CN108504294A - 一种高频有色超薄覆盖膜及制备方法 - Google Patents

一种高频有色超薄覆盖膜及制备方法 Download PDF

Info

Publication number
CN108504294A
CN108504294A CN201710102125.9A CN201710102125A CN108504294A CN 108504294 A CN108504294 A CN 108504294A CN 201710102125 A CN201710102125 A CN 201710102125A CN 108504294 A CN108504294 A CN 108504294A
Authority
CN
China
Prior art keywords
low dielectric
line
ink layer
resin
pigmented ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710102125.9A
Other languages
English (en)
Inventor
李韦志
杨立志
李建辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Electronic Material Co Ltd
Original Assignee
Asia Electronic Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Electronic Material Co Ltd filed Critical Asia Electronic Material Co Ltd
Priority to CN201710102125.9A priority Critical patent/CN108504294A/zh
Priority to TW106130143A priority patent/TWI671204B/zh
Priority to US15/841,448 priority patent/US11116074B2/en
Priority to KR1020170177473A priority patent/KR102079309B1/ko
Priority to JP2018030579A priority patent/JP2018140628A/ja
Publication of CN108504294A publication Critical patent/CN108504294A/zh
Priority to JP2020008223A priority patent/JP7179789B2/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/242—All polymers belonging to those covered by group B32B27/32
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/244—All polymers belonging to those covered by group B32B27/36
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4023—Coloured on the layer surface, e.g. ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Adhesive Tapes (AREA)

Abstract

本发明公开了一种高频有色超薄覆盖膜及制备方法，包括上离型层、有色油墨层、低介电胶层和下离型层，所述有色油墨层位于所述上离型层和所述低介电胶层之间，所述低介电胶层位于所述有色油墨层和所述下离型层之间；所述有色油墨层和所述低介电胶层两者的厚度之和为4‑35μm，其中，所述有色油墨层的厚度为1‑10μm，所述低介电胶层的厚度为3‑25μm。本发明的制造方法简单，且具有极低的介电常数与损耗、极低的离子迁移性、良好的接着力、高散热性、高柔软性和低反弹力，可低温加工，特别适合在当前线宽线距低于35/35μm的高密度组装之高频高速、超细线化线路中使用。

Description

一种高频有色超薄覆盖膜及制备方法
技术领域
本发明属于FPC(印刷电路板)用覆盖膜技术领域，特别是涉及一种高频有色超薄覆盖膜。
背景技术
目前电子系统朝向轻薄短小、高耐热性、多功能性、高密度化、高可靠性且低成本的方向发展，而在功能上，则需要强大且高速讯号传输。在高频领域，无线基础设施需要提供足够低的插损、更低的介电常数与损耗，才能有效提高能源利用率。随着5G时代与USB3.1等应用需求来临，射频产品需要提供更宽的带宽，并且向下兼容3G、4G业务。当前市面上的覆盖膜的材料常见的是使用黑色聚酰亚胺薄膜，在薄型化的设计上，其瓶颈之处在于黑色聚酰亚胺做出5μm以下的厚度具有巨大困难且加工操作性不好，且使用环氧树脂系的接着剂其离子纯度不佳、电性不良、成本高昂，这些都使得覆盖膜难以应对当前超细线化线路和高频高速传输的趋势。而另一种油墨型的有色高频覆盖膜，是使用5-7.5μm黄色超薄聚酰亚胺薄膜涂布有色油墨，此方法也一样有成本高、厚度较大的问题。
有鉴于此，有业者研发一种覆盖膜，能够满足目前细线化线路的设计，并满足其高耐热性、多功能性、高密度化、高可靠性且低成本的发展方向，以及在功能上需要强大且高速讯号传输的需求。
发明内容
本发明主要解决的技术问题是提供一种高频有色超薄覆盖膜及制备方法，本发明的制造方法简单，且具有极低的介电常数与损耗、极低的离子迁移性、良好的接着力、高散热性、高柔软性和低反弹力，可低温加工，特别适合在当前线宽线距低于35/35μm的高密度组装之高频高速、超细线化线路中使用。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种高频有色超薄覆盖膜，包括上离型层、有色油墨层、低介电胶层和下离型层，所述有色油墨层位于所述上离型层和所述低介电胶层之间，所述低介电胶层位于所述有色油墨层和所述下离型层之间；
所述有色油墨层和所述低介电胶层两者的厚度之和为4-35μm，其中，所述有色油墨层的厚度为1-10μm，所述低介电胶层的厚度为3-25μm。
进一步地说，所述低介电胶层是Dk值为2.4-2.8(10GHz)、Df值为0.002-0.006(10GHz)、吸水率介于0.05-0.2％、线间绝缘阻抗大于1011Ω、表面电阻大于1012Ω且体积电阻大于1013Ω·cm的胶层。
进一步地说，所述低介电胶层的树脂材料为氟系树脂、环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和低介电聚酰亚胺树脂中的至少一种。
进一步地说，所述极低介电胶层包括烧结二氧化硅、铁氟龙、氟系树脂、磷系耐燃剂和低介电聚酰亚胺树脂，且所述烧结二氧化硅、所述铁氟龙、所述氟系树脂和所述磷系耐燃剂的比例之和为总固含量的8-50％(重量百分比)，所述低介电聚酰亚胺系树脂含量的比例为40％-90％(重量百分比)。
进一步地说，所述有色油墨层的树脂材料为环氧树脂、丙烯酸系树脂、氨基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和聚酰亚胺树脂中的至少一种。
进一步地说，所述上离型层和所述下离型层皆为聚丙烯、双向拉伸聚丙烯和聚对苯二甲酸乙二醇酯中的至少一种构成的离型膜或离型纸。
进一步地说，所述烧结二氧化硅的比例为总固含量的2-15％(重量百分比)，所述铁氟龙的比例为总固含量的2-10％(重量百分比)，所述氟系树脂的比例为总固含量的2-10％(重量百分比)，所述磷系耐燃剂的比例为总固含量的2-15％(重量百分比)。
进一步地说，所述有色油墨层包括无机颜料或有机颜料，其中，所述无机颜料为镉红、镉柠檬黄、橘镉黄、二氧化钛、碳黑、黑色氧化铁或黑色错合无机颜料，所述有机颜料为苯胺黑、苝黑、蒽醌黑、联苯胺类黄色颜料、酞青蓝或酞青绿。
进一步地说，所述有色油墨层的厚度为3-5μm，所述低介电胶层的厚度为3-10μm。
所述的一种高频有色超薄覆盖膜的制备方法，包括下述步骤：
步骤一、在上离型层的下表面涂布有色油墨原料，50～180℃低温下固化形成有色油墨层；
步骤二、用涂布法或转印法将低介电胶层形成于有色油墨层的下表面；
步骤三、将下离型层贴覆于低介电胶层的下表面，即得成品。
本发明的有益效果是：本发明包括上离型层、有色油墨层、低介电胶层和下离型层共四层，结构合理，故本发明至少具有以下优点：
一、本发明采用低介电胶层，低介电较层的Dk(介电常数)值为2.4-2.8且Df(介电损耗因子)值为0.002-0.006，Dk/Df值较低，可减少信号传输过程中的损耗，进一步提高信号传输质量，完全能胜任FPC高频高速化、散热导热快速化以及生产成本最低化发展的需求；
二、本发明低介电胶层的配方中含有烧结二氧化硅、铁氟龙、氟系树脂、磷系耐燃剂和低介电聚酰亚胺树脂，使其具有较低的吸水率(0.05-0.2％)，吸水后性能稳定，具有较佳的电气性能，可减少讯号传输插入损耗；
三、本发明的低介电胶层由于具有极低的并且在高温湿度环境下稳定的Dk/Df值，使得本发明适合低温(低于190℃)固化，工艺加工性强，而且对制作设备要求低，进而降低生产成本；
四、本发明具有较低的反弹力，适合下游高密度组装制程；
五、本发明有色油墨层和低介电胶层两者的厚度之和最低可达5-7μm，目前FPC细线化线路的设计需求。
附图说明
图1是本发明单层有色油墨层的结构示意图；
图2是本发明双层有色油墨层的结构示意图；
附图中各部分标记如下：
100-上离型层；
200-有色油墨层；
201-第一有色油墨层，202-第二有色油墨层；
300-低介电胶层；
400-下离型层。
具体实施方式
下面结合附图对本发明的较佳实施例进行详细阐述，以使本发明的优点和特征能更易于被本领域技术人员理解，从而对本发明的保护范围做出更为清楚明确的界定。
实施例：一种高频有色超薄覆盖膜，如图1所示，包括上离型层100、有色油墨层200、低介电胶层300和下离型层400，所述有色油墨层200位于所述上离型层100和所述低介电胶层300之间，所述低介电胶层300位于所述有色油墨层200和所述下离型层400之间；
所述有色油墨层200和所述低介电胶层300两者的厚度之和为4-35μm，其中，所述有色油墨层200的厚度为1-10μm，所述低介电胶层300的厚度为3-25μm。
所述低介电胶层300是Dk值为2.4-2.8(10GHz)、Df值为0.002-0.006(10GHz)、吸水率介于0.05-0.2％、线间绝缘阻抗大于1011Ω、表面电阻大于1012Ω且体积电阻大于1013Ω·cm的胶层。
所述低介电胶层300的树脂材料为氟系树脂、环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和低介电聚酰亚胺树脂中的至少一种。
所述极低介电胶层300包括烧结二氧化硅、铁氟龙、氟系树脂、磷系耐燃剂和低介电聚酰亚胺树脂，且所述烧结二氧化硅、所述铁氟龙、所述氟系树脂和所述磷系耐燃剂的比例之和为总固含量的8-50％(重量百分比)，所述低介电聚酰亚胺系树脂含量的比例为40％-90％(重量百分比)。
所述有色油墨层200的树脂材料为环氧树脂、丙烯酸系树脂、氨基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和聚酰亚胺树脂中的至少一种。
所述上离型层100和所述下离型400层皆为聚丙烯、双向拉伸聚丙烯和聚对苯二甲酸乙二醇酯中的至少一种构成的离型膜或离型纸。
所述烧结二氧化硅的比例为总固含量的2-15％(重量百分比)，所述铁氟龙的比例为总固含量的2-10％(重量百分比)，所述氟系树脂的比例为总固含量的2-10％(重量百分比)，所述磷系耐燃剂的比例为总固含量的2-15％(重量百分比)。
所述有色油墨层200包括无机颜料或有机颜料，其中，所述无机颜料为镉红、镉柠檬黄、橘镉黄、二氧化钛、碳黑、黑色氧化铁或黑色错合无机颜料，所述有机颜料为苯胺黑、苝黑、蒽醌黑、联苯胺类黄色颜料、酞青蓝或酞青绿。
有色油墨层为红色油墨层、黄色油墨层、黑色油墨层、白色油墨层、蓝色油墨层或绿色油墨层。
若要有色油墨层的表面为雾面，可将硫酸钙、二氧化硅、二氧化钛、硫化锌、氧化锆、碳酸钙及黏土等任意组合搭配添加入油墨层中，达到消光目的，使得油墨层呈现雾面状态。
所述有色油墨层200的厚度为3-5μm，所述低介电胶层300的厚度为3-10μm。本发明对于上离型层及下离型层的厚度并无特殊限制。
所述的一种高频有色超薄覆盖膜的制备方法，包括下述步骤：
步骤一、在上离型层的下表面涂布有色油墨原料，50～180℃低温下固化形成有色油墨层；
步骤二、用涂布法或转印法将低介电胶层形成于有色油墨层的下表面；
步骤三、将下离型层贴覆于低介电胶层的下表面，即得成品。
如图2所示，作为本发明的变形，本发明的高频有色超薄覆盖膜，可以依次包括上离型层100、第一有色油墨层201、第二有色油墨层202、低介电胶层300和下离型层400，即有色油墨层具有两层或甚至更多层。所述第一有色油墨层201和所述第二有色油墨层202的厚度皆为2-3μm。第一有色油墨层和第二有色油墨层的双层叠构，有利于解决涂布制程中存在的微孔问题。
实施例1-实施例4为本发明低介电胶层中烧结二氧化硅、铁氟龙、氟系树脂、磷系耐燃剂和低介电聚酰亚胺系树脂的具体重量百分比，如表1所示：
表1
烧结二氧化硅(％) 铁氟龙(％) 氟系树脂(％) 磷系耐燃剂(％) 低介电聚酰亚胺系树脂(％)
实施例1 10 7 5 2 76
实施例2 15 2 10 15 58
实施例3 2 5 8 10 75
实施例4 6 10 2 5 77
下表2为实施例1-实施例4的低介电胶层、有色油墨层的具体叠构展示，且与现有FPC板进行基本性能比较，结果如下：
表2
由表2可知，本发明的高频有色超薄覆盖膜具有较高的热传导系数、较低的热传导效率、较低的耐击穿电压和较低的Dk/Df值。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

1.一种高频有色超薄覆盖膜，其特征在于：包括上离型层、有色油墨层、低介电胶层和下离型层，所述有色油墨层位于所述上离型层和所述低介电胶层之间，所述低介电胶层位于所述有色油墨层和所述下离型层之间；
所述有色油墨层和所述低介电胶层两者的厚度之和为4-35μm，其中，所述有色油墨层的厚度为1-10μm，所述低介电胶层的厚度为3-25μm。
2.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述低介电胶层是Dk值为2.4-2.8(10GHz)、Df值为0.002-0.006(10GHz)、吸水率介于0.05-0.2％、线间绝缘阻抗大于1011Ω、表面电阻大于1012Ω且体积电阻大于1013Ω·cm的胶层。
3.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述低介电胶层的树脂材料为氟系树脂、环氧树脂、丙烯酸系树脂、胺基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和低介电聚酰亚胺树脂中的至少一种。
4.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述极低介电胶层包括烧结二氧化硅、铁氟龙、氟系树脂、磷系耐燃剂和低介电聚酰亚胺树脂，且所述烧结二氧化硅、所述铁氟龙、所述氟系树脂和所述磷系耐燃剂的比例之和为总固含量的8-50％(重量百分比)，所述低介电聚酰亚胺系树脂含量的比例为40％-90％(重量百分比)。
5.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述有色油墨层的树脂材料为环氧树脂、丙烯酸系树脂、氨基甲酸酯系树脂、硅橡胶系树脂、聚对环二甲苯系树脂、双马来酰亚胺系树脂和聚酰亚胺树脂中的至少一种。
6.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述上离型层和所述下离型层皆为聚丙烯、双向拉伸聚丙烯和聚对苯二甲酸乙二醇酯中的至少一种构成的离型膜或离型纸。
7.根据权利要求4所述的一种高频有色超薄覆盖膜，其特征在于：所述烧结二氧化硅的比例为总固含量的2-15％(重量百分比)，所述铁氟龙的比例为总固含量的2-10％(重量百分比)，所述氟系树脂的比例为总固含量的2-10％(重量百分比)，所述磷系耐燃剂的比例为总固含量的2-15％(重量百分比)。
8.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述有色油墨层包括无机颜料或有机颜料，其中，所述无机颜料为镉红、镉柠檬黄、橘镉黄、二氧化钛、碳黑、黑色氧化铁或黑色错合无机颜料，所述有机颜料为苯胺黑、苝黑、蒽醌黑、联苯胺类黄色颜料、酞青蓝或酞青绿。
9.根据权利要求1所述的一种高频有色超薄覆盖膜，其特征在于：所述有色油墨层的厚度为3-5μm，所述低介电胶层的厚度为3-10μm。
10.根据权利要求1所述的一种高频有色超薄覆盖膜的制备方法，其特征在于：包括下述步骤：
步骤一、在上离型层的下表面涂布有色油墨原料，50～180℃低温下固化形成有色油墨层；
步骤二、用涂布法或转印法将低介电胶层形成于有色油墨层的下表面；
步骤三、将下离型层贴覆于低介电胶层的下表面，即得成品。
CN201710102125.9A 2017-02-24 2017-02-24 一种高频有色超薄覆盖膜及制备方法 Pending CN108504294A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201710102125.9A CN108504294A (zh) 2017-02-24 2017-02-24 一种高频有色超薄覆盖膜及制备方法
TW106130143A TWI671204B (zh) 2017-02-24 2017-09-04 有色薄型化覆蓋膜及其製法
US15/841,448 US11116074B2 (en) 2017-02-24 2017-12-14 Colored thin covering film and manufacturing method
KR1020170177473A KR102079309B1 (ko) 2017-02-24 2017-12-21 유색 초박 커버링 필름 및 이의 제조 방법
JP2018030579A JP2018140628A (ja) 2017-02-24 2018-02-23 カラー薄型カバーレイフィルムおよびその製造方法
JP2020008223A JP7179789B2 (ja) 2017-02-24 2020-01-22 カラー薄型カバーレイフィルムおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710102125.9A CN108504294A (zh) 2017-02-24 2017-02-24 一种高频有色超薄覆盖膜及制备方法

Publications (1)

Publication Number Publication Date
CN108504294A true CN108504294A (zh) 2018-09-07

Family

ID=63246642

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710102125.9A Pending CN108504294A (zh) 2017-02-24 2017-02-24 一种高频有色超薄覆盖膜及制备方法

Country Status (5)

Country Link
US (1) US11116074B2 (zh)
JP (2) JP2018140628A (zh)
KR (1) KR102079309B1 (zh)
CN (1) CN108504294A (zh)
TW (1) TWI671204B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113923854A (zh) * 2021-10-28 2022-01-11 京东方科技集团股份有限公司 柔性线路板和显示装置
CN114466506A (zh) * 2022-01-13 2022-05-10 江西科昂电子新材料有限公司 一种高导热低介电高频覆盖膜及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106455304A (zh) * 2016-11-16 2017-02-22 苏州市华扬电子股份有限公司 一种软硬结合板
CN109699140A (zh) * 2019-03-01 2019-04-30 西安易朴通讯技术有限公司 温感可变面板和电子设备的外壳

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003193000A (ja) * 2001-12-26 2003-07-09 Fujikura Ltd カバーレイフィルム、その製造方法及びフレキシブル基板
CN103945635A (zh) * 2013-01-23 2014-07-23 昆山雅森电子材料科技有限公司 超薄油墨保护膜及其制造方法
CN104341593A (zh) * 2013-07-31 2015-02-11 中山大学 具有低介电特性的聚酰亚胺及其制备方法和应用
CN105295753A (zh) * 2014-07-22 2016-02-03 昆山雅森电子材料科技有限公司 高频黏着胶水层叠结构及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379799B1 (en) * 2000-06-29 2002-04-30 Cytec Technology Corp. Low moisture absorption epoxy resin systems with alkylated diamine hardeners
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
JP4364508B2 (ja) 2002-12-27 2009-11-18 リンテック株式会社 チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法
JP2005281673A (ja) * 2004-03-02 2005-10-13 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび製品
WO2007059152A1 (en) * 2005-11-14 2007-05-24 World Properties, Inc. Circuit material, multi-layer circuits, and methods of manufacture thereof
WO2012091000A1 (ja) * 2010-12-27 2012-07-05 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物
CN104081884B (zh) * 2012-01-25 2017-12-19 株式会社钟化 新颖的含颜料绝缘膜用树脂组合物及其利用
CN105144854B (zh) 2013-04-24 2019-02-05 太阳油墨制造株式会社 层叠树脂结构体、干膜、及柔性印刷电路板
CN103483586B (zh) * 2013-09-25 2016-04-06 广东生益科技股份有限公司 改性聚酰亚胺树脂、含该改性聚酰亚胺树脂的胶黏剂组合物及含该胶黏剂组合物的覆盖膜
JP6547300B2 (ja) * 2015-01-13 2019-07-24 セイコーエプソン株式会社 運動解析装置、運動解析方法、プログラム、及び運動解析システム
KR101683821B1 (ko) * 2015-03-16 2016-12-08 (주)알킨스 무기재 타입의 커버레이 테이프 및 그 제조방법
JP6488170B2 (ja) 2015-03-31 2019-03-20 日鉄ケミカル＆マテリアル株式会社 回路基板
JP6074698B1 (ja) 2015-07-31 2017-02-08 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
CN205112572U (zh) * 2015-10-19 2016-03-30 昆山雅森电子材料科技有限公司 高频有色覆盖膜
US20170273179A1 (en) * 2016-03-21 2017-09-21 Ticona Llc Laminate for a Printed Circuit Board
CN207014920U (zh) * 2017-02-24 2018-02-16 昆山雅森电子材料科技有限公司 一种高频有色超薄覆盖膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003193000A (ja) * 2001-12-26 2003-07-09 Fujikura Ltd カバーレイフィルム、その製造方法及びフレキシブル基板
CN103945635A (zh) * 2013-01-23 2014-07-23 昆山雅森电子材料科技有限公司 超薄油墨保护膜及其制造方法
CN104341593A (zh) * 2013-07-31 2015-02-11 中山大学 具有低介电特性的聚酰亚胺及其制备方法和应用
CN105295753A (zh) * 2014-07-22 2016-02-03 昆山雅森电子材料科技有限公司 高频黏着胶水层叠结构及其制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113923854A (zh) * 2021-10-28 2022-01-11 京东方科技集团股份有限公司 柔性线路板和显示装置
CN113923854B (zh) * 2021-10-28 2023-10-27 京东方科技集团股份有限公司 柔性线路板和显示装置
CN114466506A (zh) * 2022-01-13 2022-05-10 江西科昂电子新材料有限公司 一种高导热低介电高频覆盖膜及其制备方法

Also Published As

Publication number Publication date
TW201831318A (zh) 2018-09-01
US11116074B2 (en) 2021-09-07
JP7179789B2 (ja) 2022-11-29
KR20180098123A (ko) 2018-09-03
JP2020078936A (ja) 2020-05-28
US20180249572A1 (en) 2018-08-30
JP2018140628A (ja) 2018-09-13
KR102079309B1 (ko) 2020-02-19
TWI671204B (zh) 2019-09-11

Similar Documents

Publication Publication Date Title
CN108504294A (zh) 一种高频有色超薄覆盖膜及制备方法
US10609815B2 (en) Colored ultrathin high frequency cover film with high haze and preparation method thereof
TWI765306B (zh) 具有高電磁屏蔽性能的軟性印刷電路板及其製備方法
WO2017155317A1 (ko) 폴리이미드 절연층을 포함하는 면상 발열체의 제조방법
CN112203416A (zh) 线路板及其制作方法
CN106793526A (zh) 耐热抗燃覆铜板制作工艺
CN104602448B (zh) 可挠式电路板及其制作方法
CN205112572U (zh) 高频有色覆盖膜
CN101772270B (zh) 一种挠性印制线路板图形转移的预处理方法
TWM616306U (zh) 一種線路板材料層結構
CN104349592B (zh) 多层电路板及其制作方法
CN207014920U (zh) 一种高频有色超薄覆盖膜
CN105295753B (zh) 高频黏着胶水层叠结构及其制备方法
CN207327759U (zh) 一种双面覆铜箔层压板
TWI671339B (zh) 高遮蔽性有色超薄覆蓋膜及製備方法
CN206471205U (zh) 一种可调节平面变压器
CN104466336A (zh) 用于4g移动通信的宽带定向耦合器
CN202307379U (zh) 用于电机、变压器的绝缘复合膜
CN202115022U (zh) 一种复合介质覆铜箔板
CN205755032U (zh) 一种pcb板
CN104752044B (zh) 一种防爆隔离变压器
CN109451658A (zh) 一种柔性电路板及制备方法
CN207489660U (zh) 平面变压器
CN208667577U (zh) 具有高Dk和低Df特性的高频高速粘结片
CN212907371U (zh) 一种微型隔离变压器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180907