. The corner cut portions 6A to 6D are portions tapered by a grinding stone and are the model numbers of the laminate 6. The cut and cut angles are different for each model number. In the laminate 6 of Fig. 4, the corner cut portions 6A to 6D are provided in all the corner portions, but there is also a laminate in which the corner cut portion is provided in at least one selected corner portion. In Figs. 4 and 6, the corner cut portions 6A to 6D are exaggerated in comparison with the size of the layered product 6, but the corner cut portions 6A to 6D are actually small in size. 2 shows a state in which the laminate 1A is laminated with the laminate 1B, but the shape of the corner cut portion of the laminate 1A in the figure and the shape of the corner cut portion of the laminate 1B are the same In some cases, they may be different.

3, at the time of forming the peeling start portions 26 and 30, the laminated body 6 is formed such that the back surface 3Bb of the reinforcing plate 3B is adsorbed on the table 12 as shown in FIG. 3A And supported in the horizontal direction (X-axis direction in the figure).

The knife N is supported in the horizontal direction by the holder 14 so that the edge Na faces the corner portion 6Aa of the corner cut portion 6A of the laminate 6. [ Further, the height of the knife N is adjusted by the height adjusting device 16 in the height direction (Z-axis direction in the drawing). Further, the knife N and the laminate 6 are relatively moved in the horizontal direction (X direction in the drawing) by a transfer device (moving mechanism) 18 such as a ball screw device. The transfer device 18 moves at least one of the knife N and the table 12 in the horizontal direction. In the embodiment, the knife N is moved. The liquid supply device 22 for supplying the liquid 20 to the upper surface of the blade Na of the knife N before or during insertion is arranged above the knife N. [

[Method of making the peeling start portion]

In the peeling initiation part creating method by the peeling initiation part creating device 10, the knife N is inserted at the corner part 6Aa of the layered product 6, and the overlapping position of the knife N in the thickness direction of the layered product 6 And the amount of the knife N is set to be different for each of the interfaces 24 and 28. [

The procedure will be described.

The edge Na of the knife N in the initial state exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B as the first insertion position and the resin layer 4B. 3 (A), the knife N is moved in the height direction, and the height of the blade tip Na of the knife N is set to the height of the interface 24.

Thereafter, as shown in Fig. 3B, the knife N is moved in the horizontal direction (the direction of arrow A in Fig. 6) toward the corner portion 6Aa of the laminate 6, Insert a predetermined amount of Na. The liquid 20 is supplied from the liquid supply device 22 to the upper surface of the cutting edge Na at the time of knife N insertion or before insertion. As a result, the substrate 2B of the corner portion 6Aa is peeled from the resin layer 4B, so that the triangular peeling initiation portion 26 is formed on the interface 24 in plan view as shown in Fig. In addition, although the supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the separation start portion 26 even after the knife N is removed, so that the separation start portion 26 Can be created.

Next, the knife N is removed in the horizontal direction (the direction of arrow B in Fig. 6) from the corner portion 6Aa, and the knife edge Na of the knife N is removed from the substrate 2A, And the height of the interface 28 of the resin layer 4A.

Thereafter, as shown in FIG. 3 (D), the knife N is moved in the horizontal direction (the direction of arrow A in FIG. 6) toward the laminate 6, and a predetermined amount Na of knife N is inserted into the interface 28. Likewise, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the nail Na. As a result, the peeling initiation portion 30 is formed on the interface 28 as shown in Fig. 3 (E). Here, the amount of self-discharge of the knife N relative to the interface 28 is set to be smaller than that of the interface 24. This is the method of making the peeling start portion. Further, the amount of self-discharge of the knife N with respect to the interface 24 may be smaller than the amount of self-discharge with respect to the interface 28.

The layered product 6 on which the peeling initiation portions 26 and 30 are formed is taken out from the peeling initiation part producing device 10 and transferred to the peeling process. In the peeling process, the layered product 6 is sequentially peeled from the interfaces 24 and 28 by a peeling apparatus to be described later.

4, the laminate 6 is cut from the corner cut portion 6A by the corner cut portion 6C facing the corner cut portion 6A, The first peeling is started with the peeling start portion 26 as the starting point at the interface 24 where the area of the peeling starting portion 26 is large. As a result, the reinforcing plate 3B is peeled off. Thereafter, the laminate 6 is bent again from the corner cut portion 6A toward the corner cut portion 6C, so that the peeling start portion 30 is started from the interface 28 where the area of the peeling start portion 30 is small . As a result, the reinforcing plate 3A is peeled off. The volume of the knife N is preferably set to 7 mm or more, and more preferably 15 to 20 mm, depending on the size of the layered product 6. [

A feature of the peeling apparatus and peeling method according to the present invention resides in a method of forming a peeling start portion by means of the knife N, which will be described later.

[Separation device (40)]

7 is a longitudinal sectional view showing the configuration of the peeling apparatus (peeling means) 40 of the embodiment. Fig. 8 is a sectional view of the peeling unit 42 of the peeling apparatus 40, Fig. 6 is a plan view of the peeling unit 42 schematically showing the arrangement position. 7 corresponds to a sectional view taken along the line D-D in Fig. 8, and in Fig. 8, the laminate 6 is shown by a solid line.

As shown in Fig. 7, the peeling apparatus 40 is provided with a pair of movable devices 46, 46 which are disposed above and below the laminate 6 sandwiched therebetween. Since the movable units 46 and 46 have the same structure, the movable unit 46 disposed on the lower side of FIG. 7 will be described here, and the movable units 46 disposed on the upper side will be denoted by the same reference numerals, do.

The movable device 46 includes a plurality of movable devices 44, a plurality of drive devices (drive devices) 48 for moving the movable device 44 up and down for each of the movable devices 44, And a controller 50 (driving section) for controlling the controller 48.

The peeling unit 42 vacuum-adheres and holds the reinforcing plate 3B to bend the reinforcing plate 3B. Instead of vacuum adsorption, electrostatic adsorption or self adsorption may be used.

[Peeling unit (42)]

9A is a plan view of the peeling unit 42 and FIG. 9B is an enlarged vertical sectional view of the peeling unit 42 along the line E-E in FIG. 9A. 9C shows a state in which the suction portion 54 constituting the peeling unit 42 is pressed against the rectangular plate type flexible plate 52 constituting the peeling unit 42 by the double- Fig. 5 is an enlarged longitudinal sectional view of the peeling unit 42 showing that the peeling unit 42 is detachably provided.

The peeling unit 42 is configured such that the adsorption unit 54 is detachably attached to the flexible plate 52 via the double-sided adhesive tape 56 as described above.

The adsorption section 54 is provided with a flexible plate 58 whose thickness is thinner than that of the flexible plate 52. The lower surface of the flexible plate 58 is detachably mounted on the upper surface of the flexible plate 52 with the double-sided adhesive tape 56 interposed therebetween.

The adsorption section 54 is also provided with a rectangular air permeable sheet 60 for adsorbing and holding the inner surface of the reinforcing plate 3B of the laminate 6. [ The thickness of the breathable sheet 60 is not more than 2 mm, preferably not more than 1 mm, and 0.5 mm in the embodiment, for the purpose of reducing the tensile stress generated in the reinforcing plate 3B at the time of peeling.

The suction portion 54 is also provided with a seal frame member 62 surrounding the air permeable sheet 60 and contacting the outer circumferential surface of the reinforcing plate 3B. The seal frame member 62 and the breathable sheet 60 are bonded to the upper surface of the flexible plate 58 via the double-sided adhesive sheet 64. The seal frame member 62 is a sponge of independent air bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less and has a thickness 0.3 to 0.5 mm thick as compared with the thickness of the air permeable sheet 60. [

A frame-like groove 66 is provided between the air-permeable sheet 60 and the seal frame member 62. A plurality of through holes 68 are opened in the flexible plate 52. One end of these through holes 68 is communicated with the groove 66 and the other end is connected to a suction source (For example, a vacuum pump).

The inner surface of the reinforcing plate 3B of the laminate 6 is vacuum-adsorbed to the air permeable sheet 60 by sucking the air in the suction pipe, the through holes 68 and the grooves 66, And the outer circumferential surface of the reinforcing plate 3B is brought into pressure contact with the seal frame member 62, so that the airtightness of the adsorption space surrounded by the seal frame member 62 is enhanced.

The flexible plate 52 is higher in bending rigidity than the flexible plate 58, the breathable sheet 60 and the seal frame member 62 and the bending rigidity of the flexible plate 52 is higher than the bending rigidity of the separating unit 42 It dominates rigidity. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40000 N · mm 2 / mm. For example, in a portion where the width of the peeling unit 42 is 100 mm, the bending rigidity is 100000-40000 N · mm 2. By setting the bending rigidity of the peeling unit 42 to 1000 N · mm < 2 > / mm or more, it is possible to prevent the bending of the reinforcing plate 3B held by the peeling unit 42. Further, by making the bending rigidity of the peeling unit 42 4000 N · mm 2 / mm or less, the reinforcing plate 3B to be attracted and held by the peeling unit 42 can be appropriately bent and deformed.

The flexible plates 52 and 58 are resin members having a Young's modulus of 10 kPa or less and are made of resin such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, polyacetal Member.

[Moving device 46]

On the lower surface of the flexible plate 52, a plurality of disc-shaped movable members 44 shown in Fig. 7 are fixed in a checkerboard shape as shown in Fig. These movable members 44 are fixed to the flexible plate 52 by fastening members such as bolts, but may be adhesively fixed instead of bolts. These movable members 44 are independently lifted and lowered by the drive unit 48 that is controlled by the controller 50.

That is, the controller 50 controls the drive unit 48 to move from the movable body 44 located on the side of the corner cut portion 6A of the laminate 6 in Fig. 8 to the peeling advancing direction The movable body 44 located on the side of the corner cut portion 6C of the main body 6C is moved downward. By this operation, the peeling is started at the interface 24 of the layered product 6 starting from the peeling start portion 26 (see Fig. 4) as shown in the longitudinal section of Fig. The laminate 6 shown in Figs. 7 and 10 is the laminate 6 in which the peeling start portions 26 and 30 are formed by the peeling start portion forming method described with reference to Fig.

The drive device 48 is constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotary motion of the servo motor is converted into linear motion in the ball screw mechanism and is transmitted to the rod 70 of the ball screw mechanism. A movable body 44 is provided at the distal end portion of the rod 70 via a ball joint 72. As a result, the movable member 44 can be tilted following the bending deformation of the peeling unit 42 as shown in Fig. Therefore, the peeling unit 42 can be bent and deformed from the corner cut portion 6A toward the corner cut portion 6C without exerting an excessive force on the peeling unit 42. [ The driving device 48 is not limited to a rotary servo motor and a ball screw mechanism but may be a linear servo motor or a fluid pressure cylinder (for example, an air pressure cylinder).

It is preferable that the plurality of drive devices 48 are installed via the cushion members 76 in the liftable frame 74. The cushion member 76 is resiliently deformed so as to follow the bending deformation of the peeling unit 42. Thus, the rod 70 is tilted with respect to the frame 74.

The frame 74 is moved down by a driving unit (not shown) when the peeled reinforcing plate 3B is removed from the peeling unit 42. [

The controller 50 is configured as a computer including a recording medium such as a CPU, ROM, and RAM. The controller 50 controls the plurality of drive devices 48 for each drive device 48 by controlling the CPU to execute a program recorded on the recording medium to control the movement of the plurality of movable members 44.

[Method of peeling the reinforcing plates 3A and 3B by the peeling apparatus 40]

11A to 12C to 12A to 12C show the case where the peeling start portions 26 and 30 are formed in the corner portion 6Aa by the peeling start portion forming method described with reference to FIG. A method of peeling the laminate 6 is shown. That is, in the figure, the peeling method for peeling the reinforcing plates 3A and 3B of the laminate 6 is shown in a time-series manner.

The carry-over operation of the laminate 6 to the peeling apparatus 40 and the removal operation of the peeled reinforcing plates 3A and 3B and the panel P are carried out by using the suction pad 78 shown in Fig. Is carried out by one conveying device (80). 11 and 12, the illustration of the movable device 46 is omitted in order to avoid the complexity of the drawing. The panel P is a product panel in which the substrate 2A and the substrate 2B except for the reinforcing plates 3A and 3B are attached via the functional layer 7.

11A is a side view of the peeling apparatus 40 in which the layered product 6 is stacked on the peeling unit 42 on the lower side by the operations indicated by arrows F and G of the transport apparatus 80. Fig. In this case, the lower peeling unit 42 and the upper peeling unit 42 are positioned at a relatively sufficiently retreated position so that the transfer device 80 is inserted between the lower peeling unit and the upper peeling unit 42 Is moved in advance. When the laminated body 6 is placed on the lower peeling unit 42, the reinforcing plate 3B of the laminated body 6 is vacuum-held by the lower peeling unit 42. That is, Fig. 11A shows an adsorption process in which the reinforcing plate 3B is adsorbed and held by the peeling unit 42 on the lower side.

11B shows a state in which the lower peeling unit 42 and the upper peeling unit 42 are moved in a relatively approaching direction and the reinforcing plate 3A of the laminate 6 is peeled from the upper peeling unit 42) in a state of being vacuum-sucked and held. 11B shows an adsorption process in which the reinforcing plate 3A is adsorbed and held by the peeling unit 42 on the upper side.

When the substrate 2 of the laminate 1 shown in Fig. 1 is peeled from the reinforcing plate 3 by the peeling apparatus 40, the substrate 2 as the first substrate is peeled from the upper peeling unit 42, and the reinforcing plate 3 as the second substrate is held by the peeling unit 42 on the lower side. In this case, the supporting portion for supporting the substrate 2 is not limited to the peeling unit 42, and any supporting portion for supporting the substrate 2 may be used. However, by using the peeling unit 42 as the supporting portion, the substrate 2 and the reinforcing plate 3 can be curved and peeled at the same time, so that compared with the form in which only the substrate 2 or the reinforcing plate 3 is curved, Can be reduced.

11, (C) of Fig. 11 shows a state in which the lower peeling unit 42 is bent downward from the corner cut portion 6A of the laminate 6 toward the corner cut portion 6C, (Refer to Fig. 4) at the interface 24 of the substrate 1 (Fig. 4) as a starting point. That is, in the plurality of movable bodies 44 of the lower peeling unit 42 shown in Fig. 10, the movable body 44 located on the side of the corner cut portion 6A of the layered body 6 is moved from the corner cut portion 6C And the reinforcing plate 3B is peeled off from the interface 24, as shown in Fig. In conjunction with this operation, in the plurality of movable members 44 of the peeling unit 42 on the upper side, from the movable body 44 located on the side of the corner cut portion 6A of the layered product 6 to the corner cut portion 6C ) Of the movable body 44 may be moved up and down at the interface 24 in order. As a result, the peeling force can be reduced as compared with a configuration in which only the reinforcing plate 3B is bent.

12A is a side view of the peeling apparatus 40 in a state in which the reinforcing plate 3B is completely peeled from the interface 24. According to this figure, the peeled reinforcing plate 3B is vacuum-held and held on the lower peeling unit 42, and the laminated body 6 excluding the reinforcing plate 3B (including the reinforcing plate 3A and the panel P Is held on the upper peeling unit 42 by vacuum suction.

11 (A) is inserted between the upper and lower peeling units 42, the peeling unit 42 on the lower side and the peeling unit 42 on the upper side are positioned at a relatively retracted position .

Thereafter, the vacuum adsorption of the lower peeling unit 42 is released first. Next, the reinforcing plate 3B is attracted and held via the resin layer 4B by the adsorption pad 78 of the transfer device 80. [ Next, the reinforcing plate 3B is taken out of the peeling apparatus 40 by the operation of the conveyance device 80 indicated by arrows H and I in Fig. 12 (A).

12B is a side view of the laminated body 6 excluding the reinforcing plate 3B held under vacuum by the peeling unit 42 on the lower side and the peeling unit 42 on the upper side. That is, the lower peeling unit 42 and the upper peeling unit 42 are moved in a relatively approaching direction, and the substrate 2B is vacuum-held and held on the lower peeling unit 42.

12C shows a state in which the upper peeling unit 42 is bent upward from the corner cut portion 6A of the layered body 6 toward the corner cut portion 6C while the upper surface of the interface 28 (See FIG. 4) as a starting point in the peeling initiation section 30 (see FIG. 4). More specifically, in the plurality of movable bodies 44 of the peeling unit 42 on the upper side shown in Fig. 10, the movable body 44 located on the side of the corner cut portion 6A of the layered body 6 is moved from the corner cut portion 6C , And the reinforcing plate 3A is peeled off from the interface 28. As a result, The movable body 44 located on the side of the corner cut portion 6A of the layered body 6 is moved from the movable cutout portion 6C of the movable body 44 of the lower side peeling unit 42 to the corner cut portion 6C The movable body 44 may be moved downward in order and peeled off at the interface 28. [ As a result, the peeling force can be reduced as compared with a configuration in which only the reinforcing plate 3A is curved.

Thereafter, the reinforcing plate 3A completely peeled off from the panel P is taken out from the peeling unit 42 on the upper side, and the panel P is taken out from the lower peeling unit 42. The above is the peeling method of the layered product 6 in which the peeling start portions 26 and 30 are formed in the corner portion 6Aa.

[Characteristics of the Peeling Initiation Part Making Apparatus 10]

13 is a plan view showing a state in which a portion Na-1 of the blade Na of the knife N is in contact with the corner portion 6Aa of the corner cut portion 6A of the laminate 6. Fig. In addition, the knife N is formed in a flat plate shape, and a linear edge Na is provided along the edge portion.

As shown in Fig. 5, the laminate 6 and the knife N are arranged on a horizontal plane. The knife N is moved in the direction of the arrow A in Fig. 13 on the horizontal plane so that a part Na-1 of the nail Na touches the corner part 6Aa and then a part Na-1 of the nail Na reaches the interface 24 (See FIG. 3 (B)).

5, the knife N is reciprocally moved in the direction of the arrow A and the direction of the arrow B in Fig. 6 by the conveying device 18 including the feed screw 82 and the motor 84. [ The amount of movement in the jigging direction indicated by the arrow A and the amount of movement in the retracting direction indicated by the arrow B are controlled by the control unit (control means) 86 in Fig. 5 for controlling the motor 84. [

On the other hand, the table 12 for holding and holding the laminate 6 is held by the conveying device (moving mechanism) 92 including the feed screw 88 and the motor 90, The arrow J direction and the arrow K direction. The directions of the arrows J and K are set in a direction parallel to the straight edge Na of the knife N as shown in FIG. The movement amount of the table 12 in the directions of the arrows J and K is also controlled by the control unit 86 that controls the motor 90. [

That is, according to the peeling initiation part creating device 10, the movement of the knife N in the directions of arrows A and B by the motor 84 and the movement of the laminate 6 in the directions of arrows J and K by the motor 90 The relative position of the knife N and the layered product 6 on the plane can be changed (self-insertion position changing means). It is possible to change the insertion position of the blade Na of the knife N inserted into the interfaces 24 and 28 of the laminate 6 by moving the laminate 6 in the directions of arrows J and K. [

That is, the peeling initiation part creating device 10 can change the position of the layered product 6 with respect to the knife N on the plane by the transfer device 92. By controlling the amount of movement of the conveying device 92 in the directions of the arrows J and K by the control unit 86, the insertion position of the knife edge Na of the knife N inserted into the interfaces 24, Can be changed from the insertion position. That is, the control unit 86 is provided with a storage unit for storing the position of the tip Na at the previous time, and changes the position based on the last position when changing the position of the tip Na.

[Operation of Peeling Initiation Part Making Apparatus 10]

14A to 14F are plan views showing an example of a peeling start portion forming method (peeling starting portion forming step) by the peeling start portion forming device 10 in a time-wise manner.

As shown in Fig. 14 (A), at the insertion start position of the knife N, a part Na-1 of the tip Na is arranged to face the corner portion 6Aa. Thereafter, the knife N is moved in the direction of the arrow A as shown in Fig. 14 (B). As a result, a part Na-1 of the tip Na is inserted into the interface 24 of the layered product 6 and the peeling initiation part 26 (see FIG. 3 (C)) is formed in the interface 24.

Fig. 14C is a plan view showing the knife N moved back to the jig start position by moving in the arrow B direction. Also, in the explanatory diagram of Fig. 14, in order to explain the characteristics of the present invention, a description will be given on the assumption that a defect occurs at the cutting edge Na due to the knitting operation of the knife N once.

As shown in Fig. 14C, some of Na-1 embedded in the interface 24 among the knife edge Na of the knife N contacts the wave glass at the time of insertion and a defect occurs.

[Characteristic of the shape of the defect shape of knife edge of knife N]

15 (A) is a plan view for explaining the shape of the missing edge Na.

The laminate 6 has a side edge 6E and a corner cut portion 6A (the other side edge) having a corner portion 6Aa at an apex angle. Here, when the angle formed by one edge 6E and the tip Na is .theta.1, and the angle formed by the corner cut 6A and the tip Na is .theta.2, at the angle .theta.2 side where the angle is smaller with respect to the corner 6Aa, The longer the length of the portion to be inserted than the larger? 1 side. Therefore, a defect (a <b: see Fig. 14 (C)) longer than the edge Na on the? 1 side is generated in the edge Na on the? 2 side as the insertion length becomes longer. Where a is the length of the defects occurring on the θ1 side and b is the length of the defects occurring on the θ2 side. a and b are lengths in the length direction of the nail Na.

Therefore, the laminate 6 is moved by a predetermined amount in the direction of the arrow J as shown in Fig. 14 (D) so as not to use a portion Na-1 of the edge Na at which the defect is generated at the next insertion. That is, the insert position of the nose Na is changed so that the normal edge Na-2 having no defect on the angle? 1 side with a large angle is used for the next insert. As a result, at the interface 28 (next time), a part Na-2 of a normal edge Na having no defect can be used, so that the peeling start portion 30 can be surely formed.

It is also preferable to set the change amount c of the laminate 6 in the direction of the arrow J as a <c <b as shown in FIG. 14 (E). This makes it possible to reduce the shift amount of the tip Na more than to change the position of the tip Na toward the angle? 2 with a small angle, so that the total length of the tip Na can be used more effectively.

The above-described peeling start portion creating method is a method of controlling the feeder 92 to change the insert position of Na edge every time one peeling start portion is created, but the present invention is not limited to this method.

For example, when it is assumed that no breakage occurs at the nail Na by the single knocking operation of the knife N, a part Na-1 of the nail Na is inserted into the interface 28, A new edge Na-2 may be inserted into the recesses 24 and 28 at the time of insertion. That is, the insert position of the nail Na may be changed so as to use a new nail Na for a plurality of insert operations (for example, two or more times).

As shown in Fig. 5, a detection device (detection means) 94 for detecting the deficiency of the cutting edge Na of the knife N is provided. When the deficiency of the cutting edge Na is detected by the detection device 94, 86 may control the conveying device 92 to move the stacked body 6 by a predetermined amount of deviation in the direction of arrow J in Fig.

In this method for changing the insertion position, since the normal edge Na free from defects is used at the next insertion, it is possible to reliably prepare the next separation start portion in the laminate 6. [ In addition, when a partial Na-1 defect of the nail Na is detected, some of Na-2 adjacent to some Na-1 is used for the next insert, so that the service life of the knife N can be further extended. The detection device 94 may be any device capable of detecting a defect such as an imaging device for imaging a defect, an optical device having a light-transmitting portion and a light-receiving portion sandwiched between the blades, and the like.

Further, when changing the insertion position as described above, since the insert position of the nail Na is changed toward the angle? 1 with a large angle, the amount of misalignment of the nail Na Can be reduced. Therefore, the entire length of the nail Na can be utilized more effectively.

FIG. 15B is an explanatory view showing a special example of a method of changing the insertion position.

The corner cut portion 6A shown in Fig. 15A and the corner cut portion 6F shown in Fig. 15B may have different shapes depending on the same knife N in some cases.

The angle θ3 shown in FIG. 15B is an angle formed by the edge Na at one edge 6G having the vertex angle of the corner 6Fa and the angle θ4 is the other edge at the vertex of the corner 6Fa, The angle formed by the corner cut portion 6F and the tip Na. 15 (B), the deviation (movement) direction of the laminate 6 is the direction of arrow K and is opposite to the direction of arrow J in Fig. 15 (A).

However, when? 2 shown in FIG. 15A is compared with? 3 shown in FIG. 15B,? 2 <? 3, and the range in which the defect is generated in FIG. 15B is narrow, , The direction of shifting may be set to the direction of the arrow J in preference to the mode of FIG. 15 (A).

Although the present invention has been described in detail with reference to specific embodiments, it is apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention.

The present application is based on Japanese Patent Application No. 2014-143018 filed on July 11, 2014, the contents of which are incorporated herein by reference.

N: Knife
Na, Na-1, Na-2: Part of the nail
P: Panel
1:
1A: first laminate
1B: second laminate
2: substrate
2a: surface of the substrate
2b: the rear surface of the substrate
2A: substrate
2Aa: surface of substrate
2B: substrate
2Ba: surface of the substrate
2Bb: the back surface of the substrate
3: reinforced plate
3a: Surface of the reinforcing plate
3A: Reinforced plate
3B: reinforced plate
3Bb: the back side of the reinforcing plate
4: Resin layer
4A: Resin layer
4B: Resin layer
6:
6A to 6D:
6Aa, 6Fa: corner portion
7: functional layer
8: Reinforced plate
10: Peeling initiation unit
12: Table
14: Holder
16: height adjustment device
18: Feeding device
20: liquid
22: liquid supply device
24: Interface
26: peeling initiation portion
28: Interface
30: peeling initiation portion
40: peeling device
42: peeling unit
44: movable body
46:
48: Driving device
50: Controller
52: Flexible plate
54:
56: double-sided adhesive tape
58: flexible version
60: breathable sheet
62: seal frame member
64: Double-sided adhesive sheet
66: home
68: Through hole
70: Load
72: ball joint
74: frame
76: Cushion member
78: Adsorption pad
80:
82: Feed screw
84: Motor
86:
88: Feed screw
90: Motor
92: Feeding device
94: Detector

Claims (12)

In which the first substrate and the second substrate are peelably attached to each other, peeling off from the interface between the first substrate and the second substrate with respect to the rectangular stacked body,
A peeling knife which is a flat plate type and has a sharp edge along a rim portion and which forms a peeling start portion on the interface by punching a predetermined amount of the edge at the interface from the corner portion of the laminate,
Peeling means for peeling off from the interface with the peeling start portion as a starting point;
A self-aligning position changing means for changing a relative position of the peeling knife and the laminate on a plane,
And control means for controlling the insertion position changing means so as to change the insertion position of the edge of the separation knife inserted into the interface,
And peeling off the laminated body. The method according to claim 1,
Wherein the control means controls the insertion position changing means so as to change the insertion position of the blade from the previous insertion position every time the at least one separation start portion is created. The method according to claim 1,
And a detecting means for detecting a deficiency of a blade edge of the peeling knife, wherein the control means controls the cutting means such that when the deficiency of the blade edge is detected by the detecting means, And controls the changing means. 4. The method according to any one of claims 1 to 3,
Wherein one edge of the edge of the peeling knife having a vertex of the corner of the stacked body and the edge of the other edge,
The control means controls the insertion position changing means such that the angle between the one side edge and the edge and the angle between the other side edge and the edge are changed to the next adjacent edge position, Sieving device. A method for peeling a layered product in which a first substrate and a second substrate are peelably bonded to each other at an interface between the first substrate and the second substrate with respect to a rectangular stacked body,
A peeling start portion forming step of forming a peeling start portion on the interface by inserting a blade edge along a rim of a flat plate type separation knife in a predetermined amount from a corner portion of the laminate to the interface,
A peeling step of peeling off from the interface with the peeling start part as a starting point
And,
Wherein the peeling start portion forming step includes a step of changing a position of insertion of the edge of the peeling knife inserted into the interface. 6. The method of claim 5,
Wherein the step of changing the insertion position is carried out so as to change the insertion position of the blade from the previous insertion position every time at least one of the separation start portions is created. 6. The method of claim 5,
Wherein the insertion position changing step is performed so as to change the insertion position of the blade tip from the previous insertion position when a separation of the blade edge of the separation blade is detected. 8. The method according to any one of claims 5 to 7,
Wherein one edge of the edge of the peeling knife having a vertex of the corner of the stacked body and the edge of the other edge,
Wherein the step of changing the insertion position is carried out such that the angle between the one edge and the blade and the angle between the other edge and the blade are changed to the next winding position, Way. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate and a rectangular laminate body in which a first substrate and a second substrate are detachably attached; A method of manufacturing an electronic device having a separation step of separating a second substrate,
In the separation step,
A peeling start portion forming step of forming a peeling start portion on the interface by inserting a blade edge along a rim of the flat plate type separation knife by a predetermined amount from the corner portion of the laminate to the interface between the first substrate and the second substrate ,
A peeling step of peeling off from the interface with the peeling start part as a starting point
And,
Wherein the peeling start portion forming step includes a jig position changing step of changing an insertion position of a cutting edge of the peeling knife inserted into the interface. 10. The method of claim 9,
Wherein the step of changing the insertion position is performed so as to change the insertion position of the blade from the previous insertion position every time at least one of the separation start portions is created. 10. The method of claim 9,
Wherein the jig changing position process is performed so as to change the jig position of the blade tip from the previous jig position when a deficiency of the blade edge of the separation blade is detected. 12. The method according to any one of claims 9 to 11,
Wherein one edge of the edge of the peeling knife having a vertex of the corner of the stacked body and the edge of the other edge,
Wherein the step of changing the insertion position is carried out such that the angle between the one edge and the edge and the angle between the other edge and the edge are changed to the next edge position Way.

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