CN104968831B - 通过可调整的分离墙进行的气体分离 - Google Patents
通过可调整的分离墙进行的气体分离 Download PDFInfo
- Publication number
- CN104968831B CN104968831B CN201480006989.5A CN201480006989A CN104968831B CN 104968831 B CN104968831 B CN 104968831B CN 201480006989 A CN201480006989 A CN 201480006989A CN 104968831 B CN104968831 B CN 104968831B
- Authority
- CN
- China
- Prior art keywords
- gas
- gas separation
- substrate
- separation unit
- coating drum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13153501.5A EP2762608B1 (en) | 2013-01-31 | 2013-01-31 | Gas separation by adjustable separation wall |
| EP13153501.5 | 2013-01-31 | ||
| PCT/EP2014/051261 WO2014118063A1 (en) | 2013-01-31 | 2014-01-22 | Gas separation by adjustable separation wall |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104968831A CN104968831A (zh) | 2015-10-07 |
| CN104968831B true CN104968831B (zh) | 2019-08-02 |
Family
ID=47747377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480006989.5A Active CN104968831B (zh) | 2013-01-31 | 2014-01-22 | 通过可调整的分离墙进行的气体分离 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20140208565A1 (enExample) |
| EP (1) | EP2762608B1 (enExample) |
| JP (2) | JP7068766B2 (enExample) |
| KR (1) | KR102228608B1 (enExample) |
| CN (1) | CN104968831B (enExample) |
| TW (1) | TWI655314B (enExample) |
| WO (1) | WO2014118063A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104040023B (zh) * | 2012-01-16 | 2016-04-13 | 株式会社爱发科 | 成膜装置 |
| EP2762609B1 (en) * | 2013-01-31 | 2019-04-17 | Applied Materials, Inc. | Apparatus and method for depositing at least two layers on a substrate |
| EP2762607B1 (en) * | 2013-01-31 | 2018-07-25 | Applied Materials, Inc. | Deposition source with adjustable electrode |
| EP2784176B1 (en) * | 2013-03-28 | 2018-10-03 | Applied Materials, Inc. | Deposition platform for flexible substrates |
| CN107429397B (zh) * | 2015-02-13 | 2022-02-15 | 布勒阿尔策瑙股份有限公司 | 用于运行在线涂覆设备的方法和在线涂覆设备 |
| FR3035122B1 (fr) * | 2015-04-20 | 2017-04-28 | Coating Plasma Ind | Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede |
| CN107949655B (zh) * | 2015-09-02 | 2020-12-29 | Beneq有限公司 | 用于处理基材表面的设备和操作该设备的方法 |
| CN108603291B (zh) * | 2016-02-12 | 2023-11-14 | 应用材料公司 | 真空处理系统和其方法 |
| JP6800236B2 (ja) * | 2016-02-19 | 2020-12-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空チャンバ内のガス分離通路のガス分離品質を検査する方法、および真空処理装置 |
| CN109923240B (zh) * | 2016-10-27 | 2021-10-01 | 涂层等离子创新公司 | 在受控气氛中处理移动基材的表面的设备及其尺寸的限定方法 |
| FR3058161B1 (fr) * | 2016-10-27 | 2018-11-16 | Coating Plasma Innovation | Installation de traitement de surface d'un substrat en mouvement sous atmosphere controlee, et son procede de dimensionnement |
| US20200318233A1 (en) * | 2017-11-28 | 2020-10-08 | Edgar Haberkorn | Deposition apparatus, method of coating a flexible substrate and flexible substrate having a coating |
| US11732345B2 (en) * | 2020-06-04 | 2023-08-22 | Applied Materials, Inc. | Vapor deposition apparatus and method for coating a substrate in a vacuum chamber |
| TWI839613B (zh) | 2020-06-04 | 2024-04-21 | 美商應用材料股份有限公司 | 用於蒸發源的溫度控制屏蔽、用於在基板上沉積材料的材料沉積設備及方法 |
| US20220033958A1 (en) * | 2020-07-31 | 2022-02-03 | Applied Materials, Inc. | Evaporation source, vapor deposition apparatus, and method for coating a substrate in a vacuum chamber |
| US11552283B2 (en) | 2020-08-04 | 2023-01-10 | Applied Materials, Inc. | Method of coating a flexible substrate in a R2R deposition system, and vapor deposition system |
| US20230137506A1 (en) * | 2020-08-21 | 2023-05-04 | Applied Materials, Inc. | Processing system for processing a flexible substrate and method of measuring at least one of a property of a flexible substrate and a property of one or more coatings on the flexible substrate |
| CN114192602B (zh) * | 2021-12-14 | 2022-09-13 | 大连理工大学 | 一种高性能多元NiAl基合金管件迭覆级进成形方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5399254A (en) * | 1990-12-14 | 1995-03-21 | Leybold Ag | Apparatus for plasma treatment |
| CN102197159A (zh) * | 2008-11-05 | 2011-09-21 | 株式会社爱发科 | 卷绕式真空处理装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8309324D0 (en) * | 1983-04-06 | 1983-05-11 | Gen Eng Radcliffe | Vacuum coating apparatus |
| EP0122092A3 (en) * | 1983-04-06 | 1985-07-10 | General Engineering Radcliffe Limited | Vacuum coating apparatus |
| GB8408023D0 (en) * | 1984-03-28 | 1984-05-10 | Gen Eng Radcliffe Ltd | Vacuum coating apparatus |
| JP2932602B2 (ja) * | 1990-04-27 | 1999-08-09 | 松下電器産業株式会社 | 薄膜製造装置 |
| JP2001023907A (ja) | 1999-07-07 | 2001-01-26 | Mitsubishi Heavy Ind Ltd | 成膜装置 |
| JP4279218B2 (ja) | 2004-07-20 | 2009-06-17 | 三菱重工業株式会社 | 給電装置およびこれを備えたプラズマ処理装置並びにプラズマ処理方法 |
| JP2006344758A (ja) * | 2005-06-08 | 2006-12-21 | Sharp Corp | 気相成長装置およびそれを用いた半導体装置の製造方法 |
| JP2008031521A (ja) | 2006-07-28 | 2008-02-14 | Sony Corp | ロールツーロール型のプラズマ真空処理装置 |
| EP2180768A1 (en) * | 2008-10-23 | 2010-04-28 | TNO Nederlandse Organisatie voor Toegepast Wetenschappelijk Onderzoek | Apparatus and method for treating an object |
| KR101842675B1 (ko) * | 2009-07-08 | 2018-03-27 | 플라즈마시, 인크. | 플라즈마 처리를 위한 장치 및 방법 |
| US20110033638A1 (en) * | 2009-08-10 | 2011-02-10 | Applied Materials, Inc. | Method and apparatus for deposition on large area substrates having reduced gas usage |
| JP5665290B2 (ja) * | 2009-08-24 | 2015-02-04 | 富士フイルム株式会社 | 成膜装置 |
| JP5542488B2 (ja) * | 2010-03-18 | 2014-07-09 | 富士フイルム株式会社 | 成膜装置 |
| EP2762609B1 (en) * | 2013-01-31 | 2019-04-17 | Applied Materials, Inc. | Apparatus and method for depositing at least two layers on a substrate |
| EP2762607B1 (en) * | 2013-01-31 | 2018-07-25 | Applied Materials, Inc. | Deposition source with adjustable electrode |
| EP2784176B1 (en) * | 2013-03-28 | 2018-10-03 | Applied Materials, Inc. | Deposition platform for flexible substrates |
-
2013
- 2013-01-31 EP EP13153501.5A patent/EP2762608B1/en active Active
- 2013-04-26 US US13/871,789 patent/US20140208565A1/en not_active Abandoned
-
2014
- 2014-01-22 WO PCT/EP2014/051261 patent/WO2014118063A1/en not_active Ceased
- 2014-01-22 JP JP2015555651A patent/JP7068766B2/ja active Active
- 2014-01-22 CN CN201480006989.5A patent/CN104968831B/zh active Active
- 2014-01-22 KR KR1020157023458A patent/KR102228608B1/ko active Active
- 2014-01-28 TW TW103103027A patent/TWI655314B/zh active
-
2018
- 2018-12-11 US US16/217,027 patent/US20190112706A1/en not_active Abandoned
-
2020
- 2020-04-03 JP JP2020067243A patent/JP2020125544A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5399254A (en) * | 1990-12-14 | 1995-03-21 | Leybold Ag | Apparatus for plasma treatment |
| CN102197159A (zh) * | 2008-11-05 | 2011-09-21 | 株式会社爱发科 | 卷绕式真空处理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102228608B1 (ko) | 2021-03-15 |
| US20190112706A1 (en) | 2019-04-18 |
| CN104968831A (zh) | 2015-10-07 |
| EP2762608A1 (en) | 2014-08-06 |
| TWI655314B (zh) | 2019-04-01 |
| KR20150114528A (ko) | 2015-10-12 |
| WO2014118063A1 (en) | 2014-08-07 |
| JP2016514197A (ja) | 2016-05-19 |
| JP7068766B2 (ja) | 2022-05-17 |
| JP2020125544A (ja) | 2020-08-20 |
| US20140208565A1 (en) | 2014-07-31 |
| TW201445005A (zh) | 2014-12-01 |
| EP2762608B1 (en) | 2019-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |