CN106062977A - 重磷光体加载led封装件 - Google Patents
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 115
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Abstract
提供具有更高稳定性的重磷光体加载LED封装以及用于增加重磷光体加载LED封装的稳定性的方法。通过降低混合的一个磷光体的量或者通过增加硅酮磷光体混合物层的厚度来增加封装的硅酮含量。
Description
技术领域
本公开一般涉及磷光体加载(phosphor loaded)的发光二极管(LED)。更具体来说,本公开涉及具有较高稳定性的重磷光体加载LED封装件以及用于增加重磷光体加载LED封装件的稳定性的方法。
背景技术
LED是常常用作其他光源、例如白炽灯的替代的半导体光发射器。它们在预期离散化或高度集中光的应用中作为照明源是特别有用的。由LED封装件所产生的光的颜色取决于其制造中的半导体材料的类型,以及在使用磷光体系统的情况下取决于所使用的磷光体或磷光体混合物。
包括发光二极管和激光器(本文中均一般称作LED)的彩色半导体LED从族III-V合金、例如氮化镓(GaN)来产生。参照GaN基LED,光一般在电磁谱的UV至绿色范围中发射。直到最近,由于LED所产生的光的固有颜色,LED尚未适合于需要明亮白光的照明用途。
磷光体将辐射(能量)转换成可见光。磷光体的不同组合提供不同的彩色光发射。所生成可见光的颜色取决于磷光体的特定成分。磷光体材料可以仅包括基本颜色的单个磷光体或者两个或更多磷光体、例如具有黄色和红色磷光体的一个或多个的特定混合,以发射光的预期颜色(色调)。如本文所使用的术语“磷光体”和“磷光体材料”可用来表示单个磷光体组成或者两个或更多磷光体组成的混合。
在预期“白”光的典型应用中,磷光体与LED结合用来提供预期特性的可接受净发射谱。“白”光通常定义为接近2500 K至6000 K的相关色温(CCT)的区域中的颜色的黑体曲线。例如,在典型灯具应用中,从InGaN(氮化铟镓)所制成的LED(其在电磁谱的蓝色区域中进行发射)与黄色、绿色和红色磷光体结合用来提供从大约2500 K CCT至高于6000 K CCT的范围的合成谱输出。CIE三色图中的所产生色温和色点取决于二极管发射器的输出谱功率以及所使用磷光体的波长、混合比、会话特性和数量。
美国专利No. 7497973公开了包括半导体光源的LED以及包括采用Mn4+所激活的复合磷光体的磷光体材料。具体磷光体材料是K2[SiF6]:Mn4+ (氟硅酸钾或PFS)。本专利所述的窄红色磷光体的任一个能够用于本发明中。
另一个LED使用PFS磷光体和磷光体BSY(蓝移钇铝石榴石(YAG))的组合。这个组合称作BSY-PFS,并且它产生白光。使用BSY-PFS组合的LED封装件的一个优选实施例是本文中用作示范实施例的低至中功率LED封装件(<1 W)。这种封装件的一个示例使用Nichia 757封装件中的Nichia Mint磷光体(BSY)和GE PFS磷光体来制作。在美国专利号5998925和7026756中涵盖了白色LED中的石榴石磷光体的使用。本领域的技术人员将会清楚地知道,发明要素的实现并不局限于Nichia 757。本发明能够在PFS与BSY磷光体或谱相似磷光体结合使用的多个不同LED封装件中实现。
相应地,LED封装件中的磷光体的使用提供优点并且是常见的。但是,一般来说,包括PFS磷光体的LED封装件呈现长期颜色和流明稳定性问题。例如,在4000 K Hi CRI(显色指数)下的BSY-PFS系统的颜色要求需要硅酮/磷光体盘/模子的极高磷光体加载。在湿度存在的可靠性测试中,来自所激励LED封装件的所产生可见辐射使颜色偏移。谱功率分布的红色分量主要随操作时间而逐渐损失强度。高磷光体加载还引起侧壁“沟槽”形成和其他影响,其引起净色点偏移。
上述缺点显著限制低和中功率PSF LED、例如BSY-PSF LED的有用性。因此,具有减轻颜色稳定性问题的LED封装件级改进是有用的。
本发明涉及使用PFS磷光体来改进LED封装件的稳定性。一般来说,在这类封装件中,磷光体加载如上所述较高。这个上下文中的高加载表示20%、30%及以上的磷光体-硅酮重量比。
发明内容
在至少一个方面,本公开提供改进采用PFS磷光体系统的LED封装件的长期稳定性和可靠性的方法。一个示范实施例是Nichia 757中功率LED封装件,其高加载有BSY-PFS磷光体混合物。
在另一方面,本公开提供具有更高稳定性的重磷光体加载LED封装件。
改进长期稳定性的方法涉及增加硅酮对磷光体的重量比,因而提供对磷光体的保护并且增加稳定性。重量比能够按照至少两种方式来增加,其均在基本上保持可接受性能的同时增加稳定性。
在改进重磷光体加载LED封装件的稳定性的一种方法中,LED封装腔的大小增加,并且使用具有更高硅酮重量比的硅酮磷光体混合物,同时将磷光体的总量保持为相同。
在第二方法中,硅酮磷光体混合比调整成增加硅酮含量,同时将磷光体含量保持在可接受等级。
附图说明
图1示出现有技术的LED的示意图。
图2示出具有更深腔以及有更高硅酮重量百分比的硅酮磷光体混合物的LED封装件。
本公开可采取各种组件和组件的布置以及各种过程操作和过程操作的布置的形式。本公开在附图中示出,附图中,相似参考标号在各个附图中可通篇表示对应或相似部件。附图仅为了便于示出优选实施例,而并不是要被理解为限制本公开。给定附图的以下操作性描述,本公开的新方面对本领域的技术人员应当变得显而易见。
具体实施方式
以下详细描述实际上只是示范性的,而不是要限制本文所公开的应用和用途。此外,并不是意在通过前面的背景、概述或者以下详细描述中提供的任何理论来限制。虽然本文中主要结合PFS LED封装件以及特别是低和中功率LED封装件、例如Nichia 757 BSY-PFSLED封装件来描述本技术的实施例,但是概念也可适用于其他类型的磷光体加载LED以及特别是其他类型的重磷光体加载LED。具体来说,概念最适用于磷光体-硅酮重量比高(20%、30%及以上)并且磷光体的至少一个呈现对环境大气组分、例如水分的敏感性的LED封装件中。
图1示出示范现有技术LED封装件10。封装件10包括发光二极管(LED)芯片12。磷光体和硅酮混合物层22覆盖芯片12。LED芯片12和磷光体硅酮混合物层22采用透镜18来封装。LED封装件10包括外部壳体30,其限定保持LED芯片12以及磷光体和硅酮混合物层22的腔32。腔32具有深度“d”。磷光体硅酮混合物层22沿箭头24所指示的方向以辐射方式耦合到LED芯片12。“以辐射方式耦合”表示元件相互关联,使得从一个元件所发射的辐射的至少部分被传送到另一个元件。
在如上所述的现有封装件中,要求一定量的磷光体混合物以取得预期白光。另外,硅酮量是重要的,以便取得必要的制造要求。腔32的这些因素和大小确定磷光体硅酮混合物层22中的磷光体和硅酮的优选相对百分比。
按照本发明的LED封装件50的一个实施例在图2中示出。LED芯片52覆盖有磷光体和硅酮混合物层54。这个层54可选地覆盖有透镜56。LED芯片52和硅酮磷光体混合物54保持在外部壳体60所创建的腔58中。
硅酮磷光体混合物层54包括硅酮和磷光体混合物。合乎需要地,硅酮磷光体混合物重加载有磷光体(大于20%),并且包括作为磷光体混合物的成分的窄红色磷光体。示例是K2[SiF6]:Mn4+ (氟硅酸钾或PFS)。磷光体混合物还能够包括磷光体BSY(蓝移钇铝石榴石(YAG))。这个组合称作BSY-PFS。
在优选实施例中,LED封装件是低至中功率LED封装件(<1 W)。
腔58具有深度“dd”。腔58的深度“dd”大于腔32的深度“d”,表示硅酮磷光体层54具有比现有技术装置中的层22要大的体积。由于磷光体量能够保持为相同以便正确起作用,所以硅酮量能够在混合中增加,这保护磷光体并且提供色移的改进。
腔深度“dd”能够增加LED封装件的当前深度“d”的额外0.3至3倍。换言之,dd的范围从大约1.3d至3d。例如,Nichia 757封装件具有300微米的腔深度。400微米至900微米的增加腔深度是合乎需要的。下表示出增加dd对硅重量百分比的作用。
300 | 400 | 450 | 600 | 900 | |
PFS (wt%) | 44 | 36.3 | 33.4 | 26.9 | 19.3 |
BSY (wt%) | 11 | 9.1 | 8.3 | 5 | 4.8 |
Si (wt%) | 45 | 54.6 | 58.3 | 66.4 | 75.8 |
表1
在本发明的第二实施例中,BSY-PFS混合中的PFS磷光体的绝对质量含量降低。这可降低LED的所产生谱功率分布的红色含量,但是将改进操作的健壮性。PFS量能够采用色温和/或显色指数(CRI)的可接受折衷来降低。
为了提供从PFS磷光体在谱中的足够红色发射,硅酮重量百分比一般接近如给定常规LED封装件(例如Nichia 757)的制造过程中的混合的所需粘性所确定的容许最小值。换言之,PFS: BSY:硅酮的优选范围和比率为35-40: 10-12: 48-52。
比较的PFS-BSY硅酮混合中的PFS的重量百分比(如用于Nichia 757中功率封装件中)为大约40重量%。混合中的PFS的总量能够降低到大约36%,以允许硅酮重量百分比从49%增加到大约53% (BSY保持在11%)。
本文所述的封装件可包括任何半导体可见或UV光源,其能够在其所发射辐射定向到磷光体上时产生白光。LED芯片的优选峰值发射将取决于所使用磷光体的特性,并且范围可例如为250-550 nm。但是,在一个优选实施例中,LED的发射将在紫色至蓝绿区域中,并且具有从大约420至大约500 nm的范围中的峰值波长。半导体光源则通常包括掺杂有各种杂质的LED。因此,LED可包括基于任何适当III-V、II-VI或IV-IV半导体层并且具有大约250至550 nm的峰值发射波长的半导体二极管。
虽然本文所述的本发明的示范结构的一般论述针对基于无机LED的光源,但是应当理解,LED芯片可通过有机发光结构或另一辐射源来替代,除非另加说明,并且提到LED芯片或半导体只是表示任何适当辐射源。
透镜可以是例如环氧树脂、塑料、低温玻璃、聚合物、热塑、热固材料、树脂或者如本领域已知的另一种类型的LED封装材料。可选地,透镜是旋涂玻璃或者具有高折射率的另外某种材料。在一个优选实施例中,透镜是诸如环氧树脂、硅酮或者硅环氧树脂之类的聚合材料,但是可使用其他有机或无机密封剂。
透镜优选地针对LED芯片和磷光体硅酮混合物材料所产生的光的波长是透明或者基本上透光的。在备选实施例中,封装件可包括密封剂材料,而没有外透镜。
LED封装件的外部壳体通常由聚合合成材料EMC(环氧模塑化合物)来制成。LED芯片可例如由引线框(未示出)、由自承(self-supporting)电极、壳体的底部或者由安装到外壳或引线框的底座(未示出)来支承。LED芯片电附连到外部壳体的底面的电气触点。本领域的技术人员已知,可能有具有相似功能属性的多个芯片存在于LED封装件中。
示例
表2示出具有变化磷光体加载的BSY-PFS混合的Nichia 757 LED之间的颜色稳定性的纯改进。硅酮磷光体混合物中使用的磷光体(BSY+PFS)的总量从47重量%改变成51重量%。BSY量恒定在11 wt%,而PFS从36至40%。硅酮从49至53%。LED驱动和环境条件保持为相同。LED操作条件是47C恒温下的30 mA。1500小时的观察表明通过将PFS磷光体加载从40%降低到36%(从51%到47%的总磷光体并且将硅酮从49%增加到53%的色移的大于50%改进。
下表3示出CCT与磷光体加载之间的直接比较。当加载的PFS部分从40%降低到36%时,存在CCT的净~200 K下降。在大多数情况下,可接受色温变化的工业标准容差能够适应这类变化范围。
PFS含量,% | LED CCT,K |
36 | 3932 |
40 | 4156 |
表3
仍然由本公开包含的备选实施例、示例和修改可由本领域的技术人员具体根据以上理论进行。此外,应当理解,用来描述本公开的术语意在具有描述措辞而不是限制的性质。
本领域的技术人员还将会理解,能够配置上述优选和备选实施例的各种适配和修改,而没有背离本公开的范围和精神。因此,将会知道,在所附权利要求书的范围内,可以不按照本文的具体描述来实施本公开。
Claims (19)
1.一种改进包含磷光体硅酮混合物的重磷光体加载LED封装件的颜色稳定性的方法,包括通过增加所述磷光体硅酮混合物的体积和硅酮的总重量但保持所述磷光体的重量来增加所述磷光体硅酮混合物中的硅酮对所述磷光体的重量比。
2.如权利要求1所述的方法,其中,所述LED封装件保持在LED封装腔中,并且其中增加所述LED封装腔的大小,以适应硅酮磷光体混合物的较大体积。
3.如权利要求2所述的方法,其中,所述LED封装腔具有增加到0.3至3倍的深度。
4.如权利要求4所述的方法,其中,所述LED封装腔的所述深度为400至900微米。
5.如权利要求1所述的方法,其中,所述磷光体硅酮混合物中的所述硅酮的重量百分比为54至75。
6.如权利要求5所述的方法,其中,所述磷光体硅酮混合物中的硅酮的重量百分比为58至75。
7.一种包含磷光体硅酮混合物的重磷光体加载LED封装件,其中,所述LED封装件保持在具有400至900微米的深度的LED封装腔中,以及所述磷光体硅酮混合物中的硅酮的重量百分比为54至75。
8.如权利要求7所述的LED封装件,其中,所述LED封装腔深度是从450至900微米。
9.如权利要求7所述的LED封装件,其中,所述磷光体硅酮混合物中的硅酮的重量百分比为58至75。
10.一种改进包含磷光体硅酮混合物以及作为所述磷光体硅酮混合物的成分的窄红色磷光体的重磷光体加载LED封装件的颜色稳定性的方法,包括增加所述磷光体硅酮混合物中的硅酮对所述窄红色磷光体的重量比。
11. 如权利要求10所述的方法,其中,所述硅酮重量百分比从大约47 wt%增加到53wt%。
12.如权利要求10所述的方法,其中,所述窄红色磷光体为PFS。
13.如权利要求10所述的方法,其中,所述磷光体硅酮混合物还包括所述磷光体BSY。
14. 如权利要求10所述的方法,其中,所述硅酮磷光体混合物包括大约53 wt%的量的硅酮、大约36 wt%的量的PFS磷光体以及大约11 wt%的量的BSY磷光体。
15.如权利要求10所述的方法,其中,所述LED封装件是中功率LED封装件,其高加载有BSY-PFS磷光体混合物。
16.如权利要求10所述的方法,其中,所述LED封装件具有色移的至少25%改进。
17. 一种包括LED和硅酮磷光体混合物的具有改进颜色稳定性的重磷光体加载LED封装件,其中所述硅酮磷光体混合物包括大约53 wt%的量的硅酮、大约36 wt%的量的PFS磷光体以及大约11 wt%的量的BSY磷光体。
18.如权利要求17所述的LED封装件,其中,所述LED封装件是中功率LED封装件,其高加载有BSY-PFS磷光体混合物。
19.如权利要求17所述的LED封装件,其中,所述LED封装件具有色移的至少25%改进。
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KR20160133484A (ko) | 2016-11-22 |
MX2016012014A (es) | 2016-12-05 |
TW201602245A (zh) | 2016-01-16 |
EP3120393B1 (en) | 2024-01-10 |
US10862009B2 (en) | 2020-12-08 |
JP2017508297A (ja) | 2017-03-23 |
US20150270452A1 (en) | 2015-09-24 |
CA2942062A1 (en) | 2015-09-24 |
CN106062977B (zh) | 2018-11-09 |
JP6552516B2 (ja) | 2019-07-31 |
CA2942062C (en) | 2023-03-28 |
EP4375348A2 (en) | 2024-05-29 |
US9590148B2 (en) | 2017-03-07 |
EP3120393A1 (en) | 2017-01-25 |
WO2015142432A1 (en) | 2015-09-24 |
TWI650376B (zh) | 2019-02-11 |
KR102462155B1 (ko) | 2022-11-02 |
MY188108A (en) | 2021-11-20 |
US20170162762A1 (en) | 2017-06-08 |
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