TWI648793B - Conductor forming device and conductor manufacturing method - Google Patents

Conductor forming device and conductor manufacturing method Download PDF

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Publication number
TWI648793B
TWI648793B TW105132073A TW105132073A TWI648793B TW I648793 B TWI648793 B TW I648793B TW 105132073 A TW105132073 A TW 105132073A TW 105132073 A TW105132073 A TW 105132073A TW I648793 B TWI648793 B TW I648793B
Authority
TW
Taiwan
Prior art keywords
pattern
plating
conductor
peeling
processed
Prior art date
Application number
TW105132073A
Other languages
English (en)
Chinese (zh)
Other versions
TW201737347A (zh
Inventor
藤川治
中山義夫
秋山政憲
秋元豊
Original Assignee
開美科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 開美科技股份有限公司 filed Critical 開美科技股份有限公司
Publication of TW201737347A publication Critical patent/TW201737347A/zh
Application granted granted Critical
Publication of TWI648793B publication Critical patent/TWI648793B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW105132073A 2016-04-01 2016-10-04 Conductor forming device and conductor manufacturing method TWI648793B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2016/060872 WO2017168745A1 (ja) 2016-04-01 2016-04-01 導体形成装置及び導体製造方法
??PCT/JP2016/060872 2016-04-01

Publications (2)

Publication Number Publication Date
TW201737347A TW201737347A (zh) 2017-10-16
TWI648793B true TWI648793B (zh) 2019-01-21

Family

ID=59962782

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105132073A TWI648793B (zh) 2016-04-01 2016-10-04 Conductor forming device and conductor manufacturing method
TW107139032A TWI699833B (zh) 2016-04-01 2016-10-04 導體形成裝置及導體製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107139032A TWI699833B (zh) 2016-04-01 2016-10-04 導體形成裝置及導體製造方法

Country Status (4)

Country Link
JP (1) JPWO2017168745A1 (ja)
CN (1) CN107710888B (ja)
TW (2) TWI648793B (ja)
WO (1) WO2017168745A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041267A1 (en) * 2000-04-11 2001-11-15 Toshiba Tec Kabushiki Kaisha Process and apparatus for nickel plating and nickel-plated product
TW579306B (en) * 2002-01-28 2004-03-11 Tokyo Kakoki Co Ltd Substrate processing equipment
TW201246293A (en) * 2010-12-01 2012-11-16 Novellus Systems Inc Electroplating apparatus and process for wafer level packaging

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235506A (ja) * 1992-02-24 1993-09-10 Fujitsu Ltd プリント基板の製造方法
JP3296992B2 (ja) * 1996-09-27 2002-07-02 イビデン株式会社 多層プリント配線板の製造方法
JP4044722B2 (ja) * 2000-10-10 2008-02-06 上村工業株式会社 板状ワークの搬送方向変換装置
JP4677216B2 (ja) * 2004-10-25 2011-04-27 アルメックスＰｅ株式会社 平板形状物の表面処理装置
KR100794961B1 (ko) * 2006-07-04 2008-01-16 주식회사제4기한국 인쇄회로기판 제조용 ｐｓａｐ 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041267A1 (en) * 2000-04-11 2001-11-15 Toshiba Tec Kabushiki Kaisha Process and apparatus for nickel plating and nickel-plated product
TW579306B (en) * 2002-01-28 2004-03-11 Tokyo Kakoki Co Ltd Substrate processing equipment
TW201246293A (en) * 2010-12-01 2012-11-16 Novellus Systems Inc Electroplating apparatus and process for wafer level packaging

Also Published As

Publication number Publication date
JPWO2017168745A1 (ja) 2018-04-05
CN107710888A (zh) 2018-02-16
CN107710888B (zh) 2020-04-28
TW201907484A (zh) 2019-02-16
TWI699833B (zh) 2020-07-21
WO2017168745A1 (ja) 2017-10-05
TW201737347A (zh) 2017-10-16

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