KR102200637B1 - 경화체, 경화체의 제조 방법, 적층체, 프린트 배선판 및 반도체 장치 - Google Patents

경화체, 경화체의 제조 방법, 적층체, 프린트 배선판 및 반도체 장치 Download PDF

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Publication number
KR102200637B1
KR102200637B1 KR1020130162831A KR20130162831A KR102200637B1 KR 102200637 B1 KR102200637 B1 KR 102200637B1 KR 1020130162831 A KR1020130162831 A KR 1020130162831A KR 20130162831 A KR20130162831 A KR 20130162831A KR 102200637 B1 KR102200637 B1 KR 102200637B1
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KR
South Korea
Prior art keywords
resin composition
composition layer
circuit board
cured product
layer
Prior art date
Application number
KR1020130162831A
Other languages
English (en)
Korean (ko)
Other versions
KR20140085342A (ko
Inventor
시게오 나카무라
히로히사 나라하시
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20140085342A publication Critical patent/KR20140085342A/ko
Application granted granted Critical
Publication of KR102200637B1 publication Critical patent/KR102200637B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020130162831A 2012-12-27 2013-12-24 경화체, 경화체의 제조 방법, 적층체, 프린트 배선판 및 반도체 장치 KR102200637B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-284845 2012-12-27
JP2012284845A JP6225422B2 (ja) 2012-12-27 2012-12-27 硬化体、硬化体の製造方法、積層体、プリント配線板及び半導体装置

Publications (2)

Publication Number Publication Date
KR20140085342A KR20140085342A (ko) 2014-07-07
KR102200637B1 true KR102200637B1 (ko) 2021-01-12

Family

ID=51406895

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130162831A KR102200637B1 (ko) 2012-12-27 2013-12-24 경화체, 경화체의 제조 방법, 적층체, 프린트 배선판 및 반도체 장치

Country Status (3)

Country Link
JP (1) JP6225422B2 (ja)
KR (1) KR102200637B1 (ja)
TW (1) TWI620474B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109804721B (zh) * 2016-10-12 2022-07-01 住友电工印刷电路株式会社 印刷电路板及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005240019A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 熱硬化性樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2009212101A (ja) * 2008-02-07 2009-09-17 Namics Corp 多層配線板用の部材、及び、多層配線板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244150A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2005251895A (ja) * 2004-03-03 2005-09-15 Hitachi Chem Co Ltd 多層配線板及び多層配線板の製造方法
JP2009155354A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層用樹脂組成物
JP2008037957A (ja) 2006-08-03 2008-02-21 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005240019A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 熱硬化性樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2009212101A (ja) * 2008-02-07 2009-09-17 Namics Corp 多層配線板用の部材、及び、多層配線板の製造方法

Also Published As

Publication number Publication date
JP6225422B2 (ja) 2017-11-08
JP2014127643A (ja) 2014-07-07
TW201436661A (zh) 2014-09-16
TWI620474B (zh) 2018-04-01
KR20140085342A (ko) 2014-07-07

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