TWI650376B - 針對提升穩定度之重載磷光體led封裝之封裝材料調整 - Google Patents
針對提升穩定度之重載磷光體led封裝之封裝材料調整 Download PDFInfo
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Abstract
本發明揭示具有較高穩定度之重載磷光體LED封裝及一種用於增加重載磷光體LED封裝之穩定度之方法。藉由減少混合物之一種磷光體之量或藉由增加聚矽氧磷光體混合物層之厚度來增加該等封裝之聚矽氧含量。
Description
本發明大體上係關於載入磷光體之發光二極體(LED)。更特定言之,本發明係關於具有較高穩定度之重載磷光體LED封裝及用於提升該等重載磷光體LED封裝之穩定度之方法。
LED係通常用作其他光源(諸如白熾燈)之替換物之半導體光發射器。其等在其中期望離散光或高度聚集之光之應用中作為照明源尤其有用。由一LED封裝所產生之光之色彩係取決於用於其製造中之半導體材料之類型及(在使用一磷光體系統的情況下)所使用的磷光體或磷光體混合物。
已由III-V族合金(諸如氮化鎵(GaN))產生包含發光二極體及雷射(在本文中兩者一般稱作LED)之彩色半導體LED。參考基於GaN之LED,光通常以UV發射到電磁光譜之綠色範圍。直至最近,由於由LED所產生之光之固有色彩,LED已不適合於其中需要一明亮白光之發光用途。
磷光體將輻射(能量)轉換為可見光。磷光體之不同組合提供不同彩色光發射。所產生之可見光之色彩係取決於磷光體之特定成分。磷光體材料可僅包含具有基本色彩之一單個磷光體或兩個或兩個以上磷光體(例如,與一黃色及紅色磷光體中之一或多者之一特定混合)以發
射一所要色彩(色調)之光。如本文中所使用,術語「磷光體」及「磷光體材料」可用於表示一單個磷光體組合物以及兩個或兩個以上磷光體組合物之一混合物兩者。
在其中期望「白」光之典型應用中,結合LED使用磷光體以提供具有所要特性之一可接受淨發射光譜。「白」光通常定義為接近於2500K至6000K之相關色溫(CCT)之區域中之黑體色彩軌跡。例如,在一典型照明器具應用中,結合黃色、綠色及紅色磷光體來使用在電磁光譜之藍色區域中發射之由InGaN(氮化銦鎵)製成之LED以提供介於自約2500K CCT至6000K CCT之範圍內之複合光譜輸出。CIE三色刺激標繪圖中之所得色溫及色點取決於二極體發射器之輸出光譜功率及波長、混合比、轉換特性及所使用之磷光體之量。
美國專利第7,497,973號揭示包含一半導體光源之LED及包含以Mn4+活化之一複合磷光體之一磷光體材料。該特定磷光體材料係K2[SiF6]:Mn4+(氟化鉀矽或PFS)。此專利中所討論之任意狹窄紅色磷光體可用於本發明中。
另一LED使用PFS磷光體及磷光體BSY(藍色偏移釔鋁石榴石(YAG))之一組合。此組合稱作BSY-PFS且其產生一白光。使用一BSY-PFS組合之一LED封裝之一項較佳實施例係在本文中用作一例示性實施例之一低至中功率之LED封裝(<1W)。在一Nichia 757封裝中使用Nichia Mint磷光體(BSY)及GE PFS磷光體來製造此一封裝之一項實例。根據美國專利第5,998,925號及第7,026,756號涵蓋了在白色LED中使用石榴石磷光體。熟習此項技術者將明了本發明元件之實施方案並不限於Nichia757。可以其中結合一BSY磷光體或一光譜類似之磷光體使用PFS之若干個不同LED封裝來實施本發明。
據此,LED封裝中磷光體之使用提供優點且較為普遍。然而,包含PFS磷光體之LED封裝一般展現長期色彩及流明穩定度問題。例
如,BSY-PFS系統在4000K Hi CRI(演色指數)下之色彩要求使聚矽氧/磷光體碟/模具之極高磷光體載入成為必需。在存在濕氣之可靠性測試中,來自經供能之LED封裝之所得可見輻射使色彩偏移。主要是光譜功率分佈之紅色成分隨操作時間逐漸損耗強度。高磷光體載入亦導致側壁「溝渠」形成及導致淨色點偏移之其他效應。
上述缺點顯著限制低及中功率PSF LED(諸如BSY-PSF LED)之有用性。因此,具有減輕色彩不穩定度問題之LED封裝位準提升將為有用的。
本發明係關於使用PFS磷光體來提升LED封裝之穩定度。如上文所述,在此等封裝中磷光體載入一般較高。高載入在此內容脈絡中係指磷光體與聚矽氧具有20%、30%及更高的重量比。
在至少一項態樣中,本發明提供提升採用PFS磷光體系統之LED封裝之長期穩定度及可靠性之方法。一項例示性實施例係Nichia 757中功率LED封裝,其高度載有一BSY-PFS磷光體混合物。
在另一態樣中,本發明提供具有較高穩定度之重載磷光體LED封裝。
用以提升長期穩定度之方法涉及增加聚矽氧對磷光體之重量比,從而對磷光體提供保護且增加穩定度。可依至少兩種方式增加重量比,該等方式兩者皆增加穩定度同時實質上維持可接受的效能。
在一種用以提升重載磷光體LED封裝之穩定度之方法中,增加LED封裝腔之大小且使用具有一較高聚矽氧重量比之一聚矽氧磷光體混合物,同時保持磷光體之總量相同。
在一第二方法中,調整聚矽氧磷光體混合比以增加聚矽氧含量同時將磷光體含量維持在一可接受的位準處。
10‧‧‧例示性先前技術發光二極體封裝/封裝/發光二極體封裝
12‧‧‧發光二極體封裝晶片/晶片
18‧‧‧透鏡
22‧‧‧磷光體及聚矽氧混合物層/磷光體聚矽氧混合物層
24‧‧‧箭頭
30‧‧‧外側外殼
32‧‧‧腔
52‧‧‧發光二極體晶片
54‧‧‧磷光體及聚矽氧混合物層/層/聚矽氧磷光體混合物/聚矽氧磷光體混合物層/聚矽氧磷光體層
56‧‧‧透鏡
58‧‧‧腔
60‧‧‧外側外殼
d‧‧‧深度
dd‧‧‧深度
圖1繪示先前技術之一LED之一示意圖。
圖2繪示具有一較深腔及具有一較高聚矽氧重量百分比之一聚矽氧磷光體混合物之一LED封裝。
本發明可採取各種組件及組件之配置及各種程序操作及程序操作之配置之形式。在附圖中繪示本發明,縱觀附圖,在各種圖式中相同元件符號可指示對應或相似部件。該等圖式僅出於繪示較佳實施例之目的且不應視為限制本發明。考慮到下文進行附圖之描述,本發明之新穎態樣應變得對熟悉此項技術者顯而易見。
以下詳細描述本質上僅係例示性的且並不意欲限制本文中所揭示之應用及使用。此外,不意欲受【先前技術】或【發明內容】或【實施方式】中呈現之任何理論約束。儘管本文中所描述之本技術之實施例主要結合PFS LED封裝,且尤其為低及中功率LED封裝(諸如Nichia 757 BSY-PFS LED封裝),但該等概念亦可適用於其他類型之載有磷光體之LED且尤其適用於其他類型之重載磷光體LED。具體言之,該等概念最適用於其中磷光體與聚矽氧之重量比較高(20%、30%及更高)且該等磷光體中之至少一者展現對環境大氣成分(諸如濕氣)之敏感度之LED封裝。
圖1展示一例示性先前技術LED封裝10。封裝10包括一發光二極體(LED)晶片12。一磷光體及聚矽氧混合物層22上覆於晶片12上。用一透鏡18來封裝LED晶片12及磷光體聚矽氧混合物層22。LED封裝10包含一外側外殼30,其界定其中保持有LED晶片12以及磷光體及聚矽氧混合物層22之一腔32。腔32具有一深度「d」。磷光體聚矽氧混合物層22在由箭頭24指示之方向上以輻射方式耦合至LED晶片12。以輻射方式耦合意指元件彼此相關聯使得由一者所發射之輻射之至少部分被傳輸至另一者。
在上述先前技術封裝中,需要一定量之磷光體混合物來達成所要白光。另外,為達成必要的製造需求,聚矽氧之量係重要的。此等因素及腔32之大小決定磷光體聚矽氧混合物層22中磷光體及聚矽氧之較佳相對百分比。
圖2中展示根據本發明之一LED封裝50之一項實施例。一LED晶片52上覆有一磷光體及聚矽氧混合物層54。此層54視情況覆蓋有一透鏡56。LED晶片52及聚矽氧磷光體混合物54保持於由一外側外殼60所形成之一腔58中。
聚矽氧磷光體混合物層54包括一聚矽氧及一磷光體混合物。期望該聚矽氧磷光體混合物重載有磷光體(大於20%)且包含一狹窄紅色磷光體作為該磷光體混合物之一成分。一實例為K2[SiF6]:Mn4+(氟化鉀矽或PFS磷光體)。該磷光體混合物亦可包含磷光體BSY(藍色偏移釔鋁石榴石(YAG))。此組合稱作BSY-PFS。
在一較佳實施例中,LED封裝係一低至中功率LED封裝(<1W)。
腔58具有一深度「dd」。腔58之深度「dd」大於腔32之深度「d」,意指聚矽氧磷光體層54具有大於先前技術裝置中之層22之一體積。由於可保持磷光體之量相同以適當地起作用,所以可增加混合物中聚矽氧之量,此保護磷光體且提供色彩偏移之一提升。
腔深度「dd」可增加一額外0.3至3倍於LED封裝之當前深度「d」。換言之,dd在介於自1.3d至3d之範圍內。例如,Nichia 757封裝具有300微米之一腔深度。將期望400微米至900微米之一增加之腔深度。下表繪示增加dd對聚矽氧重量百分比之影響。
在本發明之一第二實施例中,減少BSY-PFS混合物中PFS磷光體之絕對質量含量。此可減少LED之所得光譜功率分佈之紅光含量,但將提升操作之穩健性。可以對色溫及/或演色指數(CRI)之一可接受的折衷來減少PFS之量。
為在來自PFS磷光體之光譜中提供足夠紅光發射,聚矽氧重量百分比一般接近其可容許之最小值,如由一給定習知LED封裝(諸如Nichia 757)之製造程序中一混合物之所需黏度所判定。換言之,PFS:BSY之較佳範圍及比率:聚矽氧為35-40:10-12:48-52。
PFS在一比較PFS-BSY聚矽氧混合物(其用於Nichia 757中功率封裝中)中之重量百分比約為40重量%。可將該混合物中PFS之總量減少至約36%,以容許聚矽氧重量百分比自49%增加至約53%(BSY維持在11%)。
本文中所描述之封裝可包含能夠在其之經發射輻射被引導至磷光體上時產生白光之任何半導體可見光源或UV光源。LED晶片之較佳峰值發射將取決於所使用之磷光體之身份且可在介於(例如)250奈米至550奈米之範圍內。然而,在一項較佳實施例中,LED之發射將在紫色至藍綠色區域中且具有介於自約420奈米至500奈米之範圍內之一峰值波長。接著,半導體光源通常包括摻雜有各種雜質之一LED。因此,LED可包括基於任何適當III-V族、II-VI族或IV-IV族半導體層且具有約250奈米至550奈米之一峰值發射波長之一半導體二極體。
儘管本文中所討論之本發明之例示性結構之一般討論係關於基於無機LED之光源,但應了解除非另有說明否則可由一有機光發射結構或其他輻射源代替該LED晶片且對LED晶片或半導體之任何參考僅係表示任何合適輻射源。
如此項技術中已知,該透鏡可為(例如)一環氧樹脂、塑膠、低溫玻璃、聚合物、熱塑性塑膠、熱固性材料、樹脂或其他類型的LED封
裝材料。視情況,該透鏡係旋塗式玻璃或具有一高折射率之一些其他材料。在一項較佳實施例中,該透鏡係一聚合物材料,諸如環氧樹脂、聚矽氧或聚矽氧環氧樹脂,但可使用其他有機或無機封裝材料。
較佳地,該透鏡係透明或相對於由LED晶片及磷光體聚矽氧混合物材料所產生之光之波長實質上光學透射者。在一替代實施例中,該封裝可包含一封裝材料而不具有一外透鏡。
LED封裝之外側外殼通常由聚合物複合材料EMC(環氧樹脂可模製化合物)製成。可藉由(例如)一引線框(未展示)、藉由自支撐電極、藉由外殼之底部或藉由安裝至外殼或該引線框之一基座(未展示)來支撐LED晶片。該LED晶片可電附接至外側外殼之底面處之電接觸件。熟習此項技術者已知在LED封裝中可存在具有類似功能屬性之多個晶片。
實例
表2展示具有不同磷光體載入之BSY-PFS混合物之Nichia 757 LED之間之色彩穩定度之淨提升。用於聚矽氧磷光體混合物中之磷光體之總量(BSY+PFS)自47重量%變化至51重量%。BSY之量恆定為11wt%及PFS係自36%至40%。聚矽氧係49%至53%。LED驅動及環境條件保持相同。在一47℃恆溫下LED操作條件係30mA。1500小時處的觀察指示藉由將PFS磷光體載入自40%減少至36%(將總磷光體自51%減少至47%且將聚矽氧自49%增加至53%)而達成對色彩偏移之大於50%提升。
下表3展示CCT與磷光體載入之間之一方向比較。隨著載入之
PFS部分自40%減少至36%,CCT存在約200K之一淨下降。在大多數情況下,可接受的色溫變動之工業標準容限可適應此等變動範圍。
可由熟悉此項技術者(特別鑒於前述教示)完成仍將由本發明涵蓋之替代實施例、實例及修改。此外,應瞭解用於描述本發明之術語意欲依描述之詞語(而非限制)之性質。
熟悉此項技術者亦將瞭解,可在不背離本發明之範疇及精神之情況下組態上文所描述較佳及替代實施例之各種調整及修改。因此,應瞭解在隨附申請專利範圍之範圍內,可除了如文中所特定描述實踐本發明。
Claims (9)
- 一種提升一重載磷光體(heavily phosphor loaded)LED封裝之色彩穩定度之方法,該重載磷光體含有一磷光體聚矽氧混合物(phosphor silicone blend)及作為該磷光體聚矽氧混合物之一成分(component)之一狹窄紅色磷光體,該方法包括增加該磷光體聚矽氧混合物(54)中聚矽氧對該狹窄紅色磷光體之重量比(weight ratio),其中將聚矽氧重量百分比自約47wt%增加至約53wt%。
- 如請求項1之方法,其中該狹窄紅色磷光體係PFS。
- 如請求項1之方法,其中該磷光體聚矽氧混合物進一步包含磷光體BSY。
- 如請求項1之方法,其中該聚矽氧磷光體混合物包含約53wt%之量之聚矽氧、約36wt%之量之PFS磷光體及約11wt%之量之BSY磷光體。
- 如請求項1之方法,其中該LED封裝係高度載有一BSY-PFS磷光體混合物之具有小於1W之功率之一中功率(mid power)LED封裝。
- 如請求項1之方法,其中該LED封裝在色彩偏移上具有至少25%之提升。
- 一種具有提升之色彩穩定度之重載磷光體LED封裝,其包括一LED及一聚矽氧磷光體混合物(54),其中該聚矽氧磷光體混合物包含約53wt%之量之聚矽氧、約36wt%之量之PFS磷光體及約11wt%之量之BSY磷光體。
- 如請求項7之LED封裝,其中該LED封裝係高度載有一BSY-PFS磷光體混合物之具有小於1W之功率的一中功率LED封裝。
- 如請求項7之LED封裝,其中該LED封裝在色彩偏移上具有至少25%之提升。
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EP4375348A2 (en) | 2024-05-29 |
US10862009B2 (en) | 2020-12-08 |
US20150270452A1 (en) | 2015-09-24 |
CA2942062C (en) | 2023-03-28 |
CN106062977A (zh) | 2016-10-26 |
US20170162762A1 (en) | 2017-06-08 |
JP6552516B2 (ja) | 2019-07-31 |
CA2942062A1 (en) | 2015-09-24 |
US9590148B2 (en) | 2017-03-07 |
EP3120393B1 (en) | 2024-01-10 |
KR20160133484A (ko) | 2016-11-22 |
CN106062977B (zh) | 2018-11-09 |
JP2017508297A (ja) | 2017-03-23 |
TW201602245A (zh) | 2016-01-16 |
EP3120393A1 (en) | 2017-01-25 |
MY188108A (en) | 2021-11-20 |
KR102462155B1 (ko) | 2022-11-02 |
WO2015142432A1 (en) | 2015-09-24 |
MX2016012014A (es) | 2016-12-05 |
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