TWI655314B - 用於氣體分離之設備與方法 - Google Patents

用於氣體分離之設備與方法 Download PDF

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Publication number
TWI655314B
TWI655314B TW103103027A TW103103027A TWI655314B TW I655314 B TWI655314 B TW I655314B TW 103103027 A TW103103027 A TW 103103027A TW 103103027 A TW103103027 A TW 103103027A TW I655314 B TWI655314 B TW I655314B
Authority
TW
Taiwan
Prior art keywords
gas
gas separation
substrate
separation unit
deposition
Prior art date
Application number
TW103103027A
Other languages
English (en)
Chinese (zh)
Other versions
TW201445005A (zh
Inventor
Hans Georg Lotz
韓斯喬治 羅斯
Neil Morrison
奈爾 蒙利遜
Jose Manuel Dieguez-Campo
喬斯曼紐 地古坎柏
Heike Landgraf
海格 藍德葛瑞夫
Tobias Stolley
透比斯 史投利
Stefan Hein
史德分 海恩
Florian Ries
佛羅里安 瑞絲
Wolfgang Buschbeck
渥福剛 布許貝克
Original Assignee
Applied Materials, Inc.
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc., 美商應用材料股份有限公司 filed Critical Applied Materials, Inc.
Publication of TW201445005A publication Critical patent/TW201445005A/zh
Application granted granted Critical
Publication of TWI655314B publication Critical patent/TWI655314B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45519—Inert gas curtains
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
TW103103027A 2013-01-31 2014-01-28 用於氣體分離之設備與方法 TWI655314B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??13153501.5 2013-01-31
EP13153501.5A EP2762608B1 (en) 2013-01-31 2013-01-31 Gas separation by adjustable separation wall

Publications (2)

Publication Number Publication Date
TW201445005A TW201445005A (zh) 2014-12-01
TWI655314B true TWI655314B (zh) 2019-04-01

Family

ID=47747377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103103027A TWI655314B (zh) 2013-01-31 2014-01-28 用於氣體分離之設備與方法

Country Status (7)

Country Link
US (2) US20140208565A1 (enExample)
EP (1) EP2762608B1 (enExample)
JP (2) JP7068766B2 (enExample)
KR (1) KR102228608B1 (enExample)
CN (1) CN104968831B (enExample)
TW (1) TWI655314B (enExample)
WO (1) WO2014118063A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013108751A1 (ja) * 2012-01-16 2013-07-25 株式会社アルバック 成膜装置
EP2762609B1 (en) * 2013-01-31 2019-04-17 Applied Materials, Inc. Apparatus and method for depositing at least two layers on a substrate
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP2784176B1 (en) 2013-03-28 2018-10-03 Applied Materials, Inc. Deposition platform for flexible substrates
KR102062441B1 (ko) * 2015-02-13 2020-01-03 뷔흘러 알제나우 게엠베하 인라인 코팅 시스템을 작동하는 방법 및 인라인 코팅 시스템
FR3035122B1 (fr) * 2015-04-20 2017-04-28 Coating Plasma Ind Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede
CN107949655B (zh) * 2015-09-02 2020-12-29 Beneq有限公司 用于处理基材表面的设备和操作该设备的方法
EP3414359A2 (en) * 2016-02-12 2018-12-19 Applied Materials, Inc. Vacuum processing system and methods therefor
WO2017140384A1 (en) * 2016-02-19 2017-08-24 Applied Materials, Inc. Method of examining a gas separation quality of a gas separation passage in a vacuum chamber, and vacuum processing apparatus
BR112019008332B1 (pt) * 2016-10-27 2023-10-10 Coating Plasma Innovation Instalação de tratamento de superfície de um substrato móvel em uma atmosfera controlada e método para definição da dimensão da mesma
FR3058161B1 (fr) * 2016-10-27 2018-11-16 Coating Plasma Innovation Installation de traitement de surface d'un substrat en mouvement sous atmosphere controlee, et son procede de dimensionnement
WO2019105534A1 (en) * 2017-11-28 2019-06-06 Applied Materials, Inc. Deposition apparatus, method of coating a flexible substrate and flexible substrate having a coating
TWI839613B (zh) 2020-06-04 2024-04-21 美商應用材料股份有限公司 用於蒸發源的溫度控制屏蔽、用於在基板上沉積材料的材料沉積設備及方法
KR102896631B1 (ko) * 2020-06-04 2025-12-04 엘리베이티드 머티어리얼스 저머니 게엠베하 진공 챔버에서 기판을 코팅하기 위한 기상 증착 장치 및 방법
US20220033958A1 (en) * 2020-07-31 2022-02-03 Applied Materials, Inc. Evaporation source, vapor deposition apparatus, and method for coating a substrate in a vacuum chamber
US11552283B2 (en) 2020-08-04 2023-01-10 Applied Materials, Inc. Method of coating a flexible substrate in a R2R deposition system, and vapor deposition system
JP2023538038A (ja) * 2020-08-21 2023-09-06 アプライド マテリアルズ インコーポレイテッド フレキシブル基板を処理するための処理システム並びにフレキシブル基板の特性及びフレキシブル基板上の１つ又は複数のコーティングの特性のうちの少なくとも１つを測定する方法
JP2024542372A (ja) * 2021-10-26 2024-11-15 アプライド マテリアルズ インコーポレイテッド 薄膜基板を搬送するための真空処理システム、装置および方法
CN114192602B (zh) * 2021-12-14 2022-09-13 大连理工大学 一种高性能多元NiAl基合金管件迭覆级进成形方法

Citations (5)

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US4692233A (en) * 1983-04-06 1987-09-08 General Engineering Radcliffe Limited Vacuum coating apparatus
US4693803A (en) * 1984-03-28 1987-09-15 General Engineering Radcliffe Limited Vacuum coating apparatus
US20110033638A1 (en) * 2009-08-10 2011-02-10 Applied Materials, Inc. Method and apparatus for deposition on large area substrates having reduced gas usage
US20110209830A1 (en) * 2008-11-05 2011-09-01 Ulvac, Inc. Take-Up Vacuum Processing Apparatus
US20110287193A1 (en) * 2008-10-23 2011-11-24 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Apparatus and method for treating an object

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JP2932602B2 (ja) * 1990-04-27 1999-08-09 松下電器産業株式会社 薄膜製造装置
DE4039930A1 (de) * 1990-12-14 1992-06-17 Leybold Ag Vorrichtung fuer plasmabehandlung
JP2001023907A (ja) * 1999-07-07 2001-01-26 Mitsubishi Heavy Ind Ltd 成膜装置
JP4279218B2 (ja) * 2004-07-20 2009-06-17 三菱重工業株式会社 給電装置およびこれを備えたプラズマ処理装置並びにプラズマ処理方法
JP2006344758A (ja) * 2005-06-08 2006-12-21 Sharp Corp 気相成長装置およびそれを用いた半導体装置の製造方法
JP2008031521A (ja) * 2006-07-28 2008-02-14 Sony Corp ロールツーロール型のプラズマ真空処理装置
CN103597119B (zh) * 2009-07-08 2017-03-08 艾克斯特朗欧洲公司 用于等离子体处理的装置和方法
JP5665290B2 (ja) * 2009-08-24 2015-02-04 富士フイルム株式会社 成膜装置
JP5542488B2 (ja) * 2010-03-18 2014-07-09 富士フイルム株式会社 成膜装置
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP2762609B1 (en) * 2013-01-31 2019-04-17 Applied Materials, Inc. Apparatus and method for depositing at least two layers on a substrate
EP2784176B1 (en) * 2013-03-28 2018-10-03 Applied Materials, Inc. Deposition platform for flexible substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692233A (en) * 1983-04-06 1987-09-08 General Engineering Radcliffe Limited Vacuum coating apparatus
US4693803A (en) * 1984-03-28 1987-09-15 General Engineering Radcliffe Limited Vacuum coating apparatus
US20110287193A1 (en) * 2008-10-23 2011-11-24 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Apparatus and method for treating an object
US20110209830A1 (en) * 2008-11-05 2011-09-01 Ulvac, Inc. Take-Up Vacuum Processing Apparatus
US20110033638A1 (en) * 2009-08-10 2011-02-10 Applied Materials, Inc. Method and apparatus for deposition on large area substrates having reduced gas usage

Also Published As

Publication number Publication date
JP2016514197A (ja) 2016-05-19
TW201445005A (zh) 2014-12-01
JP2020125544A (ja) 2020-08-20
JP7068766B2 (ja) 2022-05-17
CN104968831B (zh) 2019-08-02
WO2014118063A1 (en) 2014-08-07
KR102228608B1 (ko) 2021-03-15
US20140208565A1 (en) 2014-07-31
EP2762608A1 (en) 2014-08-06
CN104968831A (zh) 2015-10-07
US20190112706A1 (en) 2019-04-18
KR20150114528A (ko) 2015-10-12
EP2762608B1 (en) 2019-10-02

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