JP6325006B2 - 光学素子封止用樹脂組成物 - Google Patents

光学素子封止用樹脂組成物 Download PDF

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Publication number
JP6325006B2
JP6325006B2 JP2015560090A JP2015560090A JP6325006B2 JP 6325006 B2 JP6325006 B2 JP 6325006B2 JP 2015560090 A JP2015560090 A JP 2015560090A JP 2015560090 A JP2015560090 A JP 2015560090A JP 6325006 B2 JP6325006 B2 JP 6325006B2
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chemical formula
optical element
formula
sealing
carbons
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Japanese (ja)
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JP2016514179A (ja
JP2016514179A5 (enExample
Inventor
ハン ポク チョ
ハン ポク チョ
スン シク ソン
スン シク ソン
ヒョク ヨン コン
ヒョク ヨン コン
ウン チュ パク
ウン チュ パク
チャエ ヒュン キム
チャエ ヒュン キム
ヨン チェ クァーク
ヨン チェ クァーク
ヒ チュン ウン
ヒ チュン ウン
ヒ ウン イム
ヒ ウン イム
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Dongjin Semichem Co Ltd
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Dongjin Semichem Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
JP2015560090A 2013-02-28 2014-02-24 光学素子封止用樹脂組成物 Active JP6325006B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130021845A KR102016348B1 (ko) 2013-02-28 2013-02-28 광학소자 봉지용 수지 조성물
KR10-2013-0021845 2013-02-28
PCT/KR2014/001458 WO2014133287A1 (ko) 2013-02-28 2014-02-24 광학소자 봉지용 수지 조성물

Publications (3)

Publication Number Publication Date
JP2016514179A JP2016514179A (ja) 2016-05-19
JP2016514179A5 JP2016514179A5 (enExample) 2017-03-30
JP6325006B2 true JP6325006B2 (ja) 2018-05-16

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ID=51428500

Family Applications (1)

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JP2015560090A Active JP6325006B2 (ja) 2013-02-28 2014-02-24 光学素子封止用樹脂組成物

Country Status (6)

Country Link
US (1) US9593241B2 (enExample)
JP (1) JP6325006B2 (enExample)
KR (1) KR102016348B1 (enExample)
CN (1) CN105008461B (enExample)
TW (1) TWI623587B (enExample)
WO (1) WO2014133287A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105392825A (zh) * 2013-07-19 2016-03-09 Az电子材料卢森堡有限公司 用于发光二极管的封装材料
CN104993067A (zh) * 2015-07-13 2015-10-21 深圳市华星光电技术有限公司 有机发光二极管封装件、其制造方法及显示装置
CN114621634B (zh) 2016-12-09 2023-07-14 株式会社Lg化学 封装组合物、包括该组合物的有机电子器件及其制造方法
CN111263981B (zh) * 2017-10-31 2024-06-25 陶氏环球技术有限责任公司 用于光伏封装膜的聚烯烃组成物
KR102013860B1 (ko) * 2017-11-24 2019-08-23 한국생산기술연구원 불소그룹이 도입된 불소 폴리실라잔 소재 및 이의 제조방법
CN109705802A (zh) * 2018-12-30 2019-05-03 苏州桐力光电股份有限公司 一种液晶显示屏全贴合用高折光率硅胶
KR102784211B1 (ko) * 2018-12-31 2025-03-21 주식회사 동진쎄미켐 합성 수지 코팅 조성물 및 이를 이용한 합성 수지 기재 제조 방법
NO348381B1 (en) * 2020-07-02 2024-12-23 Nanize As Polysilazane coating method and device
CN112420893B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法
NO347925B1 (en) * 2021-07-07 2024-05-13 Nanize As Polysilazane compositions

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412053A (en) 1993-08-12 1995-05-02 The University Of Dayton Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation
US7915369B2 (en) * 2004-12-07 2011-03-29 Panasonic Electric Works Co., Ltd. Ultraviolet transmissive polyhedral silsesquioxane polymers
EP1686133B1 (en) * 2004-12-28 2008-08-20 Chisso Corporation Organosilicon compound
JP2007045971A (ja) * 2005-08-11 2007-02-22 Asahi Kasei Corp 封止材用組成物及び光学デバイス
WO2008141201A1 (en) * 2007-05-10 2008-11-20 Fish Christopher N Composite materials
US8299185B2 (en) * 2007-12-27 2012-10-30 Nippon Steel Chemical Co., Ltd. Curable cage-type silicone copolymer and process for production thereof and curable resin composition comprising curable cage-type silicone copolymer and cured product thereof
KR20090107882A (ko) * 2008-04-10 2009-10-14 삼성전자주식회사 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법
KR20110012581A (ko) * 2009-07-31 2011-02-09 (주)디엔에프 수소 실세스퀴옥산을 포함하는 폴리실라잔 코팅 조성물
KR20110030014A (ko) * 2009-09-17 2011-03-23 주식회사 동진쎄미켐 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드
EP2573129B1 (en) * 2010-05-18 2016-08-17 JNC Corporation Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound
TWI483995B (zh) * 2010-08-18 2015-05-11 第一毛織股份有限公司 聚有機矽氧烷與由該聚有機矽氧烷獲得之封裝材料以及包含該封裝材料之電子元件
US20140243452A1 (en) * 2011-07-29 2014-08-28 David A. Smetana Dispersions and related coatings and cured articles

Also Published As

Publication number Publication date
TWI623587B (zh) 2018-05-11
JP2016514179A (ja) 2016-05-19
CN105008461B (zh) 2019-07-05
WO2014133287A1 (ko) 2014-09-04
US9593241B2 (en) 2017-03-14
KR102016348B1 (ko) 2019-08-30
KR20140107815A (ko) 2014-09-05
CN105008461A (zh) 2015-10-28
US20150376407A1 (en) 2015-12-31
TW201443156A (zh) 2014-11-16

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