TWI641122B - Camera element - Google Patents

Camera element Download PDF

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Publication number
TWI641122B
TWI641122B TW103137935A TW103137935A TWI641122B TW I641122 B TWI641122 B TW I641122B TW 103137935 A TW103137935 A TW 103137935A TW 103137935 A TW103137935 A TW 103137935A TW I641122 B TWI641122 B TW I641122B
Authority
TW
Taiwan
Prior art keywords
layer
infrared absorbing
refractive index
infrared
photoelectric conversion
Prior art date
Application number
TW103137935A
Other languages
English (en)
Chinese (zh)
Other versions
TW201523856A (zh
Inventor
木村望
今泉伸治
Original Assignee
日商新力股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新力股份有限公司 filed Critical 日商新力股份有限公司
Publication of TW201523856A publication Critical patent/TW201523856A/zh
Application granted granted Critical
Publication of TWI641122B publication Critical patent/TWI641122B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/22Absorbing filters
    • G02B5/223Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/26Reflecting filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/10Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices being sensitive to infrared radiation, visible or ultraviolet radiation, and having no potential barriers, e.g. photoresistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW103137935A 2013-11-26 2014-10-31 Camera element TWI641122B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-244424 2013-11-26
JP2013244424 2013-11-26
JP2014-085056 2014-04-16
JP2014085056A JP6281395B2 (ja) 2013-11-26 2014-04-16 撮像素子

Publications (2)

Publication Number Publication Date
TW201523856A TW201523856A (zh) 2015-06-16
TWI641122B true TWI641122B (zh) 2018-11-11

Family

ID=53198631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103137935A TWI641122B (zh) 2013-11-26 2014-10-31 Camera element

Country Status (5)

Country Link
US (1) US9991304B2 (enExample)
EP (1) EP3076432A4 (enExample)
JP (1) JP6281395B2 (enExample)
TW (1) TWI641122B (enExample)
WO (1) WO2015079662A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11625943B2 (en) 2021-08-13 2023-04-11 Au Optronics Corporation Fingerprint sensing apparatus

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102305998B1 (ko) * 2014-12-08 2021-09-28 엘지이노텍 주식회사 영상 처리 장치
WO2016189789A1 (ja) * 2015-05-27 2016-12-01 ソニー株式会社 撮像素子
JP6893757B2 (ja) * 2015-08-18 2021-06-23 凸版印刷株式会社 固体撮像素子及びその製造方法
EP3358618B1 (en) * 2015-09-29 2021-08-11 Dai Nippon Printing Co., Ltd. Imaging module and imaging device
US10056417B2 (en) 2016-03-10 2018-08-21 Visera Technologies Company Limited Image-sensor structures
CN109154555A (zh) * 2016-04-27 2019-01-04 凸版印刷株式会社 反应容器及生物化学分析方法
JP6991706B2 (ja) * 2016-11-30 2022-02-03 キヤノン株式会社 光学素子およびそれを有する光学系
CN111937152A (zh) * 2018-04-11 2020-11-13 索尼半导体解决方案公司 摄像器件和摄像器件的制造方法
US11069729B2 (en) * 2018-05-01 2021-07-20 Canon Kabushiki Kaisha Photoelectric conversion device, and equipment
JP7134763B2 (ja) * 2018-07-23 2022-09-12 キヤノン株式会社 モジュール及びその製造方法
KR102796166B1 (ko) 2019-04-16 2025-04-14 삼성전자주식회사 근적외선 흡수 조성물, 광학 구조체, 및 이를 포함하는 카메라 모듈 및 전자 장치
JP7061647B2 (ja) * 2020-08-07 2022-04-28 東京応化工業株式会社 固体撮像素子の製造方法、積層体、及びドライフィルム
CN114038343A (zh) * 2021-07-20 2022-02-11 重庆康佳光电技术研究院有限公司 一种显示屏及终端
JP2023127332A (ja) * 2022-03-01 2023-09-13 ソニーセミコンダクタソリューションズ株式会社 光検出装置及び電子機器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003244560A (ja) * 2002-02-21 2003-08-29 Seiko Precision Inc 固体撮像装置
US20040185588A1 (en) * 2002-07-09 2004-09-23 Toppan Printing Co., Ltd. Solid-state imaging device and manufacturing method therefor
JP2007277502A (ja) * 2006-03-13 2007-10-25 Soken Chem & Eng Co Ltd 耐黄変性樹脂およびその用途
JP2011176325A (ja) * 2011-03-22 2011-09-08 Sony Corp 固体撮像装置及び電子機器
JP2013155353A (ja) * 2012-01-31 2013-08-15 Fujifilm Corp 赤外線吸収性液状組成物、これを用いた赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254579A (ja) * 1986-04-28 1987-11-06 Toshiba Corp 固体撮像装置
JPH06232379A (ja) * 1993-02-01 1994-08-19 Sharp Corp 固体撮像素子
JP4882182B2 (ja) * 2001-08-08 2012-02-22 凸版印刷株式会社 固体撮像素子
JP2003163339A (ja) * 2001-11-27 2003-06-06 Kyocera Corp 撮像素子収納用パッケージ
JP2004200360A (ja) 2002-12-18 2004-07-15 Toppan Printing Co Ltd 固体撮像素子及びその製造方法
JP4471275B2 (ja) * 2003-11-26 2010-06-02 株式会社シード 近赤外線吸収組成物及び近赤外線吸収フィルター
JP4844016B2 (ja) * 2005-06-03 2011-12-21 大日本印刷株式会社 カラーフィルタおよびその製造方法
JP4923456B2 (ja) * 2005-07-11 2012-04-25 ソニー株式会社 固体撮像装置およびその製造方法、並びにカメラ
JP2007141876A (ja) 2005-11-14 2007-06-07 Sony Corp 半導体撮像装置及びその製造方法
WO2007088839A1 (ja) * 2006-01-31 2007-08-09 Toyo Boseki Kabushiki Kaisha 近赤外線吸収フィルム
JP2007242877A (ja) * 2006-03-08 2007-09-20 Sony Corp 固体撮像素子
JP2008305972A (ja) * 2007-06-07 2008-12-18 Panasonic Corp 光学デバイス及びその製造方法、並びに、光学デバイスを用いたカメラモジュール及び該カメラモジュールを搭載した電子機器
US8395686B2 (en) * 2007-12-06 2013-03-12 Sony Corporation Solid-state imaging device, method of manufacturing the same, and camera
WO2011074371A1 (ja) * 2009-12-18 2011-06-23 株式会社カネカ 近赤外線吸収材料及びその製造方法
EP2584385A4 (en) * 2010-06-18 2014-02-26 Daishinku Corp INFRARED BARRIER FILTER
JP2012064824A (ja) * 2010-09-17 2012-03-29 Toshiba Corp 固体撮像素子、その製造方法、カメラ
TWI513780B (zh) * 2010-12-31 2015-12-21 Eternal Materials Co Ltd 塗料組成物及其用途
US8872293B2 (en) * 2011-02-15 2014-10-28 Sony Corporation Solid-state imaging device and method of manufacturing the same and electronic apparatus
JP5703825B2 (ja) * 2011-02-22 2015-04-22 ソニー株式会社 撮像装置およびカメラモジュール
WO2012169447A1 (ja) * 2011-06-06 2012-12-13 旭硝子株式会社 光学フィルタ、固体撮像素子、撮像装置用レンズおよび撮像装置
JP5976523B2 (ja) * 2011-12-28 2016-08-23 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子
JP5824386B2 (ja) * 2012-02-29 2015-11-25 富士フイルム株式会社 赤外線吸収性組成物および赤外線カットフィルタ
CN104755969B (zh) * 2012-08-23 2018-06-08 旭硝子株式会社 近红外线截止滤波器和固体摄像装置
JPWO2014061188A1 (ja) * 2012-10-17 2016-09-05 ソニー株式会社 撮像素子及び撮像装置
JP6302650B2 (ja) * 2012-11-30 2018-03-28 富士フイルム株式会社 硬化性樹脂組成物、これを用いた、色素含有層の形成方法、イメージセンサチップの製造方法及びイメージセンサチップ
KR20150090142A (ko) * 2012-12-28 2015-08-05 후지필름 가부시키가이샤 적외선 반사막 형성용의 경화성 수지 조성물, 적외선 반사막과 그 제조 방법, 적외선 차단 필터, 및 이것을 이용한 고체 촬상 소자
TW201600574A (zh) * 2014-06-30 2016-01-01 Fujifilm Corp 近紅外線吸收性組成物、近紅外線截止濾波器、近紅外線截止濾波器的製造方法、固體攝像元件、照相機模組
US10056417B2 (en) * 2016-03-10 2018-08-21 Visera Technologies Company Limited Image-sensor structures

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003244560A (ja) * 2002-02-21 2003-08-29 Seiko Precision Inc 固体撮像装置
US20030164891A1 (en) * 2002-02-21 2003-09-04 Kazuo Akimoto Solidstate image-taking apparatus and laminated chip for use therewith
US20040185588A1 (en) * 2002-07-09 2004-09-23 Toppan Printing Co., Ltd. Solid-state imaging device and manufacturing method therefor
JP2007277502A (ja) * 2006-03-13 2007-10-25 Soken Chem & Eng Co Ltd 耐黄変性樹脂およびその用途
JP2011176325A (ja) * 2011-03-22 2011-09-08 Sony Corp 固体撮像装置及び電子機器
JP2013155353A (ja) * 2012-01-31 2013-08-15 Fujifilm Corp 赤外線吸収性液状組成物、これを用いた赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11625943B2 (en) 2021-08-13 2023-04-11 Au Optronics Corporation Fingerprint sensing apparatus

Also Published As

Publication number Publication date
WO2015079662A1 (ja) 2015-06-04
JP6281395B2 (ja) 2018-02-21
EP3076432A4 (en) 2017-11-01
TW201523856A (zh) 2015-06-16
EP3076432A1 (en) 2016-10-05
US9991304B2 (en) 2018-06-05
US20160293650A1 (en) 2016-10-06
JP2015128127A (ja) 2015-07-09

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