TWI635561B - 半導體製造裝置 - Google Patents

半導體製造裝置 Download PDF

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Publication number
TWI635561B
TWI635561B TW105120354A TW105120354A TWI635561B TW I635561 B TWI635561 B TW I635561B TW 105120354 A TW105120354 A TW 105120354A TW 105120354 A TW105120354 A TW 105120354A TW I635561 B TWI635561 B TW I635561B
Authority
TW
Taiwan
Prior art keywords
substrate
jig
heating plate
protruding portion
region
Prior art date
Application number
TW105120354A
Other languages
English (en)
Chinese (zh)
Other versions
TW201729326A (zh
Inventor
脇岡寬之
Original Assignee
東芝記憶體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝記憶體股份有限公司 filed Critical 東芝記憶體股份有限公司
Publication of TW201729326A publication Critical patent/TW201729326A/zh
Application granted granted Critical
Publication of TWI635561B publication Critical patent/TWI635561B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW105120354A 2015-11-12 2016-06-28 半導體製造裝置 TWI635561B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015222346A JP2017092313A (ja) 2015-11-12 2015-11-12 半導体製造装置。
JP2015-222346 2015-11-12

Publications (2)

Publication Number Publication Date
TW201729326A TW201729326A (zh) 2017-08-16
TWI635561B true TWI635561B (zh) 2018-09-11

Family

ID=58771084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105120354A TWI635561B (zh) 2015-11-12 2016-06-28 半導體製造裝置

Country Status (3)

Country Link
JP (1) JP2017092313A (ja)
CN (1) CN106711064B (ja)
TW (1) TWI635561B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101933807B1 (ko) * 2017-11-29 2018-12-28 캐논 톡키 가부시키가이샤 성막장치 및 이를 사용한 유기 el 표시장치의 제조방법
CN110216605A (zh) * 2019-05-21 2019-09-10 深圳市宏普欣电子科技有限公司 一种通用型治具
JP2022011530A (ja) * 2020-06-30 2022-01-17 キヤノン株式会社 物品の製造装置、物品の製造方法
JP2022013070A (ja) * 2020-07-03 2022-01-18 キヤノン株式会社 物品の製造装置、物品の製造方法、プログラム、記録媒体
WO2022004170A1 (ja) * 2020-07-03 2022-01-06 キヤノン株式会社 物品の製造装置、物品の製造方法、プログラム、記録媒体
CN113387132B (zh) * 2021-05-12 2023-09-12 合肥欣奕华智能机器股份有限公司 一种基板作业平台及基板作业平台的控制方法
CN113927605B (zh) * 2021-12-13 2022-05-06 肇庆本田金属有限公司 一种盐芯夹放装置及控制方法、机器人
JP7560906B1 (ja) 2023-10-31 2024-10-03 株式会社新川 ボンディング装置、方法、及びプログラム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201201265A (en) * 2010-04-23 2012-01-01 Shibaura Mechatronics Corp Manufacturing apparatus of semiconductor device
TW201517087A (zh) * 2013-08-20 2015-05-01 Murata Manufacturing Co 端子接合裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539807Y2 (ja) * 1991-02-06 1997-07-02 日本電気株式会社 ワイヤーボンダにおけるリードフレーム押さえ機構
TW569062B (en) * 2001-12-25 2004-01-01 Toshiba Corp Thermal bonding device and method
JP4064808B2 (ja) * 2001-12-25 2008-03-19 東芝松下ディスプレイテクノロジー株式会社 熱圧着装置及び熱圧着方法
JP2005281746A (ja) * 2004-03-29 2005-10-13 Seiko Epson Corp 蒸着装置、蒸着方法、電気光学装置、および電子機器
JP2007329283A (ja) * 2006-06-07 2007-12-20 Shinkawa Ltd ワイヤボンディング装置における湾曲回路基板の固定方法及びプログラム
JP2008192743A (ja) * 2007-02-02 2008-08-21 Shinkawa Ltd ボンディング装置における湾曲回路基板の吸着方法及びプログラム並びにボンディング装置
KR20090009497A (ko) * 2007-07-20 2009-01-23 한미반도체 주식회사 반도체 패키지 제조장치의 기판 반송용 워크테이블
JP2010093072A (ja) * 2008-10-08 2010-04-22 Shinkawa Ltd 吸着装置及び吸着方法
JP5542583B2 (ja) * 2010-08-26 2014-07-09 リンテック株式会社 シート貼付装置および貼付方法
JP2012250230A (ja) * 2011-06-02 2012-12-20 Tokyo Ohka Kogyo Co Ltd 加熱装置、塗布装置及び加熱方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201201265A (en) * 2010-04-23 2012-01-01 Shibaura Mechatronics Corp Manufacturing apparatus of semiconductor device
TW201517087A (zh) * 2013-08-20 2015-05-01 Murata Manufacturing Co 端子接合裝置

Also Published As

Publication number Publication date
TW201729326A (zh) 2017-08-16
CN106711064B (zh) 2019-09-06
CN106711064A (zh) 2017-05-24
JP2017092313A (ja) 2017-05-25

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