TWI655998B - 拋光墊、包含其之拋光系統及使用拋光墊拋光基材之方法 - Google Patents
拋光墊、包含其之拋光系統及使用拋光墊拋光基材之方法 Download PDFInfo
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- TWI655998B TWI655998B TW104111030A TW104111030A TWI655998B TW I655998 B TWI655998 B TW I655998B TW 104111030 A TW104111030 A TW 104111030A TW 104111030 A TW104111030 A TW 104111030A TW I655998 B TWI655998 B TW I655998B
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- polishing
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- pad
- precisely
- working surface
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461974848P | 2014-04-03 | 2014-04-03 | |
| US61/974,848 | 2014-04-03 | ||
| US201462052729P | 2014-09-19 | 2014-09-19 | |
| US62/052,729 | 2014-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201542316A TW201542316A (zh) | 2015-11-16 |
| TWI655998B true TWI655998B (zh) | 2019-04-11 |
Family
ID=52823890
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104111030A TWI655998B (zh) | 2014-04-03 | 2015-04-02 | 拋光墊、包含其之拋光系統及使用拋光墊拋光基材之方法 |
| TW104111031A TWI652142B (zh) | 2014-04-03 | 2015-04-02 | 拋光墊與系統及其製造與使用方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104111031A TWI652142B (zh) | 2014-04-03 | 2015-04-02 | 拋光墊與系統及其製造與使用方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10071461B2 (enExample) |
| EP (2) | EP3126092B1 (enExample) |
| JP (2) | JP6656162B2 (enExample) |
| KR (2) | KR102347711B1 (enExample) |
| CN (2) | CN106163740B (enExample) |
| SG (2) | SG11201608134YA (enExample) |
| TW (2) | TWI655998B (enExample) |
| WO (2) | WO2015153601A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843945B (zh) * | 2020-06-19 | 2024-06-01 | 美商應用材料股份有限公司 | 先進研磨墊以及相關的研磨墊製造方法 |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104349893B (zh) * | 2012-06-01 | 2017-07-18 | 科思创德国股份有限公司 | 作为反射器的多层结构 |
| KR102252673B1 (ko) * | 2013-09-25 | 2021-05-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 다층화된 폴리싱 패드 |
| KR102347711B1 (ko) | 2014-04-03 | 2022-01-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 |
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| TWI843945B (zh) * | 2020-06-19 | 2024-06-01 | 美商應用材料股份有限公司 | 先進研磨墊以及相關的研磨墊製造方法 |
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| EP3126092B1 (en) | 2022-08-17 |
| WO2015153601A1 (en) | 2015-10-08 |
| TW201542316A (zh) | 2015-11-16 |
| CN106163740B (zh) | 2019-07-09 |
| SG11201608134YA (en) | 2016-10-28 |
| CN106132630B (zh) | 2019-11-26 |
| JP2017513722A (ja) | 2017-06-01 |
| US10252396B2 (en) | 2019-04-09 |
| CN106163740A (zh) | 2016-11-23 |
| US10071461B2 (en) | 2018-09-11 |
| EP3126093B1 (en) | 2022-08-17 |
| EP3126093A1 (en) | 2017-02-08 |
| KR102350350B1 (ko) | 2022-01-14 |
| KR20160140874A (ko) | 2016-12-07 |
| JP2017510470A (ja) | 2017-04-13 |
| TWI652142B (zh) | 2019-03-01 |
| CN106132630A (zh) | 2016-11-16 |
| WO2015153597A1 (en) | 2015-10-08 |
| KR20160142346A (ko) | 2016-12-12 |
| US20170173758A1 (en) | 2017-06-22 |
| JP6656162B2 (ja) | 2020-03-04 |
| KR102347711B1 (ko) | 2022-01-06 |
| SG11201608219WA (en) | 2016-10-28 |
| JP6640106B2 (ja) | 2020-02-05 |
| US20170182629A1 (en) | 2017-06-29 |
| TW201542318A (zh) | 2015-11-16 |
| EP3126092A1 (en) | 2017-02-08 |
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