TW201607764A - Peeling apparatus and peeling method for laminated body and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to a peeling apparatus for laminated body, which is operated on a rectangular laminated body formed by detachably attaching a first substrate to a second substrate so as to perform a peeling operation at an interface between the first substrate and the second substrate. The peeling apparatus for laminated body is characterized by comprising: a flat peeling knife having an edge formed thereon a blade for stabbing a specific portion of the blade into an interface from a corner part of the laminated body so as to form a peeling start part at the interface; a peeling member for performing a peeling operation at the interface by taking the peeling start part as a start point; a stabbing position change member for changing the relative position of the peeling knife and the laminated body on a plane; and a control member for controlling the stabbing position change member by changing the stabbing position of the blade of the peeling knife that is used to stab into the interface.

Description

Stripping device and peeling method of laminated body, and manufacturing method of electronic device

The present invention relates to a peeling device and a peeling method for a laminate, and a method for manufacturing the electronic device.

In order to reduce the thickness and weight of an electronic device such as a display panel, a solar cell, or a thin film secondary battery, it is highly desirable to use a thin plate for a substrate (first substrate) such as a glass plate, a resin plate, or a metal plate for the electronic device.

However, if the thickness of the substrate is thinned, the substrate is deteriorated. Therefore, it is difficult to form a functional layer for an electronic device on the front surface of the substrate (Thin Film Transistor (TFT), color filter (CF). :Color Filter)).

For this reason, a method of manufacturing an electronic device in which a reinforcing plate (second substrate) is attached to the back surface of the substrate, and a laminated body of the substrate is reinforced by a reinforcing plate, and a functional layer is formed on the front surface of the substrate in a state of a laminated body is proposed. This manufacturing method improves the rationality of the substrate, so that the functional layer can be favorably formed on the front surface of the substrate. Further, the reinforcing plate is peeled off from the substrate after forming the functional layer.

The peeling method of the reinforcing plate disclosed in Patent Document 1 is such that the reinforcing plate or the substrate, or both directions thereof are separated from each other by one of the two corner portions on the diagonal line of the rectangular laminated body. The direction is flexed and deformed. At this time, in order to smoothly perform the peeling, a peeling start portion is formed at one corner portion of the laminated body. The peeling start portion is formed by piercing the blade edge of the peeling blade from a corner portion of the laminated body to a certain amount of the interface between the substrate and the reinforcing plate.

Further, in Patent Document 2, similarly, a tool (a blade edge portion) of a sharp member (peeling blade) is inserted into an interface between a substrate to be processed (first substrate) and a support substrate (second substrate), and the interface is A peeling device that performs peeling.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/024689

[Patent Document 2] Japanese Patent Laid-Open No. 2014-60346

In the peeling apparatus of Patent Documents 1 and 2, when the peeling start portion is formed at the interface by the peeling blade, when the blade edge comes into contact with the fine glass swarf attached to one corner of the laminated body, the cutting edge is defective. . If the cutting edge is defective, the cutting edge cannot be surely penetrated into the next interface. Therefore, there is a problem that the peeling start portion which contributes to peeling at the interface cannot be reliably formed at the next interface.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a peeling device and a peeling method capable of reliably forming a laminate starting portion at an interface of a laminate by a blade edge of a peeling blade, and an electronic device. Production method.

In order to achieve the above object, the laminated device of the laminated body of the present invention is a rectangular laminated body in which the first substrate and the second substrate are detachably attached to each other at the interface between the first substrate and the second substrate. a peeling blade comprising: a peeling blade having a blade shape and a blade having a blade edge along the edge portion, wherein the blade edge is inserted into the interface from a corner portion of the laminated body by a specific amount, a peeling start portion is formed at the interface; the peeling device is peeled off at the interface from the peeling start portion; and the piercing position changing device changes the relative position of the peeling blade and the layered body on a plane; and a control device for changing a piercing position of the blade tip of the peeling blade piercing the interface The manner of controlling the above-described piercing position changing device is controlled.

In order to achieve the above object, the method for peeling the laminated body of the present invention is a rectangular laminated body in which the first substrate and the second substrate are detachably attached to each other at the interface between the first substrate and the second substrate. The peeling member includes a peeling start portion forming step of piercing a blade edge provided along an edge portion of the flat plate-shaped peeling blade from a corner portion of the laminated body to the interface by a specific amount to form a peeling at the interface a starting portion; and a peeling step of peeling off at the interface with the peeling start portion as a starting point; and the peeling start portion forming step includes changing a piercing position of a piercing position of the blade edge of the peeling blade piercing the interface Change step.

In order to achieve the above object, a method of manufacturing an electronic device according to the present invention includes a functional layer forming step of forming a rectangular laminated body in which a first substrate and a second substrate are peelably attached to each other on the first substrate. The exposed surface forms a functional layer; and the separating step of separating the second substrate from the first substrate on which the functional layer is formed; and in the method of manufacturing the electronic device, the separating step includes a peeling start portion forming step a cutting edge provided along the edge of the flat-shaped peeling blade is inserted into the interface between the first substrate and the second substrate from a corner portion of the laminated body by a specific amount, and a peeling start portion is formed at the interface; And a peeling step of peeling off at the interface with the peeling start portion as a starting point; and the peeling start portion forming step includes a step of changing a piercing position for changing a piercing position of the blade edge of the peeling blade that penetrates the interface.

According to the present invention, in the step of changing the piercing position, the control means controls the piercing position changing means to change the piercing position of the blade edge of the peeling blade which pierces the interface. Therefore, according to one aspect of the present invention, when the piercing position of the blade edge is changed, the normal blade edge having no defect is used for the next piercing, so that the peeling start portion can be surely formed at the interface of the laminated body.

The peeling blade of the present invention has a flat plate shape and is provided with a flat blade shape of a blade edge along the edge portion.

On the other hand, the length of the blade tip actually used to form the peeling start portion relative to the tip of the blade (also known as effective length) is a very small part. In the conventional peeling apparatus, if the defect is generated in such a small portion, the peeling start portion cannot be reliably formed. Therefore, it is necessary to replace the peeling knife that has caused the defect with a new peeling knife that is free from defects.

On the other hand, in the present invention, the substantially full length of the blade edge provided along the edge portion can be effectively used as the blade edge for forming the peeling start portion, so that the frequency of replacement of the peeling blade can be reduced, and the service life of the peeling blade can be extended.

In the above-described piercing position changing device of the present invention, since the device for changing the position of the peeling blade and the laminated body on the plane is changed, each of the driving mechanism portions may be provided to change the relative position of both the peeling blade and the laminated body. At least one of the drive mechanism units is provided to change the relative position. That is, the peeling device of the present invention includes a single-axis drive mechanism portion for piercing the blade edge of the peeling blade into the interface, and a single-axis drive mechanism portion for changing the relative position. The two (two-axis) drive mechanism portions may be separated, one drive mechanism portion may be provided on the peeling blade side, and the other drive mechanism portion may be provided on the laminated body side, or the two-axis drive mechanism portion may be provided. One side.

Preferably, the amount of change of the piercing position of the blade edge by the piercing position changing device is preferably based on the amount of penetration of the blade edge and the edge of the blade edge relative to one of the corners of the blade edge being inserted into the blade edge Set by the angle formed (also called the penetration angle). In other words, since the amount of the blade tip (the length) can be estimated based on the amount of penetration of the blade tip and the penetration angle, it is preferable that the blade edge that is missing is not used for the next penetration. The position, ie the tool tip is offset along the length of the tool tip. Thereby, the full length of the tip can be effectively utilized.

In one aspect of the peeling apparatus of the laminated body of the present invention, preferably, the control device changes the piercing position of the cutting edge from the last piercing position every time at least one peeling start portion is formed. The method controls the above-described piercing position changing device.

In one aspect of the method for peeling a laminate of the present invention and the method for producing an electronic device, it is preferable that the step of changing the piercing position is to pierce the tip of the blade every time at least one peeling start portion is formed. The position has been changed since the last time the position was changed.

According to the above aspect of the present invention, in the step of changing the piercing position, each time at least one peeling start portion is formed, the piercing position of the blade edge is changed from the previous piercing position. Therefore, the position of the piercing position of the blade edge is changed every time the peeling start portion is formed, and the normal blade edge without defect can be used for the next piercing. Therefore, the peeling start portion can be surely formed in the laminated body. Further, the piercing position of the blade edge may be changed every time two or more peeling start portions are formed. In the above aspect of the invention, even if the blade tip does not have a defect at the time of the last piercing, the blade tip used in the last piercing is not used in the next piercing. Use a normal tip adjacent to the tip. The control device memorizes the position of the tool tip that was last pierced, and changes the position of the tool tip based on the previous position.

In another aspect of the stripping apparatus of the laminated body of the present invention, it is preferable to provide a detecting device for detecting a defect of the cutting edge of the peeling blade, and the control device controls the defect of the cutting edge when the detecting device detects the defect of the cutting edge The above piercing position changing device.

In another aspect of the method for peeling a laminate of the present invention and the method for producing an electronic device, it is preferable that the step of changing the piercing position is to detect the defect of the blade edge of the peeling blade. The piercing position is changed from the last position of the piercing position.

According to another aspect of the present invention, in the step of changing the piercing position, when the defect of the blade edge is detected by the detecting device, the piercing position of the blade edge is changed from the previous piercing position, and thus The next time you puncture, you can use the normal tip without defects. Therefore, the peeling start portion can be surely formed in the laminated body. In the above aspect of the invention, since the normal blade edge adjacent to the blade tip is used for the next piercing when the blade tip defect is detected, the service life of the peeling blade can be further extended. The control device memorizes the position of the tool tip that was last pierced, and changes the position of the tool tip based on the previous position.

In the present invention, it is preferred that the laminate is pierced into the tip of the peeling blade. The corner portion of the body is a side portion and the other side portion of the vertex angle, and the control device has a larger angle between the angle formed by the one side portion and the blade edge and an angle formed by the other side portion and the blade edge The blade side of the angle side is changed to the position of the next piercing position, and the above-mentioned piercing position changing device is controlled.

In the present invention, it is preferable that the side portion and the other side portion which are the corners of the corner portion of the laminated body which penetrates the blade edge of the peeling blade are the step of changing the piercing position to the side portion and the above The angle formed by the cutting edge and the angle of the larger angle on the angle formed by the other side portion and the cutting edge are changed to the next piercing position.

In the above case, since the new tool edge on the larger angle side is changed to the next piercing position, it can be reduced as compared with the case where the new tool edge on the smaller angle side is changed to the next piercing position. The amount of change in relative position, that is, the offset of the tool tip. Therefore, the full length of the tip can be utilized more effectively.

According to the peeling device and the peeling method of the laminated body of the present invention, and the method of manufacturing the electronic device, the peeling start portion can be surely formed in the laminated body by the blade edge of the peeling blade.

1‧‧ ‧ laminated body

1A‧‧‧1st laminate

1B‧‧‧2nd layer body

2‧‧‧Substrate

2a‧‧‧front of the substrate

2b‧‧‧Back of the substrate

2A‧‧‧Substrate

2Aa‧‧‧front of the substrate

2B‧‧‧Substrate

2Ba‧‧‧front of the substrate

2Bb‧‧‧ back of the substrate

3‧‧‧ reinforcing plate

3a‧‧‧ Strengthening the front of the board

3A‧‧‧ reinforcing plate

3B‧‧‧ reinforcing plate

3Bb‧‧‧ Back of the reinforcing board

4‧‧‧ resin layer

4A‧‧‧ resin layer

4B‧‧‧ resin layer

6‧‧‧Layer

6A‧‧‧Chopped corner

6Aa‧‧ Corner

6B‧‧‧Chopped corner

6C‧‧‧Chopped corner

6D‧‧‧Chopped corner

6E‧‧‧Edge

6F‧‧‧Chopped corner

6Fa‧‧ Corner

6G‧‧‧Edge

7‧‧‧ functional layer

8‧‧‧ reinforcing plate

10‧‧‧ peeling start forming device

12‧‧‧ platform

14‧‧‧ Keeper

16‧‧‧ Height adjustment device

18‧‧‧ Feeding device

20‧‧‧Liquid

22‧‧‧Liquid supply device

24‧‧‧ interface

26‧‧‧ peeling start

28‧‧‧ interface

30‧‧‧ peeling start

40‧‧‧ peeling device

42‧‧‧ peeling unit

44‧‧‧ movable body

46‧‧‧ movable device

48‧‧‧ drive

50‧‧‧ Controller

52‧‧‧Flexible board

54‧‧‧Adsorption Department

56‧‧‧Double-sided tape

58‧‧‧Flexible board

60‧‧‧ breathable sheet

62‧‧‧ Sealing frame members

64‧‧‧Double-sided sheet

66‧‧‧ slots

68‧‧‧through holes

70‧‧‧ pole

72‧‧‧ ball joint

74‧‧‧Frame

76‧‧‧ cushioning members

78‧‧‧Adsorption pad

80‧‧‧Transporting device

82‧‧‧feed screw

84‧‧‧Motor

86‧‧‧Control Department

88‧‧‧feed screw

90‧‧‧Motor

92‧‧‧Feeding device

94‧‧‧Detection device

A‧‧‧ length

B‧‧‧ Length

c‧‧‧Changes

N‧‧‧blade

One part of Na‧‧‧

One part of Na-1‧‧‧

Na-2‧‧‧ part of the knife tip

P‧‧‧ panel

Θ1‧‧‧ angle

Θ2‧‧‧ angle

Θ3‧‧‧ angle

Θ4‧‧‧ angle

Fig. 1 is an enlarged side elevational view of an essential part showing an example of a laminate for a manufacturing step of an electronic device.

Fig. 2 is an enlarged side elevational view of an essential part showing an example of a laminate produced in the middle of a manufacturing process of an LCD (Liquid Crystal Display).

3(A) to 3(E) are explanatory views showing a method of forming a peeling start portion by the peeling start portion forming device.

4 is a plan view showing a laminated body in which a peeling start portion is formed by a peeling start portion forming method.

Fig. 5 is a side view showing the overall configuration of a peeling start portion forming device.

Fig. 6 is a plan view showing the peeling start portion forming device shown in Fig. 5.

Fig. 7 is a longitudinal sectional view showing the configuration of a peeling device of the embodiment.

Fig. 8 is a plan view schematically showing a flexible plate in which the movable body is disposed at a position relative to the peeling unit.

9(A) to 9(C) are explanatory views showing the configuration of the peeling unit.

Fig. 10 is a vertical cross-sectional view showing a peeling device which is peeled off at the interface of the laminated body.

(A) to (C) are explanatory views showing a method of peeling off a reinforcing plate in which a laminated body having a peeling start portion is formed by a peeling start portion forming method in a time series.

Fig. 12 (A) to (C) are explanatory views showing a peeling method of the reinforcing plate of the peeled laminated body in time series in Fig. 11 (A) to (C).

Fig. 13 is a plan view showing a state in which the blade edge of the blade contacts the corner portion of the chamfered portion of the laminated body.

(A) to (F) of FIG. 14 are plan views showing an example of a step of forming a peeling start portion by the peeling start portion forming device.

15(A) to 15(B) are plan views showing the shape of the blade tip of the blade.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

Hereinafter, a case where the peeling device and the peeling method of the laminated body of the present invention are used in the manufacturing steps of the electronic device will be described.

The electronic device refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.

[Manufacturing steps of electronic device]

The electronic device forms a functional layer for an electronic device by a front surface of a substrate made of glass, resin, or metal (in the case of an LCD, a thin film transistor (TFT), a color filter) (CF)) manufactured.

Before forming the functional layer, the back surface of the substrate is attached to the reinforcing plate to form a laminated body. Thereafter, a functional layer is formed on the front surface of the substrate in the state of the laminate. Then, after the functional layer is formed, the reinforcing plate is peeled off from the substrate.

In other words, in the manufacturing step of the electronic device, a functional layer forming step of forming a functional layer on the front surface of the substrate in the state of the laminated body and a separating step of separating the reinforcing plate from the substrate on which the functional layer is formed are provided. In the separation step, the peeling device and the peeling method of the laminated body of the present invention are applied.

[Layer 1]

Fig. 1 is an enlarged side elevational view showing an essential part of an example of the laminated body 1.

The laminated body 1 includes a substrate (first substrate) 2 on which a functional layer is to be formed, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. Further, the reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the front surface 3a, and a back surface 2b of the substrate 2 is attached to the resin layer 4. In other words, the substrate 2 is detachably attached to the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting on the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]

A functional layer is formed on the front surface (exposed surface) 2a of the substrate 2. As the substrate 2, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these substrates, the glass substrate is preferably used as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability resistance and has a small coefficient of linear expansion. Further, there is also an advantage that as the coefficient of linear expansion becomes smaller, the pattern of the functional layer formed at a high temperature is less likely to shift during cooling.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of 40 to 90% by mass in terms of oxide.

The glass of the glass substrate is preferably selected to be of a type suitable for the electronic device to be manufactured. Glass, and glass suitable for its manufacturing steps. For example, a glass substrate for a liquid crystal panel preferably uses a glass (alkali-free glass) which does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 is made of a glass substrate, the thickness of the electronic device is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less for light weight and thinning. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Further, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. However, from the viewpoint of the production of the glass substrate and the treatment of the glass substrate, the thickness thereof is preferably 0.03 mm or more. .

Furthermore, in FIG. 1, the substrate 2 includes one substrate, but the substrate 2 may include a plurality of substrates. That is, the substrate 2 may include a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2.

[Reinforcing board 3]

Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

The thickness of the reinforcing plate 3 is set to 0.7 mm or less, which is set according to the type, thickness, and the like of the substrate 2 to be reinforced. Further, the reinforcing plate 3 may have a thickness thicker than the substrate 2 or may be thinner than the substrate 2. However, in order to reinforce the substrate 2, it is preferably 0.4 mm or more.

Further, in the present embodiment, the reinforcing plate 3 includes one substrate, but the reinforcing plate 3 may include a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 is the thickness of the reinforcing plate 3.

[Resin layer 4]

In order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set to be higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling step, peeling is performed at the interface between the resin layer 4 and the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin and a polyolefin. A hydrocarbon resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, and a polyamidene polyoxyl resin. Several kinds of resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polyphthalocyanine resin or a polyamidene polyoxymethylene resin is preferable.

The thickness of the resin layer 4 is not particularly limited, but is preferably 1 to 50 μm, more preferably 4 to 20 μm. When the thickness of the resin layer 4 is 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the formation time of the resin layer 4 can be shortened, and it is not necessary to excessively use the resin of the resin layer 4, which is economical.

Further, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3 so that the entire resin layer 4 can be supported by the reinforcing plate 3. Further, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2, so that the resin layer 4 can be in close contact with the entirety of the substrate 2.

Further, in FIG. 1, the resin layer 4 includes one layer, but the resin layer 4 may include two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer 4. Moreover, in this case, the kind of the resin which comprises each layer may differ.

Further, in the embodiment, the resin layer 4 as the organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

Further, the laminated body 1 of Fig. 1 includes the resin layer 4 as an adsorption layer, but the resin layer 4 may be removed to form the substrate 2 and the reinforcing plate 3. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by a van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. Further, when the substrate 2 and the reinforcing plate 3 are glass substrates, it is preferable to form an inorganic film on the front surface 3a of the reinforcing plate 3 so that the substrate 2 as the glass substrate and the reinforcing plate 3 as the glass plate are not subjected to high temperature. And then.

[Laminate 6 in which an embodiment having a functional layer is formed]

The functional layer is formed on the front surface 2a of the substrate 2 of the laminated body 1 by the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method or a sputtering method is used. The functional layer is formed into a specific pattern by photolithography and etching.

Fig. 2 is an enlarged side elevational view of an essential part showing an example of a rectangular laminated body 6 which is formed in the middle of the manufacturing process of the LCD.

The laminated body 6 is configured by sequentially laminating the reinforcing plate 3A, the resin layer 4A, the substrate 2A, the functional layer 7, the substrate 2B, the resin layer 4B, and the reinforcing plate 3B. In other words, the laminated body 6 of FIG. 2 corresponds to a laminated body in which the laminated body 1 shown in FIG. 1 is symmetrically arranged with the functional layer 7 interposed therebetween. Hereinafter, the laminated body including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminated body 1A, and the laminated body including the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminated body 1B.

A thin film transistor (TFT) as the functional layer 7 is formed on the front surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the front surface 2Ba of the substrate 2B of the second laminated body 1B. CF).

The first layered body 1A and the second layered body 1B are integrated with each other by overlapping the front faces 2Aa and 2Ba of the substrates 2A and 2B. In this way, the laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are symmetrically arranged via the functional layer 7 is manufactured.

In the peeling start portion forming step of the separation step, after the peeling start portion is formed at the interface of the laminated body 6 by the blade edge of the blade (peeling blade), the reinforcing plates 3A, 3B are sequentially peeled off in the peeling step of the separating step, Thereafter, a polarizing plate, a backlight, and the like are mounted to manufacture an LCD as a product.

[Peeling start portion forming device 10]

3(A) to (E) show the peeling start shape used in the peeling start portion forming step. FIG. 3(A) is an explanatory view showing a positional relationship between the laminated body 6 and the blade (peeling blade) N, and FIG. 3(A) is an explanatory view showing a configuration of a main portion of the forming device 10 and a peeling start portion forming method of the peeling start portion forming device 10. 3(B) is an explanatory view in which the peeling start portion 26 is formed at the interface 24 by the blade N, and FIG. 3(C) is an explanatory view showing a state immediately before the peeling start portion 30 is formed at the interface 28, and FIG. 3(D) The illustration of the peeling start portion 30 is formed at the interface 28 by the blade N, and FIG. 3(E) is an explanatory view of the laminated body 6 in which the peeling start portions 26 and 30 are formed.

Moreover, FIG. 4 is a top view of the laminated body 6 in which the peeling start parts 26 and 30 are formed.

In addition, FIG. 5 is a side view showing the overall configuration of the peeling start portion forming apparatus 10, and FIG. 6 is a plan view of the peeling start portion forming apparatus 10 shown in FIG. 5.

In FIG. 4, chamfered portions 6A, 6B, 6C, and 6D are provided at respective corner portions of the laminated body 6. The cut corner portions 6A to 6D are portions that are ground into a wedge shape by a grindstone, and indicate the type of the laminated body 6, and the amount of cutting and the cutting angle vary depending on the model. The laminated body 6 of Fig. 4 is provided with chamfered portions 6A to 6D at all corners, but also has a laminated body in which at least one corner portion is provided with a chamfered portion. Further, in FIGS. 4 and 6, the chamfered portions 6A to 6D are exaggeratedly displayed with respect to the size of the laminated body 6, but the size thereof is actually small. In addition, although the state in which the laminated body 1A and the laminated body 1B are bonded together is shown in FIG. 2, the shape of the chamfered portion of the laminated body 1A in the drawing is the same as the shape of the chamfered portion of the laminated body 1B, and there are also cases. Different situations.

Returning to Fig. 3, when the peeling start portions 26, 30 are formed, the laminated body 6 is as shown in Fig. 3(A), and the back surface 3Bb of the reinforcing plate 3B is held by the stage 12 and is horizontally (in the X-axis direction in the drawing). stand by.

The blade N is supported by the holder 14 in the horizontal direction such that the blade edge Na faces the corner portion 6Aa of the chamfered portion 6A of the laminated body 6. Further, the position of the height direction of the blade N (the Z-axis direction in the drawing) is adjusted by the height adjusting device 16. Further, the blade N and the laminated body 6 are relatively moved in the horizontal direction (X direction in the drawing) by a feeding device (moving mechanism portion) 18 such as a ball screw device. The feeding device 18 may move at least one of the blade N and the stage 12 in the horizontal direction, and in the embodiment, the blade N is moved. Further, in addition, the knife before or during the piercing The liquid supply device 22 that supplies the liquid 20 on the upper surface of the blade tip Na of the sheet N is disposed above the blade N.

[Peeling start portion forming method]

In the method of forming the peeling start portion by the peeling start portion forming apparatus 10, the piercing position of the blade N is set to the corner portion 6Aa of the laminated body 6 and overlapped in the thickness direction of the laminated body 6, and the interface is formed. 24, 28 different ways to set the amount of penetration of the blade N.

The formation procedure will be described.

In the initial state, the blade edge Na of the blade N is present at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B as the first piercing position and the resin layer 4B. Therefore, first, as shown in FIG. 3(A), the blade N is moved in the height direction, and the height of the blade tip Na of the blade N is set to the height of the interface 24.

Thereafter, as shown in FIG. 3(B), the blade N is moved toward the corner portion 6Aa of the laminated body 6 in the horizontal direction (the direction of the arrow A in FIG. 6), and the blade edge Na of the blade N is pierced into the interface 24 by a specific amount. Further, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade tip Na at the time of piercing of the blade N or before piercing. Thereby, the substrate 2B of the corner portion 6Aa is peeled off from the resin layer 4B. Therefore, as shown in FIG. 4, the peeling start portion 26 having a triangular shape in plan view is formed at the interface 24. Further, the supply of the liquid 20 is not essential. However, when the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 after the blade N is removed, so that the peeling start portion 26 which can no longer be attached can be formed.

Next, the blade N is pulled out from the corner portion 6Aa in the horizontal direction (the direction of the arrow B in Fig. 6), and as shown in Fig. 3(C), the blade tip Na of the blade N is set as the substrate 2A as the second piercing position. The height of the interface 28 of the resin layer 4A.

Thereafter, as shown in FIG. 3(D), the blade N is moved in the horizontal direction (the direction of the arrow A in FIG. 6) toward the laminated body 6, and the blade edge Na of the blade N is pierced into the interface 28 by a specific amount. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the tip Na. Thereby, as shown in FIG. 3(E), the peeling start part 30 is formed in the interface 28. Here, the amount of penetration of the blade N to the interface 28 is set to be less than the amount of penetration of the interface 24. The above is the method of forming the peeling start portion. Furthermore, it can also The amount of penetration of the blade N to the interface 24 is set to be less than the amount of penetration of the interface 28.

The laminated body 6 on which the peeling start portions 26 and 30 are formed is taken out from the peeling start portion forming device 10, and is moved to the peeling step. In the peeling step, the laminated body 6 is sequentially peeled off at the interfaces 24 and 28 by the following peeling means.

The details of the peeling method at the interfaces 24 and 28 will be described later, and the laminated body 6 is deflected from the chamfered portion 6A toward the chamfered portion 6C facing the chamfered portion 6A by the arrow C as shown in FIG. On the other hand, the interface 24 having a large area of the peeling start portion 26 is peeled off from the peeling start portion 26 as a starting point. Thereby, the reinforcing plate 3B is peeled off. Then, the laminated body 6 is deflected again from the chamfered portion 6A toward the chamfered portion 6C, and the interface 28 having a small area of the peeling start portion 30 is peeled off from the peeling start portion 30 as a starting point. Thereby, the reinforcing plate 3A is peeled off. The amount of penetration of the blade N is set according to the size of the laminated body 6, and is preferably set to 7 mm or more, and more preferably about 15 to 20 mm.

Further, the peeling device and the peeling method of the present invention are characterized by a method of forming a peeling start portion of the blade N, which will be described later.

[Peeling device 40]

7 is a longitudinal cross-sectional view showing a configuration of a peeling device (peeling device) 40 of the embodiment, and FIG. 8 is a plan view schematically showing a peeling unit 42 of a plurality of movable bodies 44 with respect to a position where the peeling unit 42 of the peeling device 40 is disposed. . Further, Fig. 7 corresponds to a cross-sectional view taken along line D-D of Fig. 8, and further, the laminated body 6 is indicated by a solid line in Fig. 8.

As shown in Fig. 7, the peeling device 40 is provided with a pair of movable devices 46 and 46 arranged vertically above the laminated body 6. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of FIG. 7 will be described here, and the same reference numerals will be given to the movable device 46 disposed on the upper side, and the description thereof will be omitted.

The movable device 46 includes a plurality of movable bodies 44, a plurality of driving devices (driving portions) 48 for moving the movable body 44 up and down for each movable body 44, and a controller 50 for controlling each of the driving devices 48 (driving) Department) and so on.

The peeling unit 42 vacuum-sucks and holds the reinforcing plate 3B so that the reinforcing plate 3B is flexibly deformed. Further, it is also possible to use electrostatic adsorption or magnetic adsorption instead of vacuum adsorption.

[Peel unit 42]

Fig. 9(A) is a plan view of the peeling unit 42, and Fig. 9(B) is an enlarged longitudinal sectional view of the peeling unit 42 taken along line E-E of Fig. 9(A). In addition, FIG. 9(C) is an enlarged longitudinal cross-sectional view of the peeling unit 42 and shows that the adsorption unit 54 constituting the peeling unit 42 is detachably provided to the rectangular plate-shaped flexible plate 52 constituting the peeling unit 42 via the double-sided tape 56. .

The peeling unit 42 is configured such that the suction unit 54 is detachably attached to the flexible board 52 via the double-sided tape 56 as described above.

The adsorption unit 54 includes a flexible plate 58 having a thickness smaller than that of the flexible plate 52. The lower surface of the flexible plate 58 is detachably attached to the upper surface of the flexible plate 52 via a double-sided tape 56.

Further, a rectangular gas permeable sheet 60 that adsorbs and holds the inner surface of the reinforcing plate 3B of the laminated body 6 is provided in the adsorption portion 54. In order to reduce the tensile stress generated in the reinforcing plate 3B at the time of peeling, the thickness of the gas permeable sheet 60 is 2 mm or less, preferably 1 mm or less, and 0.5 mm is used in the embodiment.

Further, the adsorption frame 54 is provided with a seal frame member 62 that surrounds the gas permeable sheet 60 and that abuts the outer peripheral surface of the reinforcing plate 3B. The seal frame member 62 and the gas permeable sheet 60 are attached to the upper surface of the flexible plate 58 via the double-sided back sheet 64. Further, the sealing frame member 62 is a sponge of independent bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less, and has a thickness of 0.3 mm to 0.5 mm thick with respect to the thickness of the gas permeable sheet 60.

A frame-shaped groove 66 is provided between the gas permeable sheet 60 and the sealing frame member 62. Further, a plurality of through holes 68 are formed in the flexible plate 52, and one end of the through holes 68 communicates with the groove 66, and the other end is connected to an intake source (for example, a vacuum pump) via a suction line (not shown). .

Therefore, when the air source is driven, the air of the suction pipe, the through hole 68, and the groove 66 is sucked, and the inner surface of the reinforcing plate 3B of the laminated body 6 is vacuum-adsorbed and maintained. Further, the gas sheet 60 is pressed against the outer peripheral surface of the reinforcing plate 3B against the seal frame member 62, so that the airtightness of the adsorption space surrounded by the seal frame member 62 is improved.

The flexural rigidity of the flexible plate 52 is higher than that of the flexible plate 58, the gas permeable sheet 60, and the sealing frame member 62, and the bending rigidity of the flexible plate 52 determines the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40,000 N. Mm ² /mm. For example, in the portion where the stripping unit 42 has a width of 100 mm, the bending rigidity becomes 100000 to 4000000 N. Mm ² . By setting the bending rigidity of the peeling unit 42 to 1000N. The mm ² /mm or more can prevent the bending of the reinforcing plate 3B held by the peeling unit 42 by the suction. Moreover, by setting the bending rigidity of the peeling unit 42 to 40,000 N. Below mm ² /mm, the reinforcing plate 3B held by the peeling unit 42 can be appropriately flexed and deformed.

The flexible sheets 52 and 58 are resin members having a Young's modulus of 10 GPa or less, and are, for example, resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, or polyacetal (POM) resin.

[movable device 46]

On the lower surface of the flexible plate 52, a plurality of disk-shaped movable bodies 44 shown in Fig. 7 are fixed in a lattice shape as shown in Fig. 8. The movable body 44 is fixed to the flexible plate 52 by a fastening member such as a bolt, but may be fixed next to the bolt. The movable bodies 44 are independently moved up and down by the driving device 48 that is driven and controlled by the controller 50.

That is, the controller 50 controls the driving device 48 so that the movable body 44 from the side of the chamfered portion 6A of the laminated body 6 in Fig. 8 is moved to the movable body 44 on the side of the chamfered portion 6C of the peeling traveling direction indicated by the arrow C. Move down in sequence. By this operation, as shown in the longitudinal cross-sectional view of FIG. 10, the interface 24 of the laminated body 6 is peeled off starting from the peeling start portion 26 (see FIG. 4). In addition, the laminated body 6 shown in FIG. 7 and FIG. 10 is formed with the laminated body 6 of the peeling start parts 26 and 30 by the peeling start part formation method demonstrated by FIG.

The drive device 48 includes, for example, a rotary servo motor, a ball screw mechanism, and the like. The rotary motion of the servo motor is converted into a linear motion in the ball screw mechanism and transmitted to the roller The rod 70 of the bead screw mechanism. At the front end of the rod 70, a movable body 44 is provided via the ball joint 72. Thereby, the movable body 44 can be tilted following the deflection deformation of the peeling unit 42 as shown in FIG. Thereby, the peeling unit 42 can be flexibly deformed from the chamfered portion 6A toward the chamfered portion 6C without applying a forcible force to the peeling unit 42. Further, the drive device 48 is not limited to the rotary servo motor and the ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

A plurality of drive units 48 are preferably mounted to the elevating frame 74 via a cushioning member 76. The cushioning member 76 is elastically deformed in such a manner as to follow the flexural deformation of the peeling unit 42. Thereby, the rod 70 is tilted relative to the frame 74.

When the peeled reinforcing plate 3B is detached from the peeling unit 42, the frame 74 is moved downward by a driving unit (not shown).

The controller 50 is configured as a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). . The controller 50 controls the lifting movement of the plurality of movable bodies 44 by controlling the plurality of driving devices 48 for each of the plurality of driving devices 48 by causing the CPU to execute the program recorded in the recording medium.

[Separation method of reinforcing plates 3A, 3B by peeling device 40]

11(A) to (C) to 12(A) to (C) show the laminated body 6 in which the peeling start portions 26 and 30 are formed in the corner portion 6Aa by the peeling start portion forming method described with reference to Fig. 3 . Stripping method. That is, in the figure, the peeling method of the reinforcing sheets 3A and 3B of the peeling laminated body 6 is shown in time series.

Further, the loading operation of the laminated body 6 to the peeling device 40, the peeling of the reinforcing plates 3A and 3B, and the loading operation of the panel P are performed by the conveying device 80 having the adsorption pad 78 shown in Fig. 11(A). In addition, in FIGS. 11 and 12, in order to avoid the trouble of the drawing, the illustration of the movable device 46 is omitted. Moreover, the panel P is a product panel in which the substrate 2A and the substrate 2B are bonded to the functional layer 7 except for the reinforcing plates 3A and 3B.

Fig. 11(A) is a side view of the peeling device 40 of the peeling unit 42 placed on the lower side by the operation indicated by the arrows F and G of the conveying device 80. In this case, the lower peeling unit 42 and the upper peeling unit 42 are previously moved to a position that is relatively sufficiently retracted so that the conveying device 80 is inserted between the lower peeling unit and the upper peeling unit 42. Then, when the laminated body 6 is placed on the lower peeling unit 42, the reinforcing plate 3B of the laminated body 6 is vacuum-sucked by the lower peeling unit 42. That is, in FIG. 11(A), the adsorption step of adsorbing and holding the reinforcing plate 3B by the lower peeling unit 42 is shown.

(B) is a peeling device that moves the peeling unit 42 on the lower side and the peeling unit 42 on the upper side in a relatively close direction, and vacuum-adsorbs and holds the reinforcing plate 3A of the laminated body 6 by the peeling unit 42 on the upper side. 40 side view. That is, in FIG. 11(B), the adsorption step of adsorbing and holding the reinforcing plate 3A by the upper peeling unit 42 is shown.

When the substrate 2 of the laminated body 1 shown in FIG. 1 is peeled off from the reinforcing plate 3 by the peeling device 40, the substrate 2 as the first substrate is supported by the upper peeling unit 42. The peeling unit 42 on the lower side adsorbs and holds the reinforcing plate 3 as the second substrate. In this case, the support portion of the support substrate 2 is not limited to the peeling unit 42, and the substrate 2 may be detachably supported. However, by using the peeling unit 42 as the support portion, the substrate 2 and the reinforcing plate 3 can be simultaneously bent and peeled off, so that there is an advantage that the peeling force can be reduced as compared with the case where only the substrate 2 or the reinforcing plate 3 is bent. .

Returning to Fig. 11, Fig. 11(C) shows that the peeling unit 42 on the lower side is bent downward from the chamfered portion 6A of the laminated body 6 toward the chamfered portion 6C, and is peeled off at the interface 24 of the laminated body 6. The starting portion 26 (see FIG. 4) is a side view showing a state in which the starting portion is peeled off. In other words, among the plurality of movable bodies 44 of the peeling unit 42 on the lower side shown in Fig. 10, the movable body 44 located on the side of the chamfered portion 6A of the laminated body 6 to the movable body 44 on the side of the chamfered portion 6C is sequentially lowered. Moving, the reinforcing plate 3B is peeled off at the interface 24. Further, in the plurality of movable bodies 44 of the upper peeling unit 42, the movable body 44 on the side of the chamfered portion 6A of the laminated body 6 to the movable body 44 on the side of the chamfered portion 6C may be interlocked with the operation. Move up in sequence to interface 24 Peel off. Thereby, the peeling force can be reduced as compared with the form in which only the reinforcing plate 3B is bent.

Fig. 12(A) is a side view of the peeling device 40 in a state where the interface plate 24 is completely peeled off from the reinforcing plate 3B. According to the figure, the peeled reinforcing plate 3B is vacuum-adsorbed and held by the peeling unit 42 on the lower side, and the laminated body 6 (including the laminated body including the reinforcing plate 3A and the panel P) excluding the reinforcing plate 3B is vacuum-sucked and held on the upper side. Stripping unit 42.

Further, the lower peeling unit 42 and the upper peeling unit 42 are moved to a position that is relatively sufficiently retracted so that the conveying device 80 shown in Fig. 11(A) is inserted between the upper and lower peeling units 42.

Thereafter, first, the vacuum adsorption of the peeling unit 42 on the lower side is released. Next, the reinforcing plate 3B is adsorbed and held by the resin layer 4B by the adsorption pad 78 of the transfer device 80. Then, the reinforcing plate 3B is carried out from the peeling device 40 by the operation of the conveying device 80 indicated by arrows H and I in Fig. 12(A).

Fig. 12(B) is a side view of the laminated body 6 excluding the reinforcing plate 3B by vacuum suction and holding by the lower peeling unit 42 and the upper peeling unit 42. That is, the lower peeling unit 42 and the upper peeling unit 42 are moved in the relatively close direction, and the lower peeling unit 42 vacuum-sucks and holds the substrate 2B.

12(C) shows that the peeling unit 42 is bent upward from the chamfered portion 6A of the laminated body 6 toward the chamfered portion 6C, and the peeling start portion 30 is formed at the interface 28 of the laminated body 6 (see the drawing). 4) A side view of the state of peeling off from the starting point. In other words, in the plurality of movable bodies 44 of the peeling unit 42 on the upper side shown in Fig. 10, the movable body 44 located on the side of the chamfered portion 6A of the laminated body 6 is sequentially raised to the movable body 44 located on the side of the chamfered portion 6C. Moving, the reinforcing plate 3A is peeled off at the interface 28. Further, in the plurality of movable bodies 44 of the lower peeling unit 42 in conjunction with the operation, the movable body 44 located on the side of the chamfered portion 6A of the laminated body 6 may be moved to the movable body located on the side of the chamfered portion 6C. 44 descends in sequence and peels off at interface 28. Thereby, the peeling force can be reduced as compared with the form in which only the reinforcing plate 3A is bent.

Thereafter, the reinforcing plate 3A which is completely peeled off from the panel P is taken from the peeling unit 42 on the upper side. The panel P is taken out from the lower peeling unit 42. The above is a peeling method in which the laminated body 6 of the peeling start portions 26 and 30 is formed in the corner portion 6Aa.

[Features of the peeling start portion forming device 10]

Fig. 13 is a plan view showing a state in which a portion Na-1 of the blade edge Na of the blade N contacts the corner portion 6Aa of the chamfered portion 6A of the laminated body 6. Further, the blade N is formed in a flat plate shape, and a linear blade tip Na is provided along the edge portion thereof.

As shown in Fig. 5, the laminated body 6 and the blade N are disposed on a horizontal surface. By moving the blade N in the direction of the arrow A of FIG. 13 on the horizontal plane, one portion Na-1 of the blade tip Na is brought into contact with the corner portion 6Aa, and thereafter, one portion Na-1 of the blade tip Na is pierced into the interface 24 ( Refer to Figure 3 (B)).

Returning to Fig. 5, the blade N reciprocates in the direction of the arrow A and the direction of the arrow B of Fig. 6 by the feed device 18 including the feed screw 82 and the motor 84. The amount of movement in the piercing direction indicated by the arrow A and the amount of movement in the retracting direction indicated by the arrow B are controlled by controlling the control unit (control device) 86 of Fig. 5 of the motor 84.

On the other hand, the stage 12 for adsorbing and holding the laminated body 6 is reciprocated in the horizontal direction along the arrow J direction of FIG. 6 and the arrow K direction by the feed device (moving mechanism portion) 92 including the feed screw 88 and the motor 90. mobile. The directions of the arrows J and K are set to be parallel to the straight edge Na of the blade N as shown in FIG. Further, the amount of movement in the arrows J and K directions of the stage 12 is also controlled by the control unit 86 of the control motor 90.

In other words, according to the peeling start portion forming apparatus 10, the blade N can be changed by moving the blade N in the directions of the arrows A and B by the motor 84 and moving the laminated body 6 in the directions of the arrows J and K by the motor 90. The relative position of the laminated body 6 on the plane (the piercing position changing device). Further, by moving the laminated body 6 in the directions of the arrows J and K, the piercing position of the blade edge Na of the blade N which penetrates the interfaces 24 and 28 of the laminated body 6 can be changed.

That is, the peeling start portion forming device 10 can change the position of the laminated body 6 on the plane with respect to the blade N by the feeding device 92. Further, by controlling the amount of movement of the feed device 92 in the directions of arrows J and K by the control unit 86, the blades of the interfaces 24 and 28 which pierce the laminated body 6 can be obtained. The piercing position of the tool tip Na of N has changed since the last piercing position. In other words, the control unit 86 has a built-in memory unit that stores the position of the tool nose Na that was pierced last time, and changes the position of the tool nose Na based on the previous position.

[The role of the peeling start portion forming device 10]

(A) to (F) are plan views showing an example of a peeling start portion forming method (peeling start portion forming step) by the peeling start portion forming device 10 in time series.

As shown in Fig. 14(A), at the puncture start position of the blade N, one portion Na-1 of the blade edge Na is disposed opposite to the corner portion 6Aa. Thereafter, the blade N moves in the direction of the arrow A as shown in Fig. 14(B). Thereby, one portion Na-1 of the blade tip Na is pierced into the interface 24 of the layered body 6, and the peeling start portion 26 is formed at the interface 24 (see FIG. 3(C)).

Fig. 14 (C) is a plan view showing the blade N moved in the direction of the arrow B to return to the puncture start position. In the explanatory diagram of Fig. 14, in order to explain the features of the present invention in an easy-to-understand manner, a case where the blade tip Na is broken due to the one piercing operation of the blade N will be described.

As shown in Fig. 14(C), in the blade tip Na of the blade N, a portion Na-1 of the interface 24 is pierced, and a chip (not shown) is caught at the time of piercing to cause a defect.

[Features of the shape of the blade N of the blade N]

Fig. 15(A) is a plan view for explaining a shape of a defect of the tip Na.

In the laminated body 6, there is a side portion 6E and a chamfered portion 6A (the other side portion) having the corner portion 6Aa as a vertex angle. Here, when the angle formed by the one side portion 6E and the cutting edge Na is θ1, and the angle formed by the chamfered portion 6A and the cutting edge Na is θ2, the angle is compared with the angle portion 6Aa. On the side of the small θ2, the length of the pierced portion becomes longer than the side of the larger angle θ1. Therefore, in accordance with the length of the piercing length, the blade edge Na on the θ2 side is smaller than the blade tip Na on the θ1 side (a<b: see FIG. 14(C)). Here, a is the length of the defect generated on the θ1 side, and b is the length of the defect generated on the θ2 side. Both a and b are the lengths of the length of the tip Na.

Therefore, the laminated body 6 is moved by a certain amount in the direction of the arrow J as shown in FIG. 14(D), so as to facilitate One of the Na-1 parts of the tip Na which produces the defect is not used for the next puncture. That is, the piercing position of the blade tip Na is changed so that the normal blade tip Na-2 having no angle of the θ1 side having a large angle is used for the next piercing. Thereby, at the time of piercing the interface 28 (next time), Na-2, which is one of the normal blade tips Na, which is free from defects, can be used, so that the peeling start portion 30 can be surely formed.

Further, as shown in FIG. 14(E), the amount c of change of the laminated body 6 in the direction of the arrow J is preferably set to a<c<b. As a result, the amount of shift of the tool nose Na can be made smaller than the position of the tool nose Na on the θ2 side which is smaller toward the angle. Therefore, the total length of the tool nose Na can be utilized more effectively.

The peeling start portion forming method is a method of changing the piercing position of the blade tip Na by controlling the feeding device 92 each time the peeling start portion is formed, but the method is not limited to this method.

For example, if it is assumed that there is no defect in the cutting edge Na due to the one piercing action of the blade N, one portion of the tip Na can be pierced into the interface 28, and the interface with the next laminated body 6 When the piercing of 24, 28 penetrates into the new tip Na-2. That is, the piercing position of the blade tip Na is changed by using the new blade tip Na every time the piercing operation is performed plural times (for example, two or more times).

Further, as shown in FIG. 5, a detecting device (detecting device) 94 for detecting a defect of the cutting edge Na of the blade N is provided. When the detecting device 94 detects the defect of the cutting edge Na, the control portion 86 controls the control. The layered body 6 may be moved by a specific offset amount in the direction of the arrow J of Fig. 14 to the device 92.

In the method of changing the piercing position, the normal blade tip Na having no defect is used at the time of the next piercing, so that the next peeling start portion can be surely formed in the laminated body 6. Further, when the defect of Na-1, which is one of the tips Na, is detected, the next penetration of the Na-2 adjacent to a part of Na-1 is used for the next piercing, so that the service life of the blade N can be further extended. Further, as the detecting device 94, an image pickup device that captures a defect, an optical device that has a light projecting portion and a light receiving portion that are provided via a blade edge, and the like can be used to detect a defect.

Further, when the puncturing position is changed as described above, the puncturing position of the cutting edge Na is changed toward the θ1 side where the angle is large, so that the offset amount of the cutting edge Na can be changed from the θ2 side toward the smaller angle. The position of the tip Na is less. Therefore, the full length of the tip Na can be further effectively utilized.

Fig. 15 (B) is an explanatory view showing a specific example of a method of changing the piercing position.

It is necessary to cope with the case where the chamfered portion 6A of Fig. 15(A) and the chamfered portion 6F shown in Fig. 15(B) have different shapes by the same blade N.

Θ3 shown in Fig. 15(B) is an angle formed by the corner portion 6Fa as one of the vertex angles 6G and the cutting edge Na, and θ4 is the other side portion having the corner portion 6Fa as the vertex angle, that is, the chamfered portion 6F and The angle formed by the tip Na. In general, in the form of Fig. 15(B), since θ3 < θ4, the offset (moving) direction of the laminated body 6 is the direction of the arrow K, and the direction of the arrow J of Fig. 15(A) is the opposite direction.

However, when θ2 shown in FIG. 15(A) and θ3 shown in FIG. 15(B) are compared, θ2<θ3 is obtained, and the defect range of the form of FIG. 15(B) is small. Therefore, in this case, The form of Fig. 15(A) is preferred, and the offset direction may be set to the direction of the arrow J.

The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various changes or modifications may be made without departing from the spirit and scope of the invention.

The present application is based on Japanese Patent Application No. 2014-143018, filed on Jan.

1‧‧ ‧ laminated body

2‧‧‧Substrate

2a‧‧‧front of the substrate

2b‧‧‧Back of the substrate

3‧‧‧ reinforcing plate

3a‧‧‧ Strengthening the front of the board

4‧‧‧ resin layer

Claims (12)

A peeling device for a laminated body in which a rectangular laminated body obtained by peeling a first substrate and a second substrate is peeled off at an interface between the first substrate and the second substrate; The present invention includes a peeling blade which is formed in a flat plate shape and has a blade edge along the edge portion, and is formed at the interface by piercing the blade edge from the corner portion of the laminated body to the interface by a specific amount. a peeling start portion; the peeling device is peeled off at the interface from the peeling start portion; the piercing position changing device changes a position of the peeling blade and the laminated body on a plane; and a control device The piercing position changing device is controlled such that the piercing position of the blade edge of the peeling blade that penetrates the interface is changed. The peeling device of the laminated body according to claim 1, wherein the control device controls the piercing in such a manner that the piercing position of the cutting edge is changed from the previous piercing position each time at least one peeling start portion is formed. Location change device. A peeling device for a laminate according to claim 1, comprising: a detecting device for detecting a defect of a blade edge of the peeling blade, wherein the control device is configured to detect a defect of a blade edge by the detecting device The piercing position changing device controls the above-described piercing position changing device in such a manner that the last piercing position is changed. The peeling device of the laminated body according to claim 1, 2 or 3, wherein the control device is to be a side portion and a other side portion at a corner portion of the laminated body which is pierced into the blade edge of the peeling blade Controlling the thorn by changing the angle formed by the one side portion to the cutting edge and the angle of the larger angle on the angle formed by the other side portion and the cutting edge to the next piercing position Into the location change device. A method for peeling a laminated body, wherein a rectangular laminated body obtained by peeling off a first substrate and a second substrate is peeled off at an interface between the first substrate and the second substrate; A peeling start portion forming step of piercing a blade edge provided along an edge portion of a flat-shaped peeling blade from a corner portion of the laminated body to the interface by a specific amount to form a peeling start portion at the interface; and peeling off The step of peeling off at the interface from the peeling start portion; and the step of forming the peeling start portion includes a step of changing the piercing position of the cutting edge of the blade of the peeling blade that penetrates the interface. The method of peeling a laminated body according to claim 5, wherein the step of changing the piercing position is performed by changing at least one of the peeling start portions to change the piercing position of the cutting edge from the previous piercing position. . The peeling method of the laminated body according to claim 5, wherein the step of changing the piercing position is to change the piercing position of the cutting edge from the last piercing position when detecting the defect of the blade edge of the peeling blade Way to proceed. The peeling method of the laminated body according to claim 5, 6 or 7, wherein the piercing position is changed at a side portion and the other side portion which are corner portions of the laminated body which is pierced into the blade edge of the peeling blade The step of changing the angle formed by the angle between the one side portion and the cutting edge and the angle formed by the angle between the other side portion and the cutting edge to the next piercing position get on. A method of manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on a surface of an exposed surface of the first substrate in a rectangular laminated body in which a first substrate and a second substrate are detachably attached And a separating step of separating the second substrate from the first substrate on which the functional layer is formed; and the method of manufacturing the electronic device is characterized by: The separation step includes a peeling start portion forming step of piercing a blade edge provided along an edge portion of the flat blade to a specific amount from a corner portion of the laminate to an interface between the first substrate and the second substrate a peeling start portion is formed at the interface; and a peeling step is performed at the interface from the peeling start portion; and the peeling start portion forming step includes changing a tip of the peeling blade that penetrates the interface The step of changing the piercing position of the piercing position. The method of manufacturing an electronic device according to claim 9, wherein the step of changing the piercing position is performed by changing at least one of the peeling start portions and changing a piercing position of the blade edge from a previous piercing position. . The manufacturing method of the electronic device of claim 9, wherein the step of changing the piercing position is to change the piercing position of the blade tip from the last piercing position when detecting the defect of the blade edge of the peeling blade Way to proceed. The method of manufacturing an electronic device according to claim 9, 10 or 11, wherein the piercing position is changed at a side portion and a other side portion at which a corner portion of the laminated body which is inserted into the blade edge of the peeling blade is a vertex angle The step of changing the angle formed by the angle between the one side portion and the cutting edge and the angle formed by the angle between the other side portion and the cutting edge to the next piercing position get on.