TWI645578B - 發光裝置及發光裝置的製造方法 - Google Patents

發光裝置及發光裝置的製造方法 Download PDF

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Publication number
TWI645578B
TWI645578B TW102122519A TW102122519A TWI645578B TW I645578 B TWI645578 B TW I645578B TW 102122519 A TW102122519 A TW 102122519A TW 102122519 A TW102122519 A TW 102122519A TW I645578 B TWI645578 B TW I645578B
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layer
substrate
light
emitting device
manufacturing
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TW102122519A
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TW201409753A (zh
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平形吉晴
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半導體能源研究所股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40OLEDs integrated with touch screens
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/351Thickness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW102122519A 2012-07-05 2013-06-25 發光裝置及發光裝置的製造方法 TWI645578B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012151158 2012-07-05
JP2012-151158 2012-07-05

Publications (2)

Publication Number Publication Date
TW201409753A TW201409753A (zh) 2014-03-01
TWI645578B true TWI645578B (zh) 2018-12-21

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TW107134832A TWI669835B (zh) 2012-07-05 2013-06-25 發光裝置
TW102122519A TWI645578B (zh) 2012-07-05 2013-06-25 發光裝置及發光裝置的製造方法

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US (2) US9184211B2 (OSRAM)
JP (5) JP2014029853A (OSRAM)
KR (1) KR102091687B1 (OSRAM)
TW (2) TWI669835B (OSRAM)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102091687B1 (ko) 2012-07-05 2020-03-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 발광 장치의 제작 방법
KR102173801B1 (ko) * 2012-07-12 2020-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 및 표시 장치의 제작 방법
US11074025B2 (en) 2012-09-03 2021-07-27 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
KR102239367B1 (ko) 2013-11-27 2021-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 터치 패널
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2015125046A1 (en) * 2014-02-19 2015-08-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and peeling method
TWI656633B (zh) * 2014-02-28 2019-04-11 日商半導體能源研究所股份有限公司 顯示裝置的製造方法及電子裝置的製造方法
WO2015132698A1 (en) * 2014-03-06 2015-09-11 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
KR102292148B1 (ko) * 2014-03-13 2021-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치의 제작 방법, 및 전자 기기의 제작 방법
TWI764064B (zh) * 2014-03-13 2022-05-11 日商半導體能源研究所股份有限公司 撓性裝置
JP6468686B2 (ja) * 2014-04-25 2019-02-13 株式会社半導体エネルギー研究所 入出力装置
JP6596224B2 (ja) 2014-05-02 2019-10-23 株式会社半導体エネルギー研究所 発光装置及び入出力装置
JP2015228367A (ja) * 2014-05-02 2015-12-17 株式会社半導体エネルギー研究所 半導体装置、入出力装置、及び電子機器
US10073571B2 (en) 2014-05-02 2018-09-11 Semiconductor Energy Laboratory Co., Ltd. Touch sensor and touch panel including capacitor
JP6518133B2 (ja) * 2014-05-30 2019-05-22 株式会社半導体エネルギー研究所 入力装置
JP2016006640A (ja) * 2014-05-30 2016-01-14 株式会社半導体エネルギー研究所 検知器、入力装置、入出力装置
JP6425114B2 (ja) * 2014-07-02 2018-11-21 Tianma Japan株式会社 折り畳み式表示装置及び電気機器
JP6497858B2 (ja) * 2014-07-11 2019-04-10 株式会社ジャパンディスプレイ 有機el表示装置及び有機el表示装置の製造方法
CN110176482B (zh) 2014-07-25 2023-08-08 株式会社半导体能源研究所 显示装置及电子设备
KR102375250B1 (ko) * 2014-09-04 2022-03-15 엘지디스플레이 주식회사 터치 스크린 일체형 유기 발광 표시 장치 및 터치 스크린 일체형 유기 발광 표시 장치 제조 방법
KR102326807B1 (ko) * 2014-11-26 2021-11-15 엘지디스플레이 주식회사 유기발광표시장치 및 이의 제조방법
US10516118B2 (en) 2015-09-30 2019-12-24 Semiconductor Energy Laboratory Co., Ltd. Electronic device, display device, method for manufacturing the same, and system including a plurality of display devices
US10558265B2 (en) 2015-12-11 2020-02-11 Semiconductor Energy Laboratory Co., Ltd. Input device and system of input device
US10259207B2 (en) 2016-01-26 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming separation starting point and separation method
KR102465377B1 (ko) * 2016-02-12 2022-11-10 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2017152252A (ja) * 2016-02-25 2017-08-31 株式会社ジャパンディスプレイ 表示装置
JP6863803B2 (ja) 2016-04-07 2021-04-21 株式会社半導体エネルギー研究所 表示装置
KR102438255B1 (ko) 2017-05-31 2022-08-30 엘지디스플레이 주식회사 표시 장치
KR102467371B1 (ko) * 2017-11-09 2022-11-14 엘지디스플레이 주식회사 전계발광 표시장치 및 그 제조방법
US10437402B1 (en) 2018-03-27 2019-10-08 Shaoher Pan Integrated light-emitting pixel arrays based devices by bonding
US10325894B1 (en) 2018-04-17 2019-06-18 Shaoher Pan Integrated multi-color light-emitting pixel arrays based devices by bonding
KR102595915B1 (ko) 2018-06-18 2023-10-31 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JP7240624B2 (ja) * 2018-12-07 2023-03-16 大日本印刷株式会社 表示装置形成用基板、表示装置及び表示装置の製造方法
US11011669B2 (en) 2019-10-14 2021-05-18 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices
US10847083B1 (en) 2019-10-14 2020-11-24 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices by laser-assisted bonding
US20240090253A1 (en) * 2021-01-28 2024-03-14 Semiconductor Energy Laboratory Co., Ltd. Display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040645A1 (en) * 2000-02-01 2001-11-15 Shunpei Yamazaki Semiconductor device and manufacturing method thereof
US20100013745A1 (en) * 2008-07-21 2010-01-21 Kim Young-Dae Organic light emitting display device
US20110050657A1 (en) * 2009-08-25 2011-03-03 Seiko Epson Corporation Electro-optical device and electronic apparatus

Family Cites Families (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834327A (en) 1995-03-18 1998-11-10 Semiconductor Energy Laboratory Co., Ltd. Method for producing display device
US6956324B2 (en) 2000-08-04 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
US6739931B2 (en) 2000-09-18 2004-05-25 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating the display device
SG118118A1 (en) 2001-02-22 2006-01-27 Semiconductor Energy Lab Organic light emitting device and display using the same
TW546857B (en) 2001-07-03 2003-08-11 Semiconductor Energy Lab Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
TW564471B (en) 2001-07-16 2003-12-01 Semiconductor Energy Lab Semiconductor device and peeling off method and method of manufacturing semiconductor device
JP4027740B2 (ja) 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2003109773A (ja) 2001-07-27 2003-04-11 Semiconductor Energy Lab Co Ltd 発光装置、半導体装置およびそれらの作製方法
JP5057619B2 (ja) 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI264121B (en) 2001-11-30 2006-10-11 Semiconductor Energy Lab A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device
JP2003229548A (ja) * 2001-11-30 2003-08-15 Semiconductor Energy Lab Co Ltd 乗物、表示装置、および半導体装置の作製方法
JP2004140267A (ja) 2002-10-18 2004-05-13 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4693411B2 (ja) * 2002-10-30 2011-06-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4748986B2 (ja) 2002-11-01 2011-08-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20040099926A1 (en) 2002-11-22 2004-05-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and light-emitting device, and methods of manufacturing the same
JP2004174664A (ja) * 2002-11-27 2004-06-24 Fuji Photo Film Co Ltd ハードコートフィルムの切断方法、並びにハードコート処理物品およびその製造方法
KR100484109B1 (ko) * 2002-12-14 2005-04-18 삼성에스디아이 주식회사 기판 제조방법, 이 기판제조방법을 이용한 유기 전계발광표시장치의 제조방법 및 유기 전계 발광 표시장치
EP1434264A3 (en) 2002-12-27 2017-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using the transfer technique
JP4637588B2 (ja) * 2003-01-15 2011-02-23 株式会社半導体エネルギー研究所 表示装置の作製方法
TWI328837B (en) 2003-02-28 2010-08-11 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
EP1542272B1 (en) 2003-10-06 2016-07-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7084045B2 (en) 2003-12-12 2006-08-01 Seminconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4836445B2 (ja) * 2003-12-12 2011-12-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2005114749A1 (en) 2004-05-21 2005-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7307006B2 (en) 2005-02-28 2007-12-11 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
JP5200538B2 (ja) 2005-08-09 2013-06-05 旭硝子株式会社 薄板ガラス積層体及び薄板ガラス積層体を用いた表示装置の製造方法
KR101346241B1 (ko) 2005-11-29 2013-12-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 안테나 및 그의 제작방법, 안테나를 가지는 반도체장치 및그의 제작방법, 및 무선통신 시스템
US7727809B2 (en) 2006-05-31 2010-06-01 Semiconductor Energy Laboratory Co., Ltd. Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device
JP4866200B2 (ja) * 2006-10-05 2012-02-01 パナソニック株式会社 発光デバイスの製造方法
KR101447044B1 (ko) 2006-10-31 2014-10-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
US7924350B2 (en) 2007-10-12 2011-04-12 Au Optronics Corporation Capacitance type touch panel
US8119490B2 (en) 2008-02-04 2012-02-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
WO2010005064A1 (en) 2008-07-10 2010-01-14 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
KR102112799B1 (ko) 2008-07-10 2020-05-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 및 전자기기
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
US8494021B2 (en) 2008-08-29 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Organic laser device
JP2011003522A (ja) 2008-10-16 2011-01-06 Semiconductor Energy Lab Co Ltd フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法
JP2010153813A (ja) 2008-11-18 2010-07-08 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法、並びに、携帯電話機
KR101702329B1 (ko) 2008-12-17 2017-02-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
TWI631538B (zh) 2009-01-28 2018-08-01 日商半導體能源研究所股份有限公司 顯示裝置
JP5593630B2 (ja) * 2009-04-01 2014-09-24 セイコーエプソン株式会社 有機el装置および電子機器
JP2010244694A (ja) * 2009-04-01 2010-10-28 Seiko Epson Corp 有機el装置、電子機器
US8911653B2 (en) 2009-05-21 2014-12-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting device
KR101651206B1 (ko) 2009-05-26 2016-08-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Soi 기판의 제작 방법
SG176602A1 (en) 2009-06-24 2012-01-30 Semiconductor Energy Lab Method for reprocessing semiconductor substrate and method for manufacturing soi substrate
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
JP2011013511A (ja) * 2009-07-03 2011-01-20 Casio Computer Co Ltd 保護板付き電子部材
US8576209B2 (en) 2009-07-07 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device
WO2011024690A1 (ja) 2009-08-27 2011-03-03 旭硝子株式会社 フレキシブル基材-支持体の積層構造体、支持体付き電子デバイス用パネル、および電子デバイス用パネルの製造方法
JP5562597B2 (ja) 2009-08-28 2014-07-30 荒川化学工業株式会社 支持体、ガラス基板積層体、支持体付き表示装置用パネル、および表示装置用パネルの製造方法
KR102009813B1 (ko) 2009-09-16 2019-08-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 이의 제조 방법
JP2011075809A (ja) * 2009-09-30 2011-04-14 Toppan Printing Co Ltd 液晶表示パネル
WO2011043178A1 (en) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Reprocessing method of semiconductor substrate, manufacturing method of reprocessed semiconductor substrate, and manufacturing method of soi substrate
JP5418130B2 (ja) * 2009-10-15 2014-02-19 大日本印刷株式会社 静電容量式タッチパネルセンサおよび当該タッチパネルセンサの製造方法
JP4992958B2 (ja) * 2009-11-30 2012-08-08 カシオ計算機株式会社 板状部材接合体の製造方法、及び、透明基板付き電子部材の製造方法
US9000442B2 (en) 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
KR20150010776A (ko) * 2010-02-05 2015-01-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 및 반도체 장치의 제조 방법
JP5430470B2 (ja) * 2010-03-31 2014-02-26 株式会社半導体エネルギー研究所 発光装置、及びその作製方法
US8507322B2 (en) 2010-06-24 2013-08-13 Akihiro Chida Semiconductor substrate and method for manufacturing semiconductor device
KR101845480B1 (ko) 2010-06-25 2018-04-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP5858915B2 (ja) * 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話
KR101692896B1 (ko) * 2010-10-25 2017-01-05 엘지디스플레이 주식회사 터치인식 유기전계 발광소자
KR101778229B1 (ko) 2010-10-29 2017-09-14 삼성디스플레이 주식회사 유기 발광 표시 장치
US8669702B2 (en) 2010-11-19 2014-03-11 Semiconductor Energy Laboratory Co., Ltd. Lighting device
KR101521114B1 (ko) * 2010-12-03 2015-05-19 엘지디스플레이 주식회사 유기전계발광 표시장치 및 그 제조 방법
US8772795B2 (en) 2011-02-14 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and lighting device
US9781783B2 (en) 2011-04-15 2017-10-03 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, light-emitting system, and display system
KR20120123963A (ko) * 2011-05-02 2012-11-12 엘지전자 주식회사 디스플레이 모듈 및 이를 구비한 이동 단말기
US8711292B2 (en) * 2011-11-22 2014-04-29 Atmel Corporation Integrated touch screen
KR101472806B1 (ko) * 2012-01-30 2014-12-15 삼성디스플레이 주식회사 터치 패널 및 터치 패널을 포함하는 표시 장치
KR102091687B1 (ko) 2012-07-05 2020-03-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 발광 장치의 제작 방법
KR102173801B1 (ko) 2012-07-12 2020-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 및 표시 장치의 제작 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040645A1 (en) * 2000-02-01 2001-11-15 Shunpei Yamazaki Semiconductor device and manufacturing method thereof
US20100013745A1 (en) * 2008-07-21 2010-01-21 Kim Young-Dae Organic light emitting display device
US20110050657A1 (en) * 2009-08-25 2011-03-03 Seiko Epson Corporation Electro-optical device and electronic apparatus

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US20140008668A1 (en) 2014-01-09
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JP2014029853A (ja) 2014-02-13
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