TWI626118B - 供ｃｍｐ使用之多層拋光墊、生產多層拋光墊之方法、化學機械拋光裝置、及拋光工件之方法 - Google Patents

供ｃｍｐ使用之多層拋光墊、生產多層拋光墊之方法、化學機械拋光裝置、及拋光工件之方法 Download PDF

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Publication number
TWI626118B
TWI626118B TW104113878A TW104113878A TWI626118B TW I626118 B TWI626118 B TW I626118B TW 104113878 A TW104113878 A TW 104113878A TW 104113878 A TW104113878 A TW 104113878A TW I626118 B TWI626118 B TW I626118B
Authority
TW
Taiwan
Prior art keywords
polishing pad
layer
polishing
multilayer
workpiece
Prior art date
Application number
TW104113878A
Other languages
English (en)
Chinese (zh)
Other versions
TW201542317A (zh
Inventor
Garrett BLAKE
賈列特 布雷克
Brian MRZYGLOD
布萊恩 莫依葛羅德
Jayakrishnan NAIR
加亞克里許南 奈爾
Original Assignee
Cabot Microelectronics Corporation
卡博特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corporation, 卡博特微電子公司 filed Critical Cabot Microelectronics Corporation
Publication of TW201542317A publication Critical patent/TW201542317A/zh
Application granted granted Critical
Publication of TWI626118B publication Critical patent/TWI626118B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW104113878A 2014-05-07 2015-04-30 供ｃｍｐ使用之多層拋光墊、生產多層拋光墊之方法、化學機械拋光裝置、及拋光工件之方法 TWI626118B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201461989669P 2014-05-07 2014-05-07
US61/989,669 2014-05-07
US201462022770P 2014-07-10 2014-07-10
US62/022,770 2014-07-10

Publications (2)

Publication Number Publication Date
TW201542317A TW201542317A (zh) 2015-11-16
TWI626118B true TWI626118B (zh) 2018-06-11

Family

ID=54368476

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113878A TWI626118B (zh) 2014-05-07 2015-04-30 供ｃｍｐ使用之多層拋光墊、生產多層拋光墊之方法、化學機械拋光裝置、及拋光工件之方法

Country Status (7)

Country Link
US (1) US9818618B2 (https=)
EP (1) EP3140852B1 (https=)
JP (1) JP6574244B2 (https=)
KR (1) KR102440303B1 (https=)
CN (1) CN106575613B (https=)
TW (1) TWI626118B (https=)
WO (1) WO2015171419A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
CN112238670B (zh) * 2020-10-16 2022-11-15 上海江丰平芯电子科技有限公司 一种研磨垫的制备方法
EP4267342A4 (en) * 2020-12-22 2024-10-30 CMC Materials LLC Chemical-mechanical polishing subpad having porogens with polymeric shells

Citations (3)

* Cited by examiner, † Cited by third party
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TW200513348A (en) * 2003-06-17 2005-04-16 Cabot Microelectronics Corp Multi-layer polishing pad material for CMP
TW200909137A (en) * 2007-05-03 2009-03-01 Cabot Microelectronics Corp Stacked polishing pad for high temperature applications
US20100184357A1 (en) * 2009-01-16 2010-07-22 Applied Materials, Inc. Polishing Pad and System with Window Support

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US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (ja) 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
JP2002303727A (ja) * 2001-04-06 2002-10-18 Nitto Denko Corp 偏光フィルムの製造方法
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20070015448A1 (en) * 2003-08-07 2007-01-18 Ppg Industries Ohio, Inc. Polishing pad having edge surface treatment
WO2005035194A2 (en) * 2003-10-09 2005-04-21 Thomas West, Inc. Stacked pad and method of use
EP2136994B1 (en) * 2007-04-03 2018-08-22 Dow Global Technologies LLC Hot film lamination (vacuum assisted) for carpet backing applications
US20110045753A1 (en) * 2008-05-16 2011-02-24 Toray Industries, Inc. Polishing pad
US20130102231A1 (en) * 2009-12-30 2013-04-25 3M Innovative Properties Company Organic particulate loaded polishing pads and method of making and using the same
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
US9067297B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
JP5893413B2 (ja) * 2012-01-17 2016-03-23 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200513348A (en) * 2003-06-17 2005-04-16 Cabot Microelectronics Corp Multi-layer polishing pad material for CMP
TW200909137A (en) * 2007-05-03 2009-03-01 Cabot Microelectronics Corp Stacked polishing pad for high temperature applications
US20100184357A1 (en) * 2009-01-16 2010-07-22 Applied Materials, Inc. Polishing Pad and System with Window Support

Also Published As

Publication number Publication date
JP2017514718A (ja) 2017-06-08
KR20170015907A (ko) 2017-02-10
EP3140852A4 (en) 2018-01-10
EP3140852A1 (en) 2017-03-15
US20150325451A1 (en) 2015-11-12
CN106575613B (zh) 2019-12-17
CN106575613A (zh) 2017-04-19
KR102440303B1 (ko) 2022-09-05
US9818618B2 (en) 2017-11-14
EP3140852B1 (en) 2021-07-28
WO2015171419A1 (en) 2015-11-12
JP6574244B2 (ja) 2019-09-11
TW201542317A (zh) 2015-11-16

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