TWI654066B - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing methodInfo
- Publication number
- TWI654066B TWI654066B TW107116664A TW107116664A TWI654066B TW I654066 B TWI654066 B TW I654066B TW 107116664 A TW107116664 A TW 107116664A TW 107116664 A TW107116664 A TW 107116664A TW I654066 B TWI654066 B TW I654066B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- movable cavity
- resin sealing
- mold frame
- sealed space
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims abstract description 437
- 229920005989 resin Polymers 0.000 title claims abstract description 437
- 238000007789 sealing Methods 0.000 title claims abstract description 349
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 25
- 239000007924 injection Substances 0.000 claims abstract description 25
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 9
- 238000005259 measurement Methods 0.000 claims description 42
- 230000014509 gene expression Effects 0.000 claims description 13
- 238000010792 warming Methods 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 description 34
- 239000004065 semiconductor Substances 0.000 description 23
- 238000003825 pressing Methods 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000012937 correction Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-116087 | 2016-06-10 | ||
| JP2016116087A JP6710107B2 (ja) | 2016-06-10 | 2016-06-10 | 樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201831300A TW201831300A (zh) | 2018-09-01 |
| TWI654066B true TWI654066B (zh) | 2019-03-21 |
Family
ID=60578236
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107116664A TWI654066B (zh) | 2016-06-10 | 2016-10-06 | Resin sealing device and resin sealing method |
| TW105132447A TWI636861B (zh) | 2016-06-10 | 2016-10-06 | Resin sealing device and resin sealing method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105132447A TWI636861B (zh) | 2016-06-10 | 2016-10-06 | Resin sealing device and resin sealing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6710107B2 (ja) |
| KR (1) | KR102128921B1 (ja) |
| CN (1) | CN109075083B (ja) |
| TW (2) | TWI654066B (ja) |
| WO (1) | WO2017212660A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7084247B2 (ja) * | 2018-08-02 | 2022-06-14 | Ｔｏｗａ株式会社 | 樹脂成形装置、成形型、及び樹脂成形品の製造方法 |
| JP7034891B2 (ja) * | 2018-11-20 | 2022-03-14 | Ｔｏｗａ株式会社 | 樹脂成形装置および樹脂成形品の製造方法 |
| JP6995415B1 (ja) * | 2021-05-31 | 2022-01-14 | アサヒ・エンジニアリング株式会社 | 樹脂封止金型、樹脂封止装置および樹脂封止方法 |
| CN114986803A (zh) * | 2022-05-30 | 2022-09-02 | 青岛歌尔微电子研究院有限公司 | 塑封模具的上模、塑封模具 |
| CN115214083B (zh) * | 2022-08-25 | 2023-10-13 | 合肥通富微电子有限公司 | 一种塑封装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201420308A (zh) | 2012-11-09 | 2014-06-01 | Sharp Kk | 成形物製造裝置、以及成形物製造方法 |
| TW201446458A (zh) | 2013-06-14 | 2014-12-16 | Apic Yamada Corp | 樹脂成型模具與樹脂成型裝置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3131474B2 (ja) * | 1991-10-22 | 2001-01-31 | アピックヤマダ株式会社 | 樹脂モールド方法 |
| JPH08316258A (ja) * | 1995-05-23 | 1996-11-29 | Toshiba Fa Syst Eng Kk | 半導体封入モールド装置 |
| TWI359069B (en) * | 2004-11-02 | 2012-03-01 | Apic Yamada Corp | Resin molding equipment and resin molding method |
| JP4235623B2 (ja) * | 2005-05-10 | 2009-03-11 | アピックヤマダ株式会社 | 樹脂封止装置 |
| JP5065747B2 (ja) * | 2007-04-27 | 2012-11-07 | アサヒ・エンジニアリング株式会社 | 半導体パッケージの製造方法及び製造装置 |
| JP5560479B2 (ja) * | 2009-07-01 | 2014-07-30 | アピックヤマダ株式会社 | 樹脂モールド金型及び樹脂モールド装置、並びに樹脂モールド方法 |
| JP5774545B2 (ja) | 2012-05-29 | 2015-09-09 | Ｔｏｗａ株式会社 | 樹脂封止成形装置 |
-
2016
- 2016-06-10 JP JP2016116087A patent/JP6710107B2/ja active Active
- 2016-08-17 WO PCT/JP2016/073975 patent/WO2017212660A1/ja active Application Filing
- 2016-08-17 KR KR1020187026152A patent/KR102128921B1/ko active IP Right Grant
- 2016-08-17 CN CN201680085490.7A patent/CN109075083B/zh active Active
- 2016-10-06 TW TW107116664A patent/TWI654066B/zh active
- 2016-10-06 TW TW105132447A patent/TWI636861B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201420308A (zh) | 2012-11-09 | 2014-06-01 | Sharp Kk | 成形物製造裝置、以及成形物製造方法 |
| TW201446458A (zh) | 2013-06-14 | 2014-12-16 | Apic Yamada Corp | 樹脂成型模具與樹脂成型裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180134335A (ko) | 2018-12-18 |
| KR102128921B1 (ko) | 2020-07-01 |
| TWI636861B (zh) | 2018-10-01 |
| TW201831300A (zh) | 2018-09-01 |
| JP6710107B2 (ja) | 2020-06-17 |
| WO2017212660A1 (ja) | 2017-12-14 |
| CN109075083B (zh) | 2022-03-08 |
| CN109075083A (zh) | 2018-12-21 |
| TW201742733A (zh) | 2017-12-16 |
| JP2017220629A (ja) | 2017-12-14 |
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