KR102128921B1 - 수지 밀봉 장치 - Google Patents

수지 밀봉 장치 Download PDF

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Publication number
KR102128921B1
KR102128921B1 KR1020187026152A KR20187026152A KR102128921B1 KR 102128921 B1 KR102128921 B1 KR 102128921B1 KR 1020187026152 A KR1020187026152 A KR 1020187026152A KR 20187026152 A KR20187026152 A KR 20187026152A KR 102128921 B1 KR102128921 B1 KR 102128921B1
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KR
South Korea
Prior art keywords
resin
movable cavity
mold
resin sealing
sealing
Prior art date
Application number
KR1020187026152A
Other languages
English (en)
Korean (ko)
Other versions
KR20180134335A (ko
Inventor
마사아키 이시이
Original Assignee
아사히 엔지니어링 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 엔지니어링 가부시끼가이샤 filed Critical 아사히 엔지니어링 가부시끼가이샤
Publication of KR20180134335A publication Critical patent/KR20180134335A/ko
Application granted granted Critical
Publication of KR102128921B1 publication Critical patent/KR102128921B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020187026152A 2016-06-10 2016-08-17 수지 밀봉 장치 KR102128921B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-116087 2016-06-10
JP2016116087A JP6710107B2 (ja) 2016-06-10 2016-06-10 樹脂封止装置
PCT/JP2016/073975 WO2017212660A1 (ja) 2016-06-10 2016-08-17 樹脂封止装置

Publications (2)

Publication Number Publication Date
KR20180134335A KR20180134335A (ko) 2018-12-18
KR102128921B1 true KR102128921B1 (ko) 2020-07-01

Family

ID=60578236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187026152A KR102128921B1 (ko) 2016-06-10 2016-08-17 수지 밀봉 장치

Country Status (5)

Country Link
JP (1) JP6710107B2 (ja)
KR (1) KR102128921B1 (ja)
CN (1) CN109075083B (ja)
TW (2) TWI636861B (ja)
WO (1) WO2017212660A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7084247B2 (ja) * 2018-08-02 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置、成形型、及び樹脂成形品の製造方法
JP7034891B2 (ja) * 2018-11-20 2022-03-14 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
JP6995415B1 (ja) * 2021-05-31 2022-01-14 アサヒ・エンジニアリング株式会社 樹脂封止金型、樹脂封止装置および樹脂封止方法
CN114986803A (zh) * 2022-05-30 2022-09-02 青岛歌尔微电子研究院有限公司 塑封模具的上模、塑封模具
CN115214083B (zh) * 2022-08-25 2023-10-13 合肥通富微电子有限公司 一种塑封装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277470A (ja) * 2007-04-27 2008-11-13 Asahi Engineering Kk 半導体パッケージの製造方法及び製造装置
JP2011011426A (ja) * 2009-07-01 2011-01-20 Apic Yamada Corp 樹脂モールド金型及び樹脂モールド装置
JP2013247315A (ja) 2012-05-29 2013-12-09 Towa Corp 樹脂封止成形装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3131474B2 (ja) * 1991-10-22 2001-01-31 アピックヤマダ株式会社 樹脂モールド方法
JPH08316258A (ja) * 1995-05-23 1996-11-29 Toshiba Fa Syst Eng Kk 半導体封入モールド装置
TWI359069B (en) * 2004-11-02 2012-03-01 Apic Yamada Corp Resin molding equipment and resin molding method
JP4235623B2 (ja) * 2005-05-10 2009-03-11 アピックヤマダ株式会社 樹脂封止装置
US9452554B2 (en) 2012-11-09 2016-09-27 Sharp Kabushiki Kaisha Molded product manufacturing apparatus, and molded product manufacturing method
JP6062810B2 (ja) 2013-06-14 2017-01-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277470A (ja) * 2007-04-27 2008-11-13 Asahi Engineering Kk 半導体パッケージの製造方法及び製造装置
JP2011011426A (ja) * 2009-07-01 2011-01-20 Apic Yamada Corp 樹脂モールド金型及び樹脂モールド装置
JP2013247315A (ja) 2012-05-29 2013-12-09 Towa Corp 樹脂封止成形装置

Also Published As

Publication number Publication date
CN109075083B (zh) 2022-03-08
KR20180134335A (ko) 2018-12-18
TW201742733A (zh) 2017-12-16
WO2017212660A1 (ja) 2017-12-14
JP2017220629A (ja) 2017-12-14
TWI654066B (zh) 2019-03-21
JP6710107B2 (ja) 2020-06-17
TW201831300A (zh) 2018-09-01
TWI636861B (zh) 2018-10-01
CN109075083A (zh) 2018-12-21

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