TWI620474B - Hardened body, method of manufacturing cured body, laminated body, printed wiring board, and semiconductor device - Google Patents

Hardened body, method of manufacturing cured body, laminated body, printed wiring board, and semiconductor device Download PDF

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Publication number
TWI620474B
TWI620474B TW102145127A TW102145127A TWI620474B TW I620474 B TWI620474 B TW I620474B TW 102145127 A TW102145127 A TW 102145127A TW 102145127 A TW102145127 A TW 102145127A TW I620474 B TWI620474 B TW I620474B
Authority
TW
Taiwan
Prior art keywords
resin composition
hardened body
composition layer
layer
resin
Prior art date
Application number
TW102145127A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436661A (zh
Inventor
中村茂雄
奈良橋弘久
Original Assignee
味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 味之素股份有限公司 filed Critical 味之素股份有限公司
Publication of TW201436661A publication Critical patent/TW201436661A/zh
Application granted granted Critical
Publication of TWI620474B publication Critical patent/TWI620474B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102145127A 2012-12-27 2013-12-09 Hardened body, method of manufacturing cured body, laminated body, printed wiring board, and semiconductor device TWI620474B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012284845A JP6225422B2 (ja) 2012-12-27 2012-12-27 硬化体、硬化体の製造方法、積層体、プリント配線板及び半導体装置

Publications (2)

Publication Number Publication Date
TW201436661A TW201436661A (zh) 2014-09-16
TWI620474B true TWI620474B (zh) 2018-04-01

Family

ID=51406895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102145127A TWI620474B (zh) 2012-12-27 2013-12-09 Hardened body, method of manufacturing cured body, laminated body, printed wiring board, and semiconductor device

Country Status (3)

Country Link
JP (1) JP6225422B2 (ja)
KR (1) KR102200637B1 (ja)
TW (1) TWI620474B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109804721B (zh) * 2016-10-12 2022-07-01 住友电工印刷电路株式会社 印刷电路板及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251895A (ja) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd 多層配線板及び多層配線板の製造方法
TW200806738A (en) * 2006-03-30 2008-02-01 Ajinomoto Kk Resin composition for insulating layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244150A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP5011641B2 (ja) * 2004-01-28 2012-08-29 味の素株式会社 熱硬化性樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2008037957A (ja) 2006-08-03 2008-02-21 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板
JP2009212101A (ja) * 2008-02-07 2009-09-17 Namics Corp 多層配線板用の部材、及び、多層配線板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251895A (ja) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd 多層配線板及び多層配線板の製造方法
TW200806738A (en) * 2006-03-30 2008-02-01 Ajinomoto Kk Resin composition for insulating layer

Also Published As

Publication number Publication date
JP6225422B2 (ja) 2017-11-08
KR102200637B1 (ko) 2021-01-12
JP2014127643A (ja) 2014-07-07
TW201436661A (zh) 2014-09-16
KR20140085342A (ko) 2014-07-07

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