TWI659848B - 積層體之剝離裝置及剝離方法、與電子裝置之製造方法 - Google Patents

積層體之剝離裝置及剝離方法、與電子裝置之製造方法 Download PDF

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Publication number
TWI659848B
TWI659848B TW104122384A TW104122384A TWI659848B TW I659848 B TWI659848 B TW I659848B TW 104122384 A TW104122384 A TW 104122384A TW 104122384 A TW104122384 A TW 104122384A TW I659848 B TWI659848 B TW I659848B
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TW
Taiwan
Prior art keywords
peeling
substrate
laminated body
interface
blade
Prior art date
Application number
TW104122384A
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English (en)
Chinese (zh)
Other versions
TW201607763A (zh
Inventor
伊藤泰則
宇津木洋
滝內圭
Original Assignee
日商Ａｇｃ股份有限公司
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Publication of TW201607763A publication Critical patent/TW201607763A/zh
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Publication of TWI659848B publication Critical patent/TWI659848B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
TW104122384A 2014-07-11 2015-07-09 積層體之剝離裝置及剝離方法、與電子裝置之製造方法 TWI659848B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-143019 2014-07-11
JP2014143019A JP6269954B2 (ja) 2014-07-11 2014-07-11 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
TW201607763A TW201607763A (zh) 2016-03-01
TWI659848B true TWI659848B (zh) 2019-05-21

Family

ID=55101203

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122384A TWI659848B (zh) 2014-07-11 2015-07-09 積層體之剝離裝置及剝離方法、與電子裝置之製造方法

Country Status (4)

Country Link
JP (1) JP6269954B2 (ko)
KR (1) KR102471564B1 (ko)
CN (1) CN105261578B (ko)
TW (1) TWI659848B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110065291A (zh) * 2019-04-25 2019-07-30 业成科技（成都）有限公司 胶贴合件分离装置以及胶贴合件分离方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102171745A (zh) * 2009-02-06 2011-08-31 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置
TW201321191A (zh) * 2011-11-18 2013-06-01 Au Optronics Corp 脫黏器及自基板分離薄膜的方法
TW201334090A (zh) * 2012-01-19 2013-08-16 Asahi Glass Co Ltd 剝離裝置及電子元件之製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100543024B1 (ko) * 1998-01-21 2006-05-25 삼성전자주식회사 액정표시장치의 편광판 제거장치
JP4241697B2 (ja) * 2005-09-06 2009-03-18 ユーテック株式会社 フィルム剥離装置
WO2011024689A1 (ja) 2009-08-31 2011-03-03 旭硝子株式会社 剥離装置
JP5534222B2 (ja) 2010-03-08 2014-06-25 旭硝子株式会社 ガラス基板
JP2014031301A (ja) * 2012-08-06 2014-02-20 Asahi Glass Co Ltd ガラス積層体用支持基板の管理方法及び管理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102171745A (zh) * 2009-02-06 2011-08-31 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置
TW201321191A (zh) * 2011-11-18 2013-06-01 Au Optronics Corp 脫黏器及自基板分離薄膜的方法
TW201334090A (zh) * 2012-01-19 2013-08-16 Asahi Glass Co Ltd 剝離裝置及電子元件之製造方法

Also Published As

Publication number Publication date
CN105261578B (zh) 2019-04-23
JP6269954B2 (ja) 2018-01-31
TW201607763A (zh) 2016-03-01
JP2016016984A (ja) 2016-02-01
KR20160007399A (ko) 2016-01-20
CN105261578A (zh) 2016-01-20
KR102471564B1 (ko) 2022-11-29

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