JP2016514198A5 - - Google Patents
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- Publication number
- JP2016514198A5 JP2016514198A5 JP2015555681A JP2015555681A JP2016514198A5 JP 2016514198 A5 JP2016514198 A5 JP 2016514198A5 JP 2015555681 A JP2015555681 A JP 2015555681A JP 2015555681 A JP2015555681 A JP 2015555681A JP 2016514198 A5 JP2016514198 A5 JP 2016514198A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- coating drum
- gas separation
- separation unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000151 deposition Methods 0.000 claims description 319
- 230000008021 deposition Effects 0.000 claims description 287
- 238000000926 separation method Methods 0.000 claims description 285
- 239000000758 substrate Substances 0.000 claims description 277
- 239000011248 coating agent Substances 0.000 claims description 181
- 238000000576 coating method Methods 0.000 claims description 181
- 238000012545 processing Methods 0.000 claims description 159
- 238000000034 method Methods 0.000 claims description 121
- 239000010409 thin film Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 28
- 238000012806 monitoring device Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 description 425
- 230000008569 process Effects 0.000 description 93
- 238000010586 diagram Methods 0.000 description 21
- 238000010926 purge Methods 0.000 description 14
- 238000005086 pumping Methods 0.000 description 11
- 238000005137 deposition process Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 238000011282 treatment Methods 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000008602 contraction Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical group O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- 229910052756 noble gas Inorganic materials 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000011866 long-term treatment Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13153493.5 | 2013-01-31 | ||
| EP13153493.5A EP2762607B1 (en) | 2013-01-31 | 2013-01-31 | Deposition source with adjustable electrode |
| PCT/EP2014/051632 WO2014118177A1 (en) | 2013-01-31 | 2014-01-28 | Deposition source with adjustable electrode |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016514198A JP2016514198A (ja) | 2016-05-19 |
| JP2016514198A5 true JP2016514198A5 (enExample) | 2017-03-09 |
| JP6297597B2 JP6297597B2 (ja) | 2018-03-20 |
Family
ID=47747375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015555681A Active JP6297597B2 (ja) | 2013-01-31 | 2014-01-28 | 調整可能な電極を有する堆積源 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140212599A1 (enExample) |
| EP (1) | EP2762607B1 (enExample) |
| JP (1) | JP6297597B2 (enExample) |
| KR (1) | KR102033673B1 (enExample) |
| CN (1) | CN104968830B (enExample) |
| TW (1) | TWI619827B (enExample) |
| WO (1) | WO2014118177A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104040023B (zh) * | 2012-01-16 | 2016-04-13 | 株式会社爱发科 | 成膜装置 |
| EP2762609B1 (en) * | 2013-01-31 | 2019-04-17 | Applied Materials, Inc. | Apparatus and method for depositing at least two layers on a substrate |
| EP2762608B1 (en) * | 2013-01-31 | 2019-10-02 | Applied Materials, Inc. | Gas separation by adjustable separation wall |
| EP2784176B1 (en) * | 2013-03-28 | 2018-10-03 | Applied Materials, Inc. | Deposition platform for flexible substrates |
| CN104695201B (zh) * | 2015-03-10 | 2016-09-21 | 渤扬复合面料科技(昆山)有限公司 | 翻转式电极组纺织品大气等离子处理机构及双面处理机构 |
| FR3035122B1 (fr) * | 2015-04-20 | 2017-04-28 | Coating Plasma Ind | Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede |
| CN108603291B (zh) * | 2016-02-12 | 2023-11-14 | 应用材料公司 | 真空处理系统和其方法 |
| CN105549340B (zh) * | 2016-02-24 | 2017-10-24 | 上海大学 | 卷对卷柔性衬底光刻方法和装置 |
| CN106373868B (zh) * | 2016-10-10 | 2020-03-10 | 昆山龙腾光电股份有限公司 | 一种阵列基板的制造方法 |
| EP4596776A3 (en) * | 2019-02-19 | 2025-10-29 | Xefco Pty Ltd | System for treatment and/or coating of substrates |
| WO2021185444A1 (en) * | 2020-03-18 | 2021-09-23 | Applied Materials, Inc. | Vacuum processing system for a flexible substrate, method of depositing a layer stack on a flexible substrate, and layer system |
| US11732345B2 (en) * | 2020-06-04 | 2023-08-22 | Applied Materials, Inc. | Vapor deposition apparatus and method for coating a substrate in a vacuum chamber |
| US11905589B2 (en) * | 2020-08-20 | 2024-02-20 | Applied Materials, Inc. | Material deposition apparatus having at least one heating assembly and method for pre- and/or post-heating a substrate |
| US20230137506A1 (en) * | 2020-08-21 | 2023-05-04 | Applied Materials, Inc. | Processing system for processing a flexible substrate and method of measuring at least one of a property of a flexible substrate and a property of one or more coatings on the flexible substrate |
| CN116724142A (zh) * | 2021-01-19 | 2023-09-08 | 芝浦机械株式会社 | 表面处理装置及表面处理方法 |
| TWI788032B (zh) * | 2021-09-28 | 2022-12-21 | 天虹科技股份有限公司 | 開合式遮蔽機構及具有開合式遮蔽機構的薄膜沉積機台 |
| CN115874158B (zh) * | 2021-09-28 | 2024-11-15 | 天虹科技股份有限公司 | 开合式遮蔽机构及薄膜沉积机台 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4039930A1 (de) * | 1990-12-14 | 1992-06-17 | Leybold Ag | Vorrichtung fuer plasmabehandlung |
| DE69312989T2 (de) * | 1992-03-13 | 1997-12-18 | Matsushita Electric Ind Co Ltd | Plasma-CVD-Anlage und entsprechendes Verfahren |
| JP3175894B2 (ja) * | 1994-03-25 | 2001-06-11 | 株式会社半導体エネルギー研究所 | プラズマ処理装置及びプラズマ処理方法 |
| JPH09228054A (ja) * | 1996-02-16 | 1997-09-02 | Hitachi Ltd | 磁気記録媒体およびその製造方法と製造装置 |
| JPH116071A (ja) * | 1997-06-12 | 1999-01-12 | Sony Corp | プラズマｃｖｄ法及びプラズマｃｖｄ装置 |
| US6082292A (en) * | 1999-01-05 | 2000-07-04 | Wisconsin Alumni Research Foundation | Sealing roller system for surface treatment gas reactors |
| KR20020080954A (ko) * | 2001-04-18 | 2002-10-26 | 주성엔지니어링(주) | 냉벽 화학기상증착 방법 및 장치 |
| CH696013A5 (de) * | 2002-10-03 | 2006-11-15 | Tetra Laval Holdings & Finance | Vorrichtung zur Behandlung eines bandförmigen Materials in einem Plasma-unterstützten Prozess. |
| JPWO2006093168A1 (ja) * | 2005-03-04 | 2008-08-07 | 株式会社ユーテック | Ｃｖｄ装置と、それを用いた多層膜形成方法と、それにより形成された多層膜 |
| JP4747658B2 (ja) * | 2005-04-22 | 2011-08-17 | 大日本印刷株式会社 | 成膜装置及び成膜方法 |
| US7763114B2 (en) * | 2005-12-28 | 2010-07-27 | 3M Innovative Properties Company | Rotatable aperture mask assembly and deposition system |
| JP2008031521A (ja) * | 2006-07-28 | 2008-02-14 | Sony Corp | ロールツーロール型のプラズマ真空処理装置 |
| CN102027574B (zh) * | 2008-02-08 | 2014-09-10 | 朗姆研究公司 | 等离子体处理室部件的保护性涂层及其使用方法 |
| CN102197159B (zh) * | 2008-11-05 | 2013-07-10 | 株式会社爱发科 | 卷绕式真空处理装置 |
| JP2012518894A (ja) * | 2009-02-02 | 2012-08-16 | リンデール インコーポレイテッド | 高密度コンデンサまたは他の顕微鏡的層を有する機械的デバイスの製造方法 |
| JP5643528B2 (ja) * | 2009-03-30 | 2014-12-17 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP5562723B2 (ja) * | 2009-05-29 | 2014-07-30 | 富士フイルム株式会社 | 成膜方法、成膜装置、およびガスバリアフィルムの製造方法 |
| US20110033638A1 (en) * | 2009-08-10 | 2011-02-10 | Applied Materials, Inc. | Method and apparatus for deposition on large area substrates having reduced gas usage |
| EP2362001A1 (en) * | 2010-02-25 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and device for layer deposition |
| JP2011192664A (ja) * | 2010-03-11 | 2011-09-29 | Tokyo Electron Ltd | プラズマエッチング方法及びプラズマエッチング装置 |
| JP5831759B2 (ja) * | 2011-04-28 | 2015-12-09 | 日東電工株式会社 | 真空成膜方法、及び該方法によって得られる積層体 |
| WO2013103609A1 (en) * | 2012-01-03 | 2013-07-11 | Applied Materials, Inc. | Advanced platform for passivating crystalline silicon solar cells |
| EP2762608B1 (en) * | 2013-01-31 | 2019-10-02 | Applied Materials, Inc. | Gas separation by adjustable separation wall |
| EP2762609B1 (en) * | 2013-01-31 | 2019-04-17 | Applied Materials, Inc. | Apparatus and method for depositing at least two layers on a substrate |
| EP2784176B1 (en) * | 2013-03-28 | 2018-10-03 | Applied Materials, Inc. | Deposition platform for flexible substrates |
-
2013
- 2013-01-31 EP EP13153493.5A patent/EP2762607B1/en active Active
- 2013-04-26 US US13/871,874 patent/US20140212599A1/en not_active Abandoned
-
2014
- 2014-01-28 WO PCT/EP2014/051632 patent/WO2014118177A1/en not_active Ceased
- 2014-01-28 KR KR1020157023455A patent/KR102033673B1/ko active Active
- 2014-01-28 CN CN201480006817.8A patent/CN104968830B/zh active Active
- 2014-01-28 JP JP2015555681A patent/JP6297597B2/ja active Active
- 2014-01-29 TW TW103103338A patent/TWI619827B/zh active
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