BR112016001710A2 - método para fabricação de uma nanoestrutura e artigos nanoestruturados - Google Patents

método para fabricação de uma nanoestrutura e artigos nanoestruturados

Info

Publication number
BR112016001710A2
BR112016001710A2 BR112016001710A BR112016001710A BR112016001710A2 BR 112016001710 A2 BR112016001710 A2 BR 112016001710A2 BR 112016001710 A BR112016001710 A BR 112016001710A BR 112016001710 A BR112016001710 A BR 112016001710A BR 112016001710 A2 BR112016001710 A2 BR 112016001710A2
Authority
BR
Brazil
Prior art keywords
plasma
substrate
nanostructure
layer
compounds
Prior art date
Application number
BR112016001710A
Other languages
English (en)
Inventor
Franke Carsten
s bates Daniel
Seth Jayshree
s berger Michael
M David Moses
F Zehentmaier Sebastian
Yu Ta-Hua
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR112016001710A2 publication Critical patent/BR112016001710A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S70/00—Details of absorbing elements
    • F24S70/60—Details of absorbing elements characterised by the structure or construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3341—Reactive etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

resumo “método para fabricação de uma nanoestrutura e artigos nanoestruturados” trata-se de um método para fabricação de uma nanoestrutura e artigos na-noestruturados através da deposição de uma camada em uma superfície principal de um substrato por deposição química por vapor assistida por plasma a partir de uma mistura gasosa enquanto a superfície é substancial e simultaneamente grava-da com uma espécie reativa. o método inclui fornecer um substrato, misturar uma primeira espécie gasosa capaz de depositar uma camada sobre o substrato quando transformada em um plasma com uma segunda espécie gasosa capaz de gravar o substrato quando transformada em um plasma, formando, portanto, uma mistura gasosa; transformar a mistura gasosa em um plasma e expor uma superfície do substrato ao plasma, sendo que a superfície é gravada e uma camada é depositada sobre ao menos uma porção da superfície gravada formando substancial e simulta-neamente, dessa forma, a nanoestrutura. o substrato pode ser um material (co)polimérico, um material inorgânico, uma liga, uma solução sólida ou uma com-binação dos mesmos. a camada depositada pode incluir o produto da reação da de-posição química por vapor assistida por plasma com uso de um gás reagente que compreende um composto selecionado do grupo que consiste em compostos de organossilício, compostos metálicos de alquila, compostos de isopropóxido metálico, compostos de acetilacetonato metálico, compostos de haleto metálico e combina-ções dos mesmos. nanoestruturas de alta razão de aspecto e opcionalmente com dimensões aleatórias em ao menos uma dimensão e, de preferência, em três di-mensões ortogonais podem ser preparadas.
BR112016001710A 2013-07-26 2014-07-23 método para fabricação de uma nanoestrutura e artigos nanoestruturados BR112016001710A2 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361858670P 2013-07-26 2013-07-26
US201361867733P 2013-08-20 2013-08-20
US201462018761P 2014-06-30 2014-06-30
PCT/US2014/047782 WO2015013387A1 (en) 2013-07-26 2014-07-23 Method of making a nanostructure and nanostructured articles

Publications (1)

Publication Number Publication Date
BR112016001710A2 true BR112016001710A2 (pt) 2017-08-01

Family

ID=52393807

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016001710A BR112016001710A2 (pt) 2013-07-26 2014-07-23 método para fabricação de uma nanoestrutura e artigos nanoestruturados

Country Status (8)

Country Link
US (1) US10119190B2 (pt)
EP (1) EP3024777B1 (pt)
JP (1) JP6505693B2 (pt)
KR (2) KR20160037961A (pt)
CN (1) CN105431376B (pt)
BR (1) BR112016001710A2 (pt)
SG (2) SG11201600606TA (pt)
WO (1) WO2015013387A1 (pt)

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EP3313458A1 (en) 2015-06-29 2018-05-02 3M Innovative Properties Company Anti-microbial articles and methods of using same
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EP3373984B1 (en) 2015-11-13 2020-12-23 3M Innovative Properties Company Anti-microbial articles and methods of using same
WO2017083482A1 (en) 2015-11-13 2017-05-18 3M Innovative Properties Company Anti-microbial articles and methods of using same
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Also Published As

Publication number Publication date
WO2015013387A1 (en) 2015-01-29
EP3024777A1 (en) 2016-06-01
SG10201704677QA (en) 2017-07-28
KR20160037961A (ko) 2016-04-06
KR20210151999A (ko) 2021-12-14
US20170067150A1 (en) 2017-03-09
CN105431376B (zh) 2018-08-31
SG11201600606TA (en) 2016-02-26
JP2016532576A (ja) 2016-10-20
CN105431376A (zh) 2016-03-23
JP6505693B2 (ja) 2019-04-24
EP3024777B1 (en) 2024-05-15
EP3024777A4 (en) 2017-01-11
US10119190B2 (en) 2018-11-06

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2472 DE 22-05-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.