TWI623587B - 用於密封光學元件的樹脂組成物 - Google Patents

用於密封光學元件的樹脂組成物 Download PDF

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Publication number
TWI623587B
TWI623587B TW103106840A TW103106840A TWI623587B TW I623587 B TWI623587 B TW I623587B TW 103106840 A TW103106840 A TW 103106840A TW 103106840 A TW103106840 A TW 103106840A TW I623587 B TWI623587 B TW I623587B
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TW
Taiwan
Prior art keywords
sealing
optical element
chemical formula
resin composition
independently
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TW103106840A
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English (en)
Chinese (zh)
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TW201443156A (zh
Inventor
Han Bok Joo
朱漢福
Sun Sik Song
宋善植
Hyeok Yong Kwon
權赫勇
Eun Ju Park
朴恩珠
Jae Hyun Kim
金宰賢
Young Je Kwark
郭英植
Hee Chun Eun
恩熙春
Hee Eun IM
林熙恩
Original Assignee
Dongjin Semichem Co., Ltd.
東進世美肯有限公司
Soongsil University Research Consortium Techno-Park
崇實大學校產學協力團
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Application filed by Dongjin Semichem Co., Ltd., 東進世美肯有限公司, Soongsil University Research Consortium Techno-Park, 崇實大學校產學協力團 filed Critical Dongjin Semichem Co., Ltd.
Publication of TW201443156A publication Critical patent/TW201443156A/zh
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Publication of TWI623587B publication Critical patent/TWI623587B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
TW103106840A 2013-02-28 2014-02-27 用於密封光學元件的樹脂組成物 TWI623587B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0021845 2013-02-28
KR1020130021845A KR102016348B1 (ko) 2013-02-28 2013-02-28 광학소자 봉지용 수지 조성물

Publications (2)

Publication Number Publication Date
TW201443156A TW201443156A (zh) 2014-11-16
TWI623587B true TWI623587B (zh) 2018-05-11

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TW103106840A TWI623587B (zh) 2013-02-28 2014-02-27 用於密封光學元件的樹脂組成物

Country Status (6)

Country Link
US (1) US9593241B2 (enExample)
JP (1) JP6325006B2 (enExample)
KR (1) KR102016348B1 (enExample)
CN (1) CN105008461B (enExample)
TW (1) TWI623587B (enExample)
WO (1) WO2014133287A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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CN105392825A (zh) * 2013-07-19 2016-03-09 Az电子材料卢森堡有限公司 用于发光二极管的封装材料
CN104993067A (zh) * 2015-07-13 2015-10-21 深圳市华星光电技术有限公司 有机发光二极管封装件、其制造方法及显示装置
KR102176229B1 (ko) 2016-12-09 2020-11-10 주식회사 엘지화학 밀봉재 조성물
JP7064585B2 (ja) * 2017-10-31 2022-05-10 ダウ グローバル テクノロジーズ エルエルシー 太陽光発電封止材フィルムのためのポリオレフィン組成物
KR102013860B1 (ko) * 2017-11-24 2019-08-23 한국생산기술연구원 불소그룹이 도입된 불소 폴리실라잔 소재 및 이의 제조방법
CN109705802A (zh) * 2018-12-30 2019-05-03 苏州桐力光电股份有限公司 一种液晶显示屏全贴合用高折光率硅胶
KR102784211B1 (ko) * 2018-12-31 2025-03-21 주식회사 동진쎄미켐 합성 수지 코팅 조성물 및 이를 이용한 합성 수지 기재 제조 방법
NO348381B1 (en) * 2020-07-02 2024-12-23 Nanize As Polysilazane coating method and device
CN112420893B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法
NO347925B1 (en) 2021-07-07 2024-05-13 Nanize As Polysilazane compositions

Citations (3)

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US20060175684A1 (en) * 2004-12-28 2006-08-10 Hisao Oikawa Organosilicon compound
WO2008141201A1 (en) * 2007-05-10 2008-11-20 Fish Christopher N Composite materials
WO2013019752A1 (en) * 2011-07-29 2013-02-07 Sun Color Corporation Dispersions and related coatings and cured articles

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US5412053A (en) 1993-08-12 1995-05-02 The University Of Dayton Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation
US7915369B2 (en) * 2004-12-07 2011-03-29 Panasonic Electric Works Co., Ltd. Ultraviolet transmissive polyhedral silsesquioxane polymers
JP2007045971A (ja) * 2005-08-11 2007-02-22 Asahi Kasei Corp 封止材用組成物及び光学デバイス
WO2009084562A1 (ja) * 2007-12-27 2009-07-09 Nippon Steel Chemical Co., Ltd. 籠構造含有硬化性シリコーン共重合体及びその製造方法並びに籠構造含有硬化性シリコーン共重合体を用いた硬化性樹脂組成物及びその硬化物
KR20090107882A (ko) * 2008-04-10 2009-10-14 삼성전자주식회사 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법
KR20110012581A (ko) * 2009-07-31 2011-02-09 (주)디엔에프 수소 실세스퀴옥산을 포함하는 폴리실라잔 코팅 조성물
KR20110030014A (ko) * 2009-09-17 2011-03-23 주식회사 동진쎄미켐 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드
KR101836962B1 (ko) * 2010-05-18 2018-03-09 제이엔씨 주식회사 신규 유기 규소 화합물, 상기 유기 규소 화합물을 포함하는 열경화성 수지 조성물, 경화 수지 및 광 반도체용 봉지 재료
TWI483995B (zh) * 2010-08-18 2015-05-11 第一毛織股份有限公司 聚有機矽氧烷與由該聚有機矽氧烷獲得之封裝材料以及包含該封裝材料之電子元件

Patent Citations (3)

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US20060175684A1 (en) * 2004-12-28 2006-08-10 Hisao Oikawa Organosilicon compound
WO2008141201A1 (en) * 2007-05-10 2008-11-20 Fish Christopher N Composite materials
WO2013019752A1 (en) * 2011-07-29 2013-02-07 Sun Color Corporation Dispersions and related coatings and cured articles

Also Published As

Publication number Publication date
TW201443156A (zh) 2014-11-16
US20150376407A1 (en) 2015-12-31
US9593241B2 (en) 2017-03-14
CN105008461B (zh) 2019-07-05
CN105008461A (zh) 2015-10-28
KR20140107815A (ko) 2014-09-05
KR102016348B1 (ko) 2019-08-30
WO2014133287A1 (ko) 2014-09-04
JP2016514179A (ja) 2016-05-19
JP6325006B2 (ja) 2018-05-16

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