JP6656162B2 - 研磨パッド及びシステム、並びにその作製方法及び使用方法 - Google Patents

研磨パッド及びシステム、並びにその作製方法及び使用方法 Download PDF

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Publication number
JP6656162B2
JP6656162B2 JP2016560455A JP2016560455A JP6656162B2 JP 6656162 B2 JP6656162 B2 JP 6656162B2 JP 2016560455 A JP2016560455 A JP 2016560455A JP 2016560455 A JP2016560455 A JP 2016560455A JP 6656162 B2 JP6656162 B2 JP 6656162B2
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Prior art keywords
polishing
layer
less
precisely shaped
micrometers
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Japanese (ja)
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JP2017510470A5 (enExample
JP2017510470A (ja
Inventor
デュイ ケー． レフー，
デュイ ケー． レフー，
ケネス エー．ピー． マイヤー，
ケネス エー．ピー． マイヤー，
モーゼス エム． デイヴィッド，
モーゼス エム． デイヴィッド，
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016560455A 2014-04-03 2015-03-31 研磨パッド及びシステム、並びにその作製方法及び使用方法 Active JP6656162B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461974848P 2014-04-03 2014-04-03
US61/974,848 2014-04-03
US201462052729P 2014-09-19 2014-09-19
US62/052,729 2014-09-19
PCT/US2015/023576 WO2015153601A1 (en) 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same

Publications (3)

Publication Number Publication Date
JP2017510470A JP2017510470A (ja) 2017-04-13
JP2017510470A5 JP2017510470A5 (enExample) 2019-07-04
JP6656162B2 true JP6656162B2 (ja) 2020-03-04

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JP2016560455A Active JP6656162B2 (ja) 2014-04-03 2015-03-31 研磨パッド及びシステム、並びにその作製方法及び使用方法
JP2016560383A Active JP6640106B2 (ja) 2014-04-03 2015-03-31 研磨パッド及びシステム、並びにその作製方法及び使用方法

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US (2) US10071461B2 (enExample)
EP (2) EP3126092B1 (enExample)
JP (2) JP6656162B2 (enExample)
KR (2) KR102347711B1 (enExample)
CN (2) CN106163740B (enExample)
SG (2) SG11201608134YA (enExample)
TW (2) TWI655998B (enExample)
WO (2) WO2015153601A1 (enExample)

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SG11201608134YA (en) 2016-10-28
CN106132630B (zh) 2019-11-26
JP2017513722A (ja) 2017-06-01
US10252396B2 (en) 2019-04-09
TWI655998B (zh) 2019-04-11
CN106163740A (zh) 2016-11-23
US10071461B2 (en) 2018-09-11
EP3126093B1 (en) 2022-08-17
EP3126093A1 (en) 2017-02-08
KR102350350B1 (ko) 2022-01-14
KR20160140874A (ko) 2016-12-07
JP2017510470A (ja) 2017-04-13
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CN106132630A (zh) 2016-11-16
WO2015153597A1 (en) 2015-10-08
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US20170173758A1 (en) 2017-06-22
KR102347711B1 (ko) 2022-01-06
SG11201608219WA (en) 2016-10-28
JP6640106B2 (ja) 2020-02-05
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TW201542318A (zh) 2015-11-16
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