TWI626323B - 電子材料用銅合金 - Google Patents

電子材料用銅合金 Download PDF

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Publication number
TWI626323B
TWI626323B TW106111225A TW106111225A TWI626323B TW I626323 B TWI626323 B TW I626323B TW 106111225 A TW106111225 A TW 106111225A TW 106111225 A TW106111225 A TW 106111225A TW I626323 B TWI626323 B TW I626323B
Authority
TW
Taiwan
Prior art keywords
mass
electronic materials
ray diffraction
less
copper alloy
Prior art date
Application number
TW106111225A
Other languages
English (en)
Chinese (zh)
Other versions
TW201736615A (zh
Inventor
Akihiro Kakitani
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201736615A publication Critical patent/TW201736615A/zh
Application granted granted Critical
Publication of TWI626323B publication Critical patent/TWI626323B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
TW106111225A 2016-03-31 2017-03-31 電子材料用銅合金 TWI626323B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016073377A JP6306632B2 (ja) 2016-03-31 2016-03-31 電子材料用銅合金

Publications (2)

Publication Number Publication Date
TW201736615A TW201736615A (zh) 2017-10-16
TWI626323B true TWI626323B (zh) 2018-06-11

Family

ID=60003803

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106111225A TWI626323B (zh) 2016-03-31 2017-03-31 電子材料用銅合金

Country Status (4)

Country Link
JP (1) JP6306632B2 (ko)
KR (1) KR101866129B1 (ko)
CN (2) CN110273083A (ko)
TW (1) TWI626323B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306632B2 (ja) * 2016-03-31 2018-04-04 Ｊｘ金属株式会社 電子材料用銅合金
JP6542817B2 (ja) * 2016-10-12 2019-07-10 Ｊｘ金属株式会社 電子材料用銅合金
JP2019054854A (ja) * 2017-09-19 2019-04-11 株式会社三共 遊技機
JP2019054853A (ja) * 2017-09-19 2019-04-11 株式会社三共 遊技機
JP6887399B2 (ja) * 2018-03-30 2021-06-16 Ｊｘ金属株式会社 銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
JP6671434B2 (ja) * 2018-08-22 2020-03-25 Ｊｘ金属株式会社 電子材料用銅合金
CN110252972B (zh) * 2019-07-06 2021-11-30 湖北精益高精铜板带有限公司 高强高导微合金铜箔及其加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471428B (zh) * 2012-10-22 2015-02-01 Jx Nippon Mining & Metals Corp Conductive and stress relief characteristics of excellent copper alloy plate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3800279B2 (ja) * 1998-08-31 2006-07-26 株式会社神戸製鋼所 プレス打抜き性が優れた銅合金板
JP4729680B2 (ja) * 2000-12-18 2011-07-20 Ｄｏｗａメタルテック株式会社 プレス打ち抜き性に優れた銅基合金
JP5028657B2 (ja) * 2006-07-10 2012-09-19 Ｄｏｗａメタルテック株式会社 異方性の少ない高強度銅合金板材およびその製造法
JP4981748B2 (ja) * 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
US8287669B2 (en) * 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
JP5208555B2 (ja) * 2008-03-31 2013-06-12 Ｊｘ日鉱日石金属株式会社 電子部品用チタン銅
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4620173B1 (ja) * 2010-03-30 2011-01-26 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金材
JP4708497B1 (ja) 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
JP4601085B1 (ja) * 2010-06-03 2010-12-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
JP5325178B2 (ja) * 2010-08-12 2013-10-23 Ｊｘ日鉱日石金属株式会社 強度、導電率及び曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP2012072470A (ja) * 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4799701B1 (ja) * 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP5539932B2 (ja) 2011-08-01 2014-07-02 Ｊｘ日鉱日石金属株式会社 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP5565506B1 (ja) * 2013-07-03 2014-08-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品及び端子
JP6306632B2 (ja) * 2016-03-31 2018-04-04 Ｊｘ金属株式会社 電子材料用銅合金

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471428B (zh) * 2012-10-22 2015-02-01 Jx Nippon Mining & Metals Corp Conductive and stress relief characteristics of excellent copper alloy plate

Also Published As

Publication number Publication date
KR20170113407A (ko) 2017-10-12
CN107267804A (zh) 2017-10-20
CN110273083A (zh) 2019-09-24
CN107267804B (zh) 2022-02-22
KR101866129B1 (ko) 2018-06-08
JP6306632B2 (ja) 2018-04-04
JP2017179569A (ja) 2017-10-05
TW201736615A (zh) 2017-10-16

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