TWI620215B - 分數階電容器 - Google Patents

分數階電容器 Download PDF

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Publication number
TWI620215B
TWI620215B TW103109506A TW103109506A TWI620215B TW I620215 B TWI620215 B TW I620215B TW 103109506 A TW103109506 A TW 103109506A TW 103109506 A TW103109506 A TW 103109506A TW I620215 B TWI620215 B TW I620215B
Authority
TW
Taiwan
Prior art keywords
fractional
capacitor
fractional capacitor
layer
electrode layer
Prior art date
Application number
TW103109506A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505052A (zh
Inventor
瑪蒙德Ｎ 艾瑪頓
艾洛 艾許拉法
卡哈雷 薩拉瑪
胡山 艾爾沙瑞福
Original Assignee
沙特基礎工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沙特基礎工業公司 filed Critical 沙特基礎工業公司
Publication of TW201505052A publication Critical patent/TW201505052A/zh
Application granted granted Critical
Publication of TWI620215B publication Critical patent/TWI620215B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/13—Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals
    • H03K5/14—Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals by the use of delay lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW103109506A 2013-03-14 2014-03-14 分數階電容器 TWI620215B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361783373P 2013-03-14 2013-03-14
US61/783,373 2013-03-14

Publications (2)

Publication Number Publication Date
TW201505052A TW201505052A (zh) 2015-02-01
TWI620215B true TWI620215B (zh) 2018-04-01

Family

ID=50346167

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109506A TWI620215B (zh) 2013-03-14 2014-03-14 分數階電容器

Country Status (7)

Country Link
US (1) US9305706B2 (https=)
EP (2) EP3511964A1 (https=)
JP (1) JP6298878B2 (https=)
KR (1) KR20150128743A (https=)
CN (1) CN105190805A (https=)
TW (1) TWI620215B (https=)
WO (1) WO2014158970A1 (https=)

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US20140293513A1 (en) * 2013-03-26 2014-10-02 Custom Electronics, Inc. Graphene-based high voltage electrodes and materials
US10091870B2 (en) * 2015-03-31 2018-10-02 International Business Machines Corporation Methods for tuning propagation velocity with functionalized carbon nanomaterial
CN105790724B (zh) * 2016-04-28 2018-04-13 华南理工大学 一种0到1阶功率级分数阶电容元件的制备方法
CN106411291B (zh) * 2016-07-31 2023-04-07 华南理工大学 一种阶数大于1的大功率可调高频分数阶电容及其控制方法
KR102772047B1 (ko) 2016-12-19 2025-02-25 삼성전기주식회사 아크릴계 바인더 및 적층 전자부품
WO2018193405A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Phase angle tunable fractional-order capacitors including poly (vinylidene fluoride)-based polymers and blends and methods of manufacture thereof
WO2018193403A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Method of modeling a fractional order capacitor design
WO2018193404A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Numerical design of fractional order capacitors
WO2018193402A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Phase angle tunable fractional-order capacitors including multi-layer ferroelectric polymer dielectric and methods of manufacture thereof
FR3066398B1 (fr) * 2017-05-18 2019-07-05 X'sin Prise d'escalade a detection capacitive, procede de realisation et mur associes
KR102001138B1 (ko) * 2017-09-19 2019-07-18 유덕첨단소재(주) 그래핀을 이용한 적층 세라믹 커패시터 및 이의 제조 방법
KR102620515B1 (ko) 2018-04-30 2024-01-03 삼성전기주식회사 적층형 커패시터
CN111537400B (zh) * 2020-05-19 2023-03-31 北京林业大学 一种在线测定水中颗粒物分形维数的方法
CN118638374B (zh) * 2024-07-16 2025-08-26 深圳大学 一种掺杂含氟铁电聚合物、薄膜及其制备方法和应用

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WO2012177555A2 (en) * 2011-06-20 2012-12-27 Yazaki Corporation Cohesive assembly of carbon and its application

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Also Published As

Publication number Publication date
KR20150128743A (ko) 2015-11-18
CN105190805A (zh) 2015-12-23
TW201505052A (zh) 2015-02-01
WO2014158970A1 (en) 2014-10-02
US20140266374A1 (en) 2014-09-18
US9305706B2 (en) 2016-04-05
JP6298878B2 (ja) 2018-03-20
JP2016511550A (ja) 2016-04-14
EP3511964A1 (en) 2019-07-17
EP2973626A1 (en) 2016-01-20

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