TWI626868B - Laminated resin structure, dry film and flexible printed circuit board - Google Patents
Laminated resin structure, dry film and flexible printed circuit board Download PDFInfo
- Publication number
- TWI626868B TWI626868B TW103114685A TW103114685A TWI626868B TW I626868 B TWI626868 B TW I626868B TW 103114685 A TW103114685 A TW 103114685A TW 103114685 A TW103114685 A TW 103114685A TW I626868 B TWI626868 B TW I626868B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- resin structure
- adhesive layer
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 80
- 239000011347 resin Substances 0.000 title claims abstract description 80
- 239000003086 colorant Substances 0.000 claims abstract description 77
- 239000012790 adhesive layer Substances 0.000 claims abstract description 52
- 239000011241 protective layer Substances 0.000 claims abstract description 41
- 230000001681 protective effect Effects 0.000 claims abstract description 26
- 239000011342 resin composition Substances 0.000 claims description 75
- 239000010410 layer Substances 0.000 claims description 31
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 29
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 28
- 239000003960 organic solvent Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 abstract description 11
- 238000009413 insulation Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 53
- 239000000049 pigment Substances 0.000 description 29
- 239000000203 mixture Substances 0.000 description 26
- 229920001187 thermosetting polymer Polymers 0.000 description 26
- 238000000034 method Methods 0.000 description 25
- 239000003999 initiator Substances 0.000 description 20
- 239000000126 substance Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 230000015556 catabolic process Effects 0.000 description 9
- 230000000295 complement effect Effects 0.000 description 9
- 238000000576 coating method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 6
- 150000004056 anthraquinones Chemical class 0.000 description 6
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000000038 blue colorant Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 4
- 239000001062 red colorant Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000001060 yellow colorant Substances 0.000 description 4
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 239000000040 green colorant Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000009877 rendering Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical compound C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 2
- -1 diazonaphthoquinone compound Chemical class 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 2
- 239000001061 orange colorant Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- KTEFLEFPDDQMCB-UHFFFAOYSA-N 1,4-bis(4-butylanilino)-5,8-dihydroxyanthracene-9,10-dione Chemical compound C1=CC(CCCC)=CC=C1NC(C=1C(=O)C2=C(O)C=CC(O)=C2C(=O)C=11)=CC=C1NC1=CC=C(CCCC)C=C1 KTEFLEFPDDQMCB-UHFFFAOYSA-N 0.000 description 1
- OZQQAZPMNWJRDQ-UHFFFAOYSA-N 1,4-dihydroxy-5,8-bis(4-methylanilino)anthracene-9,10-dione Chemical compound C1=CC(C)=CC=C1NC(C=1C(=O)C2=C(O)C=CC(O)=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1 OZQQAZPMNWJRDQ-UHFFFAOYSA-N 0.000 description 1
- FWTBRYBHCBCJEQ-UHFFFAOYSA-N 4-[(4-phenyldiazenylnaphthalen-1-yl)diazenyl]phenol Chemical compound C1=CC(O)=CC=C1N=NC(C1=CC=CC=C11)=CC=C1N=NC1=CC=CC=C1 FWTBRYBHCBCJEQ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- YLNJGHNUXCVDIX-UHFFFAOYSA-N bis(2-methylpropyl) perylene-3,9-dicarboxylate Chemical compound C=12C3=CC=CC2=C(C(=O)OCC(C)C)C=CC=1C1=CC=CC2=C1C3=CC=C2C(=O)OCC(C)C YLNJGHNUXCVDIX-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- NNLOHLDVJGPUFR-UHFFFAOYSA-L calcium;3,4,5,6-tetrahydroxy-2-oxohexanoate Chemical compound [Ca+2].OCC(O)C(O)C(O)C(=O)C([O-])=O.OCC(O)C(O)C(O)C(=O)C([O-])=O NNLOHLDVJGPUFR-UHFFFAOYSA-L 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- KJOLVZJFMDVPGB-UHFFFAOYSA-N perylenediimide Chemical compound C=12C3=CC=C(C(NC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)NC(=O)C4=CC=C3C1=C42 KJOLVZJFMDVPGB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 1
- TVRGPOFMYCMNRB-UHFFFAOYSA-N quinizarine green ss Chemical compound C1=CC(C)=CC=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1 TVRGPOFMYCMNRB-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013091093 | 2013-04-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201513757A TW201513757A (zh) | 2015-04-01 |
| TWI626868B true TWI626868B (zh) | 2018-06-11 |
Family
ID=51791832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103114685A TWI626868B (zh) | 2013-04-24 | 2014-04-23 | Laminated resin structure, dry film and flexible printed circuit board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6062037B2 (ko) |
| KR (1) | KR102211561B1 (ko) |
| CN (1) | CN105144854B (ko) |
| TW (1) | TWI626868B (ko) |
| WO (1) | WO2014175260A1 (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3040516B1 (fr) * | 2015-08-27 | 2017-09-15 | Linxens Holding | Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique |
| EP3398202B1 (en) | 2015-12-30 | 2023-08-09 | FujiFilm Electronic Materials USA, Inc. | Photosensitive stacked structure |
| CN107529283A (zh) * | 2016-06-21 | 2017-12-29 | 欣兴同泰科技（昆山）有限公司 | 柔性线路板的生产工艺 |
| CN105977170B (zh) | 2016-07-01 | 2018-06-05 | 京东方科技集团股份有限公司 | 布线保护膜层的贴附方法及布线结构、显示面板 |
| CN108504294A (zh) * | 2017-02-24 | 2018-09-07 | 昆山雅森电子材料科技有限公司 | 一种高频有色超薄覆盖膜及制备方法 |
| WO2019194208A1 (ja) * | 2018-04-04 | 2019-10-10 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板用カバーフィルム及びフレキシブルプリント配線板 |
| JP7283278B2 (ja) * | 2019-07-17 | 2023-05-30 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| CN110471203B (zh) * | 2019-08-05 | 2022-06-07 | Oppo（重庆）智能科技有限公司 | 显示装置及电子设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201007356A (en) * | 2008-03-26 | 2010-02-16 | Taiyo Ink Mfg Co Ltd | Photocurable resin composition, dry film and cured object thereof, and printed circuit board with the same |
| TW201204785A (en) * | 2010-05-31 | 2012-02-01 | Arisawa Seisakusho Kk | Composition for polyimid resin and polyimid resin made from the composition for polyimid resin |
| TW201247603A (en) * | 2011-03-04 | 2012-12-01 | Toyo Ink Sc Holdings Co Ltd | β -hydroxylalkyl amide and resin composition |
| JP2013028767A (ja) * | 2011-07-29 | 2013-02-07 | Kaneka Corp | 絶縁性黒色ポリイミドフィルム、カバーレイフィルム及びフレキシブルプリント配線板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS479326Y1 (ko) | 1968-04-05 | 1972-04-08 | ||
| JPH09135067A (ja) * | 1995-09-08 | 1997-05-20 | Shin Etsu Chem Co Ltd | 遮光性カバーレイフィルム |
| JP5211307B2 (ja) * | 2011-03-04 | 2013-06-12 | 東洋インキＳｃホールディングス株式会社 | 感光性組成物 |
| JP5952078B2 (ja) * | 2011-06-23 | 2016-07-13 | 日東電工株式会社 | 導電性熱硬化型接着テープ |
-
2014
- 2014-04-22 WO PCT/JP2014/061273 patent/WO2014175260A1/ja active Application Filing
- 2014-04-22 KR KR1020157027864A patent/KR102211561B1/ko active IP Right Grant
- 2014-04-22 JP JP2015506965A patent/JP6062037B2/ja active Active
- 2014-04-22 CN CN201480022938.1A patent/CN105144854B/zh active Active
- 2014-04-23 TW TW103114685A patent/TWI626868B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201007356A (en) * | 2008-03-26 | 2010-02-16 | Taiyo Ink Mfg Co Ltd | Photocurable resin composition, dry film and cured object thereof, and printed circuit board with the same |
| TW201204785A (en) * | 2010-05-31 | 2012-02-01 | Arisawa Seisakusho Kk | Composition for polyimid resin and polyimid resin made from the composition for polyimid resin |
| TW201247603A (en) * | 2011-03-04 | 2012-12-01 | Toyo Ink Sc Holdings Co Ltd | β -hydroxylalkyl amide and resin composition |
| JP2013028767A (ja) * | 2011-07-29 | 2013-02-07 | Kaneka Corp | 絶縁性黒色ポリイミドフィルム、カバーレイフィルム及びフレキシブルプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102211561B1 (ko) | 2021-02-03 |
| WO2014175260A1 (ja) | 2014-10-30 |
| CN105144854B (zh) | 2019-02-05 |
| CN105144854A (zh) | 2015-12-09 |
| JP6062037B2 (ja) | 2017-01-18 |
| KR20160002748A (ko) | 2016-01-08 |
| JPWO2014175260A1 (ja) | 2017-02-23 |
| TW201513757A (zh) | 2015-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI626868B (zh) | Laminated resin structure, dry film and flexible printed circuit board | |
| TWI525390B (zh) | Black hardening resin composition | |
| US9188871B2 (en) | Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof | |
| US6190833B1 (en) | Radiation-sensitive resin composition | |
| CA2427923A1 (en) | Positive type photosensitive epoxy resin composition and printed circuit board using the same | |
| KR20170122130A (ko) | 착색 경화막의 제조 방법 및 컬러 필터의 화소 패턴의 형성 방법 | |
| JP6359814B2 (ja) | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 | |
| TW200712773A (en) | Negative photosensitive resin composite, method of forming pattern and electronic component | |
| KR20140148400A (ko) | 감광성 도전 페이스트 및 도전 패턴의 제조 방법 | |
| TW202044949A (zh) | 積層構造體、乾膜、其硬化物及電子零件 | |
| JPWO2007023834A1 (ja) | 接着剤組成物 | |
| TWI608300B (zh) | Photosensitive resin composition | |
| JP2011215597A (ja) | 感放射線性組成物、絶縁膜の形成方法、絶縁膜及び固体撮像素子 | |
| WO2015052978A1 (ja) | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 | |
| US10198139B2 (en) | Method of producing touch sensor member, and touch sensor member | |
| JPWO2017057431A1 (ja) | 硬化性樹脂組成物、ドライフィルムおよびそれを用いたプリント配線板 | |
| KR102546656B1 (ko) | 안료-염료 분산체, 이 분산체로부터 제조되는 녹색 컬러필터 및 디스플레이 장치 | |
| JPH11106606A (ja) | 感放射線性樹脂組成物 | |
| WO2018070489A1 (ja) | 感光性エレメント、半導体装置、及びレジストパターンの形成方法 | |
| WO2018164233A1 (ja) | 感光性エレメント、半導体装置及びレジストパターンの形成方法 | |
| WO2023191037A1 (ja) | 積層硬化体、これを備えるプリント配線板、および積層硬化体の製造方法 | |
| JP3792871B2 (ja) | 樹脂組成物及びその硬化物 | |
| JP7468282B2 (ja) | 感光性樹脂組成物 | |
| JP2007109934A (ja) | 電子部品及びその製造方法 | |
| JP2000169550A (ja) | 樹脂組成物及びその硬化物 |